Amorphous inorganic anion exchanger, resin composition for electronic component sealing, and process for producing amorphous bismuth compound

Patent metadata

Field	Value
Publication number	US-9849449-B2
Application number	US-201314410256-A
Country	US
Kind code	B2
Filing date	Jun 13, 2013
Priority date	Jun 21, 2012
Publication date	Dec 26, 2017
Grant date	Dec 26, 2017

Abstract

The amorphous inorganic anion exchanger of the present invention is represented by Formula (1) and has an average primary particle size observed with an electron microscope of at least 1 nm but no greater than 500 nm and an NO 3 content of no greater than 1 wt % of the whole:

BiO(OH)  Formula (1).

First claim

What is claimed is:

1. An amorphous inorganic anion exchanger, represented by Formula (1), having:
an average primary particle size observed with an electron microscope of at least 1 nm but no greater than 500 nm,
a NO 3 − content of no greater than 1 wt % of a whole,
a specific surface area by a BET method of 10 to 100 m 2 /g,
a median diameter on a volume basis measured by a laser diffraction type particle size distribution analyzer within a range of from 0.01 μm to 20 μm, and
a maximum particle size measured by a laser diffraction type particle size distribution analyzer no greater than 20 μm,
BiO(OH)  Formula (1).

2. The amorphous inorganic anion exchanger according to claim 1 , wherein the anion exchange capacity at 25° C. is at least 2.0 meq/g.

3. The amorphous inorganic anion exchanger according to claim 1 , wherein the anion exchange rate at 25° C. for 10 minutes is at least 2.5 meq/g.

4. The amorphous inorganic anion exchanger according to claim 1 , wherein a suspension thereof in deionized water has a supernatant conductivity of no greater than 50 μS/cm.

5. A resin composition for electronic component sealing, comprising the amorphous inorganic anion exchanger according to claim 1 .

6. The resin composition for electronic component sealing according to claim 5 , wherein the resin composition further comprises an inorganic cation exchanger.

7. A resin for electronic component sealing that is formed by curing the resin composition for electronic component sealing according to claim 5 .

8. An electronic component that is formed by sealing a device with the resin composition for electronic component sealing according to claim 5 .

9. A varnish comprising the amorphous inorganic anion exchanger according to claim 1 .

10. The varnish according to claim 9 , wherein the vanish further comprises an inorganic cation exchanger.

11. An article comprising the varnish according to claim 9 .

12. An adhesive comprising the amorphous inorganic anion exchanger according to claim 1 .

13. The adhesive according to claim 12 , wherein the adhesive further comprises an inorganic cation exchanger.

14. An article that is adhered by means of the adhesive according to claim 12 .

15. A paste comprising the amorphous inorganic anion exchanger according to claim 1 .

16. The paste according to claim 15 , wherein the paste further comprises an inorganic cation exchanger.

17. An article comprising the paste according to claim 15 .

Assignees

• Toagosei Co Ltd

Inventors

• MIYAMURA Kentarou
• Iinuma Tomohisa
• Ono Yasuharu

Classifications

• H10W74/47 Primary

  comprising organic materials, e.g. plastics or resins · CPC title

• C01P2006/80

  Compositional purity · CPC title

• Y10T428/2982

  Particulate matter [e.g., sphere, flake, etc.] · CPC title

• B01J39/09

  Inorganic material · CPC title

• C01P2002/72

  by d-values or two theta-values, e.g. as X-ray diagram · CPC title