Mold material, molding method, mold object, and molding apparatus

Patent metadata

Field	Value
Publication number	US-9849632-B2
Application number	US-201414557605-A
Country	US
Kind code	B2
Filing date	Dec 2, 2014
Priority date	Dec 10, 2013
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A molding apparatus includes a heating section, a spreading section, a molding section, a drawing section and a curing section. The heating section which heats a mold material including particles and a binder agent which bonds together the particles, to a temperature equal to or higher than the melting point of the binder agent and forms a fluid mold material. The spreading section forms a mold layer by spreading the fluid mold material. The molding section layers the mold layers. The drawing section applies UV ink to a desired region of the mold layer. The curing section cures the UV ink applied to the desired region of the mold layer.

First claim

What is claimed is:

1. A mold material adapted to be used in a molding method including applying liquid droplets to a desired region of a layer formed using the mold material, the mold material comprising:
particles; and
a thermoplastic binder which bonds together the particles, the thermoplastic binder including pieces having a thickness which is greater than a smallest gap among gaps between two adjacent particles and smaller than a largest gap among gaps between two adjacent particles, with each of the gaps being located on a line connecting a center of a first particle of two adjacent particles and a center of a second particle of the two adjacent particles.

2. The mold material according to claim 1 , wherein a melting point of the thermoplastic binder is 30° C. or more and 90° C. or less.

3. The mold material according to claim 1 , wherein the thermoplastic binder is soluble in an aqueous solution.

4. The mold material according to claim 1 , wherein the thermoplastic binder includes at least one of polyethylene glycol, polyether-modified silicone, water soluble nylon, polycaprolactone diol, paraffin wax, fatty acid, and fatty acid amide.

5. The mold material according to claim 1 , wherein the particles include one type or two or more types of particles which are selected from acrylic resin particles, silicone resin particles, acrylic silicone resin particles, polyethylene resin particles, polystyrene resin particles, nylon resin particles, polyacrylonitrile resin particles, silicon dioxide particles, and aluminum oxide particles.

6. The mold material according to claim 1 , wherein
an average spherical equivalent diameter of the particles is 0.1 μm or more and 30 μm or less.

7. The mold material according to claim 1 , wherein
a volume of the thermoplastic binder is smaller than a gap between the particles.

Assignees

• Seiko Epson Corp

Inventors

• Hirata Koki

Classifications

• C08L2205/22

  Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer · CPC title

• B29K2101/10

  Thermosetting resins · CPC title

• B29C64/165 Primary

  using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber · CPC title

• B29K2101/12

  Thermoplastic materials · CPC title

• C08L2201/54

  Aqueous solutions or dispersions · CPC title