Method of manufacturing multi-layer thin film, member including the same and electronic product including the same

US9845535B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9845535-B2
Application numberUS-201414291652-A
CountryUS
Kind codeB2
Filing dateMay 30, 2014
Priority dateMay 31, 2013
Publication dateDec 19, 2017
Grant dateDec 19, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a multi-layer thin film, the method comprising: coating a metal object with a coating layer; depositing at least one hardness-enhancing layer on the coating layer; depositing a color layer on the at least one hardness-enhancing layer, and depositing a protective layer on the color layer; wherein the depositing the at least one hardness-enhancing layer on the coating layer consists of: depositing a first hardness-enhancing layer comprising chromium (Cr) on the coating layer; and depositing a second hardness-enhancing layer on the first hardness-enhancing layer, the second hardness-enhancing layer comprising at least one material selected from a group consisting of titanium nitride (TiN), chromium nitride (CrN) and aluminum nitride (AlN). 2. The method according to claim 1 , wherein the coating the metal object with the coating layer comprises creating a substantially smooth surface with the coating layer. 3. The method according to claim 1 , wherein the coating the metal object with the coating layer comprises forming the coating layer to a thickness of about 1 to about 30 micrometers. 4. The method according to claim 1 , wherein the coating the metal object with the coating layer comprises using one of a stoving paint, a UV paint and a powdered paint. 5. The method according to claim 1 , wherein the coating layer comprises at least one of an acrylic resin, a melamine resin and an epoxy resin. 6. The method according to claim 1 , wherein the color layer comprises at least one material selected from a group consisting of chromium (Cr), titanium (Ti), copper (Cu), gold (Au) and titanium nitride (TiN). 7. The method according to claim 1 , wherein the protective layer consists of at least one material selected from a group consisting of Teflon and silicon. 8. The method according to claim 1 , wherein each of the coating the metal object with the coating layer, the depositing the at least one hardness-enhancing layer, and the depositing the color layer comprise using at least one of a pulsed direct current power source and a radio frequency power source. 9. A metal member comprising: a metal object; a coating layer coated on the metal object; at least one hardness-enhancing layer disposed on the coating layer; a color layer deposited on the at least one hardness-enhancing layer; and a protective layer disposed on the color layer; wherein the at least one hardness-enhancing layer consists of: a first hardness-enhancing layer comprising chromium (Cr) disposed on the coating layer; and a second hardness-enhancing layer, disposed on the first hardness-enhancing layer, the second hardness-enhancing layer comprising at least one material selected from a group consisting of titanium nitride (TiN), chromium nitride (CrN) and aluminum nitride (AlN). 10. The metal member according to claim 9 , wherein the coating layer comprises a substantially surface which is smoother than a surface of the metal object on which the coating layer is coated. 11. The metal member according to claim 9 , wherein the coating layer has a thickness of about 1 to about 30 micrometers. 12. The metal member according to claim 9 , wherein the coating layer comprises at least one material selected from a group consisting of a stoving paint, a UV paint and a powdered paint. 13. The metal member according to claim 9 , wherein the coating layer comprises at least one of an acrylic resin, a melamine resin and an epoxy resin. 14. The metal member according to claim 9 , wherein the color layer comprises at least one material selected from a group consisting of chromium (Cr), titanium (Ti), copper (Cu), gold (Au) and titanium nitride (TiN), and wherein the color layer is different from the second hardness-enhancing layer. 15. The metal member according to claim 9 , wherein the protective layer consists of at least one material selected from a group consisting of Teflon and silicon. 16. An electronic product comprising: a housing comprising a metal component; and a multi-layer thin film bonded to an entirety or a part of a surface of the housing, wherein the multi-layer thin film consists of: a coating layer bonded to the entirety or part of the surface of the housing; at least one hardness-enhancing layer bonded to the coating layer; a color layer bonded to the at least one hardness-enhancing layer; and a protective layer bonded to the color layer, and wherein the at least one hardness-enhancing layer consists of: a first hardness-enhancing layer, comprising chromium (Cr) disposed on the coating layer; and a second hardness-enhancing layer, disposed on the first hardness-enhancing layer, the second hardness-enhancing layer comprising at least one material selected from a group consisting of titanium nitride (TiN), chromium nitride (CrN) and aluminum nitride (AlN). 17. The electronic product according to claim 16 , wherein the housing comprises an accessory. 18. The electronic product according to claim 16 , wherein the metal component comprises at least one material selected from a group consisting of aluminum (Al), zinc (Zn), magnesium (Mg), steel use stainless (SUS), stainless steel (STS) and steel. 19. The electronic product according to claim 16 , wherein the color layer comprises at least one material selected from a group consisting of chromium (Cr), titanium (Ti), copper (Cu), gold (Au) and titanium nitride (TiN), and wherein the color layer is different from the second hardness-enhancing layer. 20. The electronic product according to claim 16 , wherein the protective layer consists of at least one material selected from a group consisting of Teflon and silicon.

Assignees

Inventors

Classifications

  • Addition polymer is perhalogenated · CPC title

  • Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.] · CPC title

  • characterized by the colour of the layer · CPC title

  • using pulsed power to the target · CPC title

  • Of metal · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9845535B2 cover?
Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includ…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23C28/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).