Cleaning composition after chemical mechanical polishing of organic film and cleaning method using the same

Patent metadata

Field	Value
Publication number	US-9845444-B2
Application number	US-201514942206-A
Country	US
Kind code	B2
Filing date	Nov 16, 2015
Priority date	Nov 18, 2014
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

A cleaning composition includes an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at the end, and an ultra pure water, wherein a pH value of the cleaning composition is equal to or higher than 12.

First claim

What is claimed is:

1. A composition for cleaning an organic film, the composition comprising:
an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at an end, and an ultra pure water,
wherein a pH value of the composition is greater than or equal to 12,
wherein the composition includes 0.01 to 10.00 wt % of the organic solvent, 0.01 to 3.00 wt % of the organic acid, 0.01 to 1.00 wt % of the chelating agent, 0.0001 to 0.2 wt % of the surfactant, and 85.8 to 99.9 wt % of the ultra pure water based on a total weight of the composition.

2. The composition of claim 1 , wherein the pH value is 12 to 13.

3. The composition of claim 1 , wherein the surfactant contains 1 to 20 hydroxyl groups at the end.

4. The composition of claim 3 , wherein the surfactant is an aromatic compound including 20 or less aromatic rings.

5. The composition of claim 1 , wherein the organic solvent includes at least one of tetramethyl ammonium hydroxide (TMAH), dimethylacetamide (DMAC), N-methylpyrrolidone (NMP), dimethyl sulfoxide (DMSO), 1,4-dioxane, propylene glycol monomethyl ether (PGME), dimethylformamide, N-methylformamide, formamide, dimethyl-2-piperidone (DMPD), tetrahydrofurfuryl alcohol, glycerol, and ethylene glycol.

6. The composition of claim 1 , wherein the organic acid includes at least one of acetic acid, citric acid, glutaric acid, glycolic acid, formic acid, lactic acid, malic acid, maleic acid, oxalic acid, phthalic acid, succinic acid, and tartaric acid.

7. The composition of claim 1 , wherein the chelating agent includes at least one of ammonium acetate, ammonium oxalate, ammonium formate, ammonium tartrate, ammonium lactate, aminobenzotriazole, aminobutyric acid, aminoethylaminoethanol, aminopyridine, and their salts.

8. A method of cleaning a surface of the organic film after polishing the organic film using the composition according to claim 1 .

9. A cleaning composition comprising an aromatic surfactant containing at least one hydroxyl group (OH) at an end, the surfactant including 20 or less aromatic rings, wherein a pH value of the cleaning composition is greater than or equal to 12, and
wherein the cleaning composition includes 0.01 to 10.00 wt % of an organic solvent, 0.01 to 3.00 wt % of an organic acid, 0.01 to 1.00 wt % of a chelating agent 0.001 to 0.2 wt % of the surfactant, and 85.8 to 99.9 wt % of an ultra pure water based on a total weight of the cleaning composition.

10. The cleaning composition of claim 9 , wherein the surfactant contains 1 to 20 hydroxyl groups at the end.

11. The cleaning composition of claim 9 , further comprising:
the organic solvent including at least one of tetramethyl ammonium hydroxide (TMAH), dimethylacetamide (DMAC), N-methylpyrrolidone (NMP), dimethyl sulfoxide (DMSO), 1,4-dioxane, propylene glycol monomethyl ether (PGME), dimethylformamide, N-methylformamide, formamide, dimethyl-2-piperidone (DMPD), tetrahydrofurfuryl alcohol, glycerol, and ethylene glycol;
the organic acid including at least one of acetic acid, citric acid, glutaric acid, glycolic acid, formic acid, lactic acid, malic acid, maleic acid, oxalic acid, phthalic acid, succinic acid, and tartaric acid; and
the chelating agent including at least one of ammonium acetate, ammonium oxalate, ammonium formate, ammonium tartrate, ammonium lactate aminobenzotriazole, aminobutyric acid, aminoethylaminoethanol, aminopyridine, and their salts.

12. A cleaning system comprising:
a composition supply portion configured to supply the composition of claim 1 on exposed surfaces of an organic film; and
at least one cleaning portion configured to clean the surfaces of the organic film having the composition supplied thereon,
wherein the at least one cleaning portion includes first and second roll-brushes configured to clean the surfaces of the organic film having the composition supplied thereon, and
wherein the composition supply portion includes first and second portions configured to supply the composition to the exposed surfaces of the organic film.

13. The cleaning system of claim 12 , wherein
the surfactant contains 1 to 20 hydroxyl groups at the end, and
the surfactant is an aromatic compound including 20 or less aromatic rings.

14. The cleaning system of claim 12 , wherein the organic film has a carbon content of 50 to 95 atom %, a film density of 0.5 to 2.5 g/cm 3 , and a hardness of greater than or equal to 0.4 GPa.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Ahn-Ho
• Jung Chung-Kyung
• Kang Dong-Min
• Kang Dong-Hun
• Kim Go-Un
• Kim Dong-Jin
• Yoo Yong-Sik
• Jung Young-Chul
• Jung Yu-Ri
• Choi Jung-Min
• Kim Sang-Kyun

Classifications

• C11D11/0047

  Chemistry & Metallurgy · mapped topic

• C11D1/72

  Ethers of polyoxyalkylene glycols · CPC title

• C11D3/43

  Solvents · CPC title

• C11D3/28

  Heterocyclic compounds containing nitrogen in the ring · CPC title

• C11D3/30

  Amines; Substituted amines {; Quaternized amines} · CPC title