Laser-assisted machining device
US-2016101492-A1 · Apr 14, 2016 · US
Method for machining ceramic matrix composite
US9850175B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9850175-B2 |
| Application number | US-201514843453-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 2, 2015 |
| Priority date | Mar 8, 2013 |
| Publication date | Dec 26, 2017 |
| Grant date | Dec 26, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method for machining a ceramic matrix composite (CMC), the method enhancing a machining speed for the ceramic matrix composite (CMC), includes: a step of scanning an irradiated portion of a surface of a machining target material by a laser head to irradiate the irradiated portion with laser light from the laser head, and forming a deteriorated layer on the irradiated portion of the surface of the machining target material; and a step of sequentially removing the deteriorated layer by an end mill, the deteriorated layer being formed on the irradiated portion, wherein the deteriorated layer is formed by heating the irradiated portion up to a predetermined temperature by irradiation of continuous oscillation laser light, and by forming a crack by irradiation of pulsed oscillation laser light.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for machining a ceramic matrix composite, the method comprising: a step of scanning an irradiated portion of a surface of a machining target material by laser light to irradiate the irradiated portion with the laser light, and forming a deteriorated layer on the irradiated portion of the surface of the machining target material; and a step of removing the deteriorated layer by a machining tool, the deteriorated layer being formed on the irradiated portion, wherein the deteriorated layer is formed by heating the irradiated portion up to a predetermined temperature by irradiation of continuous oscillation laser light, and by forming a crack by irradiation of pulsed oscillation laser light. 2. The method according to claim 1 , wherein, in the step of removing the deteriorated layer, the deteriorated layer formed on the irradiated portion is sequentially removed by the machining tool, which machining tool follows the irradiated portion apart from the irradiated portion by a predetermined distance. 3. The method according to claim 2 , wherein the machining tool is an end mill. 4. The method according to claim 1 , wherein, in the step of forming a deteriorated layer, the deteriorated layer is formed in a predetermined region of the surface of the machining target material, and in the step of removing the deteriorated layer, the deteriorated layer is removed after the deteriorated layer is formed in the predetermined region.
Assignees
Inventors
Classifications
Cutter or work · CPC title
combined with mechanical machining or metal-working covered by other subclasses than B23K · CPC title
- B23C9/00Primary
Details or accessories so far as specially adapted to milling machines or cutter (drives, control devices, or accessories, in general B23Q) · CPC title
involving the removal of at least part of the materials of the treated article, {e.g. etching, drying of hardened concrete (C04B41/0036 - C04B41/0054 take precedence)} · CPC title
Operations & Transport · mapped topic
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- What does patent US9850175B2 cover?
- A method for machining a ceramic matrix composite (CMC), the method enhancing a machining speed for the ceramic matrix composite (CMC), includes: a step of scanning an irradiated portion of a surface of a machining target material by a laser head to irradiate the irradiated portion with laser light from the laser head, and forming a deteriorated layer on the irradiated portion of the surface of…
- Who is the assignee on this patent?
- Ihi Corp
- What technology area does this patent fall under?
- Primary CPC classification B23C9/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 26 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).