Ceiling system

US9845596B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9845596-B2
Application numberUS-201514868485-A
CountryUS
Kind codeB2
Filing dateSep 29, 2015
Priority dateSep 29, 2015
Publication dateDec 19, 2017
Grant dateDec 19, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A ceiling system includes a ceiling support structure supporting a plurality of ceiling panels, each ceiling panel including a core layer having a top surface facing a first interior space above the ceiling panels, a bottom surface facing a second interior space below the ceiling panels, and a plurality of peripheral edges extending between the top and bottom surfaces. A top frame layer extends from the top surface and a thermal layer is on the top frame layer opposite the top surface. The thermal layer has a first surface facing away from the top frame layer and a second surface facing toward the top frame layer. The top frame layer supports the second surface in a spaced-apart manner from the top surface to form one or more air gaps between the top surface and the second surface. The first and second surfaces have a thermal emissivity of 0.5 or less.

First claim

Opening claim text (preview).

What is claimed is: 1. An acoustic ceiling panel comprising: a core layer having a top surface a bottom surface opposite the top surface, and a plurality of peripheral edges extending between the top and bottom surfaces, wherein the core layer comprises a sound absorption material having an NRC rating of at least 0.7; a top frame layer extending from the top surface of the core layer; and a thermal layer on the top frame layer, the thermal layer having a first surface and a second surface opposite the first surface, the first surface facing away from the top frame layer and the second surface facing toward the top frame layer, wherein the top frame layer supports the second surface of the thermal layer in a spaced-apart manner from the top surface of the core layer to form one or more air gaps between the top surface of the core layer and the second surface of the thermal layer, and wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.5 or less. 2. The acoustic ceiling panel according to claim 1 , wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.1 or less. 3. The acoustic ceiling panel according to claim 1 , wherein the top frame layer is formed by a plurality of ridges extending from the top surface of the core layer. 4. The acoustic ceiling panel according to claim 1 , wherein the top frame layer is affixed to the top surface of the core layer. 5. The acoustic ceiling panel according to claim 1 , wherein the top frame layer is formed integrally with the core layer. 6. The acoustic ceiling panel according to claim 1 , wherein the top frame layer is formed integrally with the thermal layer. 7. The acoustic ceiling panel according to claim 1 , wherein the first surface and the second surface of the thermal layer are formed from one of a metal foil, a paint, and a metal coated polymer film. 8. The acoustic ceiling panel according to claim 1 , wherein the sound absorption material comprises a fibrous material. 9. The acoustic ceiling panel according to claim 8 , wherein the fibrous material comprises mineral fiber. 10. An acoustic ceiling panel comprising a core layer having a top surface, a bottom surface opposite the top surface, and a plurality of peripheral edges extending between the top and bottom surfaces, wherein the core layer comprises a sound absorption material; a top frame layer extending from the top surface of the core layer; and a thermal layer on the top frame layer, the thermal layer having a first surface and a second opposite the first surface, the first surface facing away from the top frame layer and the second surface facing toward the top frame layer, wherein the top frame layer supports the second surface of the thermal layer in a spaced-apart manner from the top surface of the core layer to form one or more air gaps between the top surface of the core layer and the second surface of the thermal layer, and wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.5 or less; wherein the top frame layer extends across the top surface of the core layer. 11. The acoustic ceiling panel according to claim 10 , wherein the top frame layer includes at least one medial support extending across the top surface of the core layer. 12. The acoustic ceiling panel according to claim 10 , wherein the thermal layer extends across the top frame layer to cover the top frame layer. 13. The acoustic ceiling panel according to claim 10 , wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.1 or less. 14. The acoustic ceiling panel according to claim 10 , wherein the top frame layer is formed by a plurality of ridges extending from the top surface of the core layer. 15. The acoustic ceiling panel according to claim 10 , wherein the top frame layer is affixed to the top surface of the core layer. 16. The acoustic ceiling panel according to claim 10 , wherein the top frame layer is formed integrally with the core layer. 17. The acoustic ceiling panel according to claim 10 , wherein the top frame layer is formed integrally with the thermal layer. 18. The acoustic ceiling panel according to claim 10 , wherein the first surface and the second surface of the thermal layer are formed from one of a metal foil, a paint, and a metal coated polymer film. 19. An acoustic ceiling panel comprising: a core layer having a top surface, a bottom surface opposite the top surface, and a plurality of peripheral edges extending between the top and bottom surfaces, wherein the core layer comprises a sound absorption material; a top frame layer extending from the top surface of the core layer; and a thermal layer on the top frame layer, the thermal layer having a first surface and a second opposite the first surface, the first surface facing away from the top frame layer and the second surface facing toward the top frame layer, wherein the top frame layer supports the second surface of the thermal layer in a spaced-apart manner from the top surface of the core layer to form one or more air gaps between the top surface of the core layer and the second surface of the thermal layer, and wherein the first surface and the second surface of the thermal layer have a thermal emissivity of 0.5 or less; a bottom frame layer secured to the bottom surface of the core layer; and a bottom layer secured to the bottom frame layer, wherein the bottom frame layer holds the bottom layer in a spaced-apart manner from the bottom surface of the core layer to form an air space between the bottom layer and the bottom surface of the core layer.

Assignees

Inventors

Classifications

  • ceilings, e.g. cool ceilings · CPC title

  • Waffle-form · CPC title

  • the fibres or filaments of a layer being of different substances {, e.g. conjugate fibres, mixture of different fibres} · CPC title

  • 4 layers · CPC title

  • Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers · CPC title

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What does patent US9845596B2 cover?
A ceiling system includes a ceiling support structure supporting a plurality of ceiling panels, each ceiling panel including a core layer having a top surface facing a first interior space above the ceiling panels, a bottom surface facing a second interior space below the ceiling panels, and a plurality of peripheral edges extending between the top and bottom surfaces. A top frame layer extends…
Who is the assignee on this patent?
Armstrong World Ind Inc, Awi Licensing Llc
What technology area does this patent fall under?
Primary CPC classification E04B1/76. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Dec 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).