Conveying and cooling apparatus for a resin composition and conveying and cooling method for a resin composition

Patent metadata

Field	Value
Publication number	US-9849613-B2
Application number	US-201113580258-A
Country	US
Kind code	B2
Filing date	Feb 21, 2011
Priority date	Mar 5, 2010
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

A cooling apparatus includes a conveying means which conveys a resin composition formed into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition and a cooling means which cools the resin composition being conveyed by the conveying means. A temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C. and the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min. Further, the cooling means includes a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of −40 to 0° C. to the resin composition.

First claim

What is claimed is:

1. An apparatus comprising:
a kneading device which kneads a resin composition;
a pair of rollers which pressurizes the kneaded resin composition to thereby form the resin composition into a sheet-shaped resin composition, each roller having an outer layer constituted of a ceramic material;
a conveying device which conveys the sheet-shaped resin composition along a direction parallel to a surface thereof; and
a cooling device which cools the sheet-shaped resin composition being conveyed by the conveying device,
wherein a temperature of the sheet-shaped resin composition just before being cooled by the cooling device is in the range of 40 to 60° C.,
wherein the cooling device has at least one outlet port which discharges cooling air of −40 to 0° C. to the sheet-shaped resin composition being conveyed and a dehumidification device which is provided and in line with the cooling device, wherein the cooling air which is dehumidified is at an upstream side of the at least one outlet port, wherein said dehumidification device dehumidifies the cooling air in the cooling device, and
wherein the cooling device is configured to discharge the cooling air which is dehumidified by the dehumidification device to the sheet-shaped resin composition from the at least one outlet port to thereby have a cooling ability to cool the resin composition such that a cooling rate of the sheet-shaped resin composition is in the range of 0.2 to 5° C./sec.

2. The apparatus as claimed in claim 1 , wherein the humidity of the cooling air is equal to or less than 10%.

3. The apparatus as claimed in claim 1 , wherein when the cooling air is discharged from the outlet port, a pressure of the cooling air is equal to or higher than 0.2 MPa.

4. The apparatus as claimed in claim 1 , wherein the at least one outlet port includes a plurality of outlet ports and the plurality of outlet ports are provided along a conveying direction of the sheet-shaped resin composition.

5. The apparatus as claimed in claim 1 , wherein the at least one outlet port discharges the cooling air to the sheet-shaped resin composition from an upper side thereof.

6. The apparatus as claimed in claim 1 , wherein the at least one outlet port discharges the cooling air to the sheet-shaped resin composition from an opposite side with respect to a conveying direction of the sheet-shaped resin composition.

7. The apparatus as claimed in claim 1 , wherein the cooling device is configured to discharge the cooling air to the sheet-shaped resin composition from an upper side and a lower side thereof.

8. The apparatus as claimed in claim 4 , wherein a temperature of the cooling air discharged from a first outlet port of the plurality of outlet ports provided at a downstream side of the conveying device is lower than a temperature of the cooling air discharged from a second outlet port of the plurality of outlet ports provided at an upstream side of the conveying device compared to the first outlet port.

9. The apparatus as claimed in claim 1 ,
wherein the conveying device has a pair of pulleys arranged so as to be spaced apart from each other and a belt wrapped around the pair of pulleys, on which the sheet-shaped resin composition is placed, conveying the sheet-shaped resin composition by rotation of each of the pulleys, and
wherein at least a surface of the belt is constituted of a nonmetallic material.

10. The apparatus as claimed in claim 9 , wherein the belt is constituted of a laminated body and an outer layer positioned at an outermost side of the laminated body is constituted of a nonmetallic material.

11. The apparatus as claimed in claim 1 ,
further comprising a chamber containing both the sheet-shaped resin composition and a belt therein and maintaining a cooling atmosphere obtained by the cooling device while the sheet-shaped resin composition is conveyed by the belt.

12. The apparatus as claimed in claim 1 , wherein a thickness of the sheet-shaped resin composition is equal to or less than 5 mm.

13. A conveying and cooling method for cooling a resin composition molded into a sheet shape while conveying the resin composition along a direction parallel to a surface of the sheet-shaped resin composition by using the apparatus of claim 1 , the method comprising:
conveying the sheet-shaped resin composition along the direction parallel to the surface thereof by using the conveying device, and
cooling the sheet-shaped resin composition being conveyed by the conveying device by using the cooling device,
wherein a temperature of the sheet-shaped resin composition just before being cooled by the cooling method is in the range of 40 to 60° C., and
wherein the resin composition is cooled such that a cooling rate of the sheet-shaped resin composition is in the range of 0.2 to 5° C./sec by the cooling device.

14. The apparatus as claimed in claim 1 ,
wherein the cooling device has a retention unit storing the cooling air therein which is provided at an opposite side of the at least one outlet port through the conveying device, and
wherein the retention unit is configured to cool an underside of the sheet-shaped resin composition.

Assignees

• Ueda Shigehisa
• Shibata Hiroshi
• Sumitomo Bakelite Co

Inventors

• Ueda Shigehisa
• Shibata Hiroshi

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• B29C48/0011

  combined with compression moulding · CPC title