Copper alloy

Patent metadata

Field	Value
Publication number	US-9845521-B2
Application number	US-201113299828-A
Country	US
Kind code	B2
Filing date	Nov 18, 2011
Priority date	Dec 13, 2010
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

A copper alloy containing Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent with the remainder consisting of copper and unavoidable impurities, wherein: the average crystal grain size of the crystal grains in the copper alloy is 5 to 30 μm; the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 3%; and the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%.

First claim

What is claimed is:

1. A cold-rolled copper alloy consisting essentially of Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent, copper and unavoidable impurities, wherein:
the copper alloy contains Sn: 0.05%-3.0% and Zn: 0.05%-3.0% in terms of mass percent;
the total content of Sn and Zn in the copper alloy is at least 1.1 mass %;
the average crystal grain size of the crystal grains in the copper alloy is 12 to 30 μm;
the area ratio of the crystal grains having crystal grain sizes not less than twice the average crystal grain size to the area of the total crystal grains is not less than 3%;
the ratio of the area of cube orientation grains to the area of the crystal grains having crystal grain sizes not less than twice the average crystal grain size is not less than 50%;
the electrical conductivity of the copper alloy is more than 35% IACS,
the stress relaxation resistance is less than 20%, and
the copper alloy has been subjected to a final cold rolling reduction of 35% to 60%, has a tensile strength in the rolling direction of no less than 733 MPa, and has a 0.2% proof stress in the direction perpendicular to the rolling direction of no less than 700 MPa;
wherein the amount of Co in the copper alloy is no more than 0.3 mass %.

2. The copper alloy according to claim 1 , wherein the copper alloy further contains one or more elements selected from the group consisting of Fe, Mn, Mg, Ti, Cr, and Zr by 0.01%-3.0% in terms of mass percent in total.

3. A cold-rolled copper alloy consisting essentially of Ni: 1.5%-3.6% and Si: 0.3%-1.0% in terms of mass percent, copper and unavoidable impurities, wherein:
the copper alloy contains Sn: 0.05%-3.0% and Zn: 0.05%-3.0% in terms of mass percent;
the total content of Sn and Zn in the copper alloy is at least 1.1 mass %;
the average crystal grain size of the copper alloy is 15 to 40 μm;
the average area ratio in cube orientation {001}<100> is not less than 45% as a result of measurement by an SEM-EBSP method;
a KAM value is 1.0-3.0;
the electrical conductivity of the copper alloy is more than 35% IACS;
the stress relaxation resistance is less than 20%, and
the copper alloy has been subjected to a final cold rolling reduction of 35% to 60%, has a tensile strength in the rolling direction of no less than 742 MPa, and has a 0.2% proof stress in the direction perpendicular to the rolling direction of no less than 700 MPa;
wherein the amount of Co in the copper alloy is no more than 0.3 mass %.

4. The copper alloy according to claim 3 , wherein the copper alloy further contains one or more elements selected from the group consisting of Fe, Mn, Mg, Ti, Cr, and Zr by 0.01%-3.0% in terms of mass percent in total.

5. A cold-rolled copper alloy consisting essentially of Ni: 2.0%-3.6%, Si: 0.4%-1.0%, Sn: 0.05%-1.5%, and Zn: 0.05%-3.0% in terms of mass percent, copper and unavoidable impurities, wherein:
the total content of Sn and Zn in the copper alloy is at least 1.1 mass %;
the average crystal grain size of the copper alloy is 12 to 40 μm;
the average area ratio in cube orientation {001}<100> is not less than 20% as a result of measurement by an SEM-EBSP method;
the average difference in area ratio in cube orientation measured at points at ¼ thickness of a sheet of the copper alloy and measured at points at ½ thickness of a sheet of the copper alloy is within 5%; and
a KAM value is not less than 1.00 to not more than 3.00;
the electrical conductivity of the copper alloy is more than 35% IACS,
the stress relaxation resistance is less than 20%, and
the copper alloy has been subjected to a final cold rolling reduction of 35% to 60%, has a tensile strength in the rolling direction of no less than 732 MPa, and has a 0.2% proof stress in the direction perpendicular to the rolling direction of no less than 700 MPa;
wherein the amount of Co in the copper alloy is no more than 0.3 mass %.

6. The copper alloy according to claim 5 , wherein the copper alloy further contains one or more elements selected from the group consisting of Fe, Mn, Mg, Ti, Cr, and Zr by 0.01%-3.0% in terms of mass percent in total.

7. The copper alloy according to claim 1 , wherein an average area ratio in cube orientation {001}<100> is not less than 45% as a result of measurement by an SEM-EBSP method.

8. The copper alloy according to claim 5 , wherein the average area ratio in cube orientation {001}<100> is not less than 45% as a result of measurement by an SEM-EBSP method.

9. The copper alloy according to claim 1 , wherein the total content of Sn and Zn in the copper alloy is at least 1.20 mass %.

10. The copper alloy according to claim 3 , wherein the total content of Sn and Zn in the copper alloy is at least 1.20 mass %.

11. The copper alloy according to claim 5 , wherein the total content of Sn and Zn in the copper alloy is at least 1.20 mass %.

Assignees

• Shishido Hisao
• Katsura Shinya
• Aruga Yasuhiro
• Matsumoto Katsushi
• Kobe Steel Ltd

Inventors

• Shishido Hisao
• Katsura Shinya
• Aruga Yasuhiro
• Matsumoto Katsushi

Classifications

• C22F1/08

  of copper or alloys based thereon · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C22C1/02

  by melting {(C22C1/1036 takes precedence)} · CPC title

• C22C9/06 Primary

  with nickel or cobalt as the next major constituent · CPC title

• H01B1/026

  Alloys based on copper · CPC title