Polyamide molding material, the use thereof, and molded parts produced therefrom

Patent metadata

Field	Value
Publication number	US-9845389-B2
Application number	US-201114360543-A
Country	US
Kind code	B2
Filing date	Dec 23, 2011
Priority date	Dec 23, 2011
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320° C. and a tool temperature of 90° C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar, at the flow path end of a mold arm having a vent gap dimension of 30 μm, burrs having a length G of at most 30 μm result. Such a polyamide molding material results in molded parts having good surface quality and low warpage when injection molded and is suitable for the production of housings or housing parts of electrical and electronic devices.

First claim

The invention claimed is:

1. A polyamide molding material comprising:
at least one partially crystalline, partially aromatic polyamide (A) selected from a group consisting of PA 6T/6I /6, PA 6T/10T, PA 6T/10T/6I/10I and mixtures thereof;
at least one amorphous polyamide (B);
a weight ratio of the at least one partially crystalline, partially aromatic polyamide (A) to the at least one amorphous polyamide (B) being in the range of 30:70 to 70:30;
the at least one polyamide (A) and the at least one polyamide (B) together making up 30 -60 wt.-% of the polyamide molding material;
40-70 wt.-% glass fibers (C) with flat cross section;
0-15 wt.-% of at least one nonhalogenated flame retardant (D); and
0-10 wt.-% further additives (E);
the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material;
wherein the polyamide molding material, in an injection-molding burr formation test at a melt temperature of 320° C. and a tool temperature of 90° C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar at the flow path end of a mold arm having a vent gap dimension of 30 μm, results in burrs having a length G of at most 30 μm, and the at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C.

2. The polyamide molding material according to claim 1 , wherein the at least one partially crystalline, partially aromatic polyamide (A) is PA 6T/10T/6I/10I, which is synthesized from:
100 mol-% dicarboxylic acid component, composed of
72.0 -98.3 mol-% terephthalic acid and
28.0 -1.7 mol-% isophthalic acid

100 mol-% diamine component, composed of
60.0 -85.0 mol-% hexamethylene diamine and
15.0 -40.0 mol-% 1,10-decane diamine.

3. The polyamide molding material according to claim 1 , wherein the at least one partially crystalline, partially aromatic polyamide (A) is PA, 6T/10T/6I/10I which is synthesized from:
100 mol-% dicarboxylic acid component, composed of
75.0 -95.0 mol-% terephthalic acid and
25.0 -5.0 mol-% isophthalic acid;

100 mol-% diamine component, composed of
60.0 -75.0 mol-% hexamethylene diamine and
25.0 -40.0 mol-% 1,10-decane diamine.

4. The polyamide molding material according to claim 1 , wherein the at least one partially crystalline, partially aromatic polyamide (A) is PA 6T/10T/6I/10I, which is synthesized from:
100 mol-% dicarboxylic acid, composed of
80.0-90.0 mol-% terephthalic acid and
20.0-10.0 mol-% isophthalic acid; and

100 mol-% diamine component, composed of
62. 0-72.0 mol-% hexamethylene diamine and
28.0-38.0 mol-% 1 ,10-decane diamine.

5. The polymide molding material according to claim 1 , wherein a relative viscosity of the at least one partially crystalline, partially aromatic polymide (A) is 1.45-2.0, measured using 0.5 g of the at least one partially crystalline, partially aromatic polyamide (A) in 100 ml m-cresol at 20°C.

6. The polyamide molding material according to claim 1 , wherein the at least one amorphous polyamide (B) is selected from a group consisting of PA 6I/6T, PA 6I, PA MACMI/12, PA MACMI/MACMT/12, PA 6I/MACMI/12,PA 6I/6T/MACMI/MACMT, PA 6I/6T/MACMI/MACMT/12, PA MACMI/MACM12, PA MXDI, PA MXDI/6I, PA MXDI/MXDT/6I/6T, PA MXDI/12I, PA 6I/6T/6NDA, PA MACM12, PA MACM14, PA MACM18, PA NDT/INDT, PA MACMT/12, PA MACMI/MACMNDA, PA MACMT/MACMNDA, PA MACMI/MACM36, PA MACMT/MACM36, PA MACMT/MACM12, PA MACM6/11, PA 6I/6T/MACMI/MACMT/MACM12/612, PA 6I/6T/6NDA/MACMI/MACMT/MACMNDA, the laurin lactam being able to be entirely or partially replaced by caprolactam and/or the MACM being able to be replaced up to at most 20 mol-% by PACM.

7. The polyamide molding material according to claim 6 , wherein the at least one amorphous polyamide (B) is a PA 6I/6T, in which the portion of the isophthalic acid in relation to the sum of isophthalic acid and terephthalic acid in the PA 6I/6T is 90 to 57 mol-%.

8. The polyamide molding material according to claim 1 , wherein the weight ratio of the at least one partially crystalline, partially aromatic polyamide (A) to the at least one amorphous polyamide (B) is in the range of 40:60 to 65:35.

9. The polyamide molding material according to claim 1 , wherein the molding material only comprises one polyamide (A) and one polyamide (B) each.

10. The polyainide molding material according to claim 1 , wherein the at least one nonhalogenated flame retardant (D) is provided in a quantity of 0 to 13 wt-% in the polyamide molding material.

11. The polyamide molding material according to claim 10 , wherein the at least one nonhalogenated flame retardant comprises a flame retardant (D) containing phosphorus.

12. The polyamide molding material according to claim 1 , wherein a standard test body, which is produced from such a molding material and injection molded at a melt temperature of 320° C. and a tool temperature of 90° C. having plate-shaped dimensions of 60×60×2 mm, has a warpage, calculated as the difference between the transverse and longitudinal processing shrinkage according to ISO standard 294, of at most 0.22%.

13. A molded part produced by injection molding from a molding material according to claim 1 , wherein the molded part has an amorphous or less crystallized surface region and a partially crystalline core region.

14. The polyamide molding material according to claim 5 , wherein the relative viscosity of the at least one partially crystalline, partially aromatiepolyamide (A) is 1.5-1.9, measured using 0.5 g of the at least one partially crystalline, partially aromatic polyamide (A) in 100 ml m-cresol at 20° C.

15. The polyamide molding material according to claim 7 , wherein the portion of the isophthalic acid in relation to the sum of isophthalic acid and terephthalic acid in the PA 6I/6T is 85 to 60 mol-%.

16. The polyamide molding material according to claim 7 , wherein the portion of the isophthalic acid in relation to the sum of isophthalic acid and terephthalic acid in the PA 6I/6T is 75 to 60 mol-%.

17. The polyamide molding material according to claim 7 , wherein the portion of the isophthalic acid in relation to the sum of isophthalic acid and terephthalic acid in the PA 6I/6T is 72 to 63 mol-%.

18. The polyamide molding material according to claim 8 , wherein the weight ratio of the at least one partially crystalline, partially aromatic polyamide (A) to the at least one amorphous polyamide (B) is in the range of 40:60 to 60:40.

19. The polyamide molding material according to claim 8 , wherein the weight ratio of the at least one partially crystalline, partially aromatic polyamide (A) to the at least one amorphous polyamide (B) is in the range of 45:55 to 56:44.

20. The potyamide molding material according to claim 8 , wherein the weight ratio of the at least one partially crystalline, partially aromatic polyamide (A) to the at least one amorphous polyamide (B) is in the range of 45:55 to 49:51.

21. The polyamide molding material according to claim 10 , wherein the at least one nonhalogenated flame retardant (D) is provided in a quantity of 9 to 13 wt.-% in the polyamide molding material.

22. The polyamide molding material according to claim 10 , wherein the at least one nonhalogenated flame retardant (D) is provided in a quantity of 10 to 12 wt.-% in the polyamide molding material.

23. The polyamide molding material according to claim 6 , wherein the MACM is able to be replaced up to at most 10 mol-% by PACM.

24. The polyamide molding material

Assignees

• Harder Philipp
• Mossauer Herbert
• Ems Patent Ag

Inventors

• Harder Philipp
• Mossauer Herbert

Classifications

• C08L77/06 Primary

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• B29K2077/00

  Use of {PA, i.e.} polyamides, e.g. polyesteramides {or derivatives thereof}, as moulding material · CPC title

• C09K21/12

  containing phosphorus · CPC title

• C08G69/265

  from at least two different diamines or at least two different dicarboxylic acids · CPC title

• B29C2945/00

  Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould · CPC title