Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same

Patent metadata

Field	Value
Publication number	US-9850390-B2
Application number	US-201615188454-A
Country	US
Kind code	B2
Filing date	Jun 21, 2016
Priority date	Jun 23, 2015
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:

First claim

What is claimed is:

1. An epoxy resin composition for encapsulation of a semiconductor device, the composition comprising:
an epoxy resin;
a curing agent;
an inorganic filler;
a curing catalyst; and
a compound containing at least one hydroxyl group,
wherein the curing catalyst includes a phosphonium compound represented by Formula 4:

wherein, in Formula 4,
R 1 , R 2 , R 3 , and R 4 are each independently a substituted or unsubstituted C 1 to C 30 aliphatic hydrocarbon group, a substituted or unsubstituted C 6 to C 30 aromatic hydrocarbon group, or a substituted or unsubstituted C 1 to C 30 hydrocarbon group including a hetero atom;
X is a substituted or unsubstituted C 6 to C 30 arylene group, a substituted or unsubstituted C 3 to C 10 cycloalkylene group. or a substituted or unsubstituted C 1 to C 20 alkylene group, provided that when X is a substituted C 6 to C 30 arylene group, the substituted C 6 to C 30 arylene group includes at most one hydroxyl group bonded thereto;
R 5 is hydrogen, a hydroxyl group, an unsubstituted C 1 to C 20 alkyl group, an unsubstituted C 6 to C 30 aryl group, an unsubstituted C 3 to C 30 heteroaryl group, an unsubstituted C 3 to C 10 cycloalkyl group, an unsubstituted C 3 to C 10 heterocycloalkyl group, an unsubstituted C 7 to C 30 arylalkyl group, or an unsubstituted C 1 to C 30 heteroalkyl group; and
m is an integer of 0 to 5.

2. The epoxy resin composition as claimed in claim 1 , wherein R 1 , R 2 , R 3 , and R 4 are each independently a substituted or unsubstituted C 6 to C 30 aryl group.

3. The epoxy resin composition as claimed in claim 2 , wherein at least one of R 1 , R 2 , R 3 , and R 4 is a hydroxyl group-substituted C 6 to C 30 aryl group.

4. The epoxy resin composition as claimed in claim 1 , wherein the phosphonium compound is represented by one of the following Formulae 4a to 4h.

5. The epoxy resin composition as claimed in claim 1 , wherein the compound containing at least one hydroxyl group includes a monosaccharide or a compound containing at least one phenolic hydroxyl group.

6. The epoxy resin composition as claimed in claim 5 , wherein the monosaccharide includes glucose, fructose, mannose, galactose, or ribose.

7. The epoxy resin composition as claimed in claim 5 , wherein the compound containing at least one phenolic hydroxyl group includes a phenol compound, a naphthol compound, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 9,9′-bis(4-hydroxyphenyl) fluorene, or 2,4-dihydroxybenzophenone.

8. The epoxy resin composition as claimed in claim 1 , wherein the epoxy resin includes at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, a phenol novolac epoxy resin, a tert-butyl catechol epoxy resin, a naphthalene epoxy resin, a glycidylamine epoxy resin, a cresol novolac epoxy resin, a biphenyl epoxy resin, a linear aliphatic epoxy resin, a cycloaliphatic epoxy resin, a heterocyclic epoxy resin, a spiro ring-containing epoxy resin, a cyclohexane dimethanol epoxy resin, a trimethylol epoxy resin, and a halogenated epoxy resin.

9. The epoxy resin composition as claimed in claim 1 , wherein the curing agent includes at least one of a phenol aralkyl phenol resin, a phenol novolac phenol resin, a xyloc phenol resin, a cresol novolac phenol resin, a naphthol phenol resin, a terpene phenol resin, a polyfunctional phenol resin, a dicyclopentadiene-based phenol resin, a novolac phenol resin synthesized from bisphenol A and resorcinol, a polyhydric phenolic compound, an acid anhydride, and an aromatic amine.

10. The epoxy resin composition as claimed in claim 1 , wherein the curing catalyst is present in the epoxy resin composition in an amount of about 0.01 wt % to about 5 wt %, in terms of solid content.

11. The epoxy resin composition as claimed in claim 1 , wherein the phosphonium compound is present in the curing catalyst in an amount of about 10wt % to about 100wt %, based on a total weight of the curing catalyst.

12. The epoxy resin composition as claimed in claim 1 , wherein the compound containing at least one hydroxyl group is present in the epoxy resin composition in an amount of about 0.01wt % to about 1.5wt %, in terms of solid content.

13. A semiconductor device encapsulated with the epoxy resin composition as claimed in claim 1 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Cheon Jin Min
• Kwon Ki Hyeok
• Kim Min Gyum
• Chung Joo Young
• Choi Jin Woo
• Han Seung

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/473

  containing a filler · CPC title