Thermal head and thermal printer provided with same

Patent metadata

Field	Value
Publication number	US-9844950-B2
Application number	US-201414914087-A
Country	US
Kind code	B2
Filing date	Aug 23, 2014
Priority date	Aug 26, 2013
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

A thermal head includes a substrate, a heat-generating portion disposed on the substrate, electrodes disposed on the substrate and electrically connected to the heat-generating portion, a driver IC disposed on the substrate and electrically connected to the electrodes, and a covering member covering the driver IC. In plan view, a center line of the driver IC extending in a main scanning direction and a highest position of the covering member are located farther form the heat-generating portion than a center line of the covering member extending in the main scanning direction.

First claim

The invention claimed is:

1. A thermal head comprising:
a substrate;
a heat-generating portion disposed on the substrate;
an electrode disposed on the substrate and electrically connected to the heat-generating portion;
a driver IC disposed on the substrate and electrically connected to the electrode; and
a covering member covering the driver IC,
wherein, in plan view, a center line of the driver IC extending in a main scanning direction and a highest position of the covering member are located farther from the heat-generating portion than a center line of the covering member extending in the main scanning direction.

2. The thermal head according to claim 1 ,
wherein, in plan view, an entirety of the driver IC is located farther from the heat-generating portion than the highest position of the covering member.

3. The thermal head according to claim 1 ,
wherein, in plan view, the highest position of the covering member is located farther from the heat generating portion than the center line of the covering member extending in the main scanning direction.

4. The thermal head according to claim 1 ,
wherein the covering member includes a bubble.

5. The thermal head according to claim 4 ,
wherein the bubble is disposed between the highest position of the covering member and the driver IC.

6. The thermal head according to claim 1 ,
wherein the covering member includes a first region in which the driver IC is located in a cross direction of the main scanning direction and a second region in which the driver IC is not located in the cross direction of the main scanning direction, and an each of the first region and the second region includes a first edge disposed close to the heat-generating portion and a second edge located opposite to the first edge, and
wherein a second edge of the second region is located closer to the heat-generating portion than a second edge of the first region.

7. The thermal head according to claim 6 ,
wherein a distance between a first edge of the first region and the heat-generating portion is substantially equal to a distance between a first edge of the second region and the heat-generating portion.

8. The thermal head according to claim 6 , further comprising:
a circuit board electrically connected to the electrode,
wherein the circuit board is disposed adjacent to an each second edge of the first region and the second region, and
wherein a resin layer is disposed on a part of the circuit board and a part of the each second edge of the first region and the second region.

9. A thermal printer comprising:
the thermal head according to claim 1 ;
a conveying mechanism that conveys a recording medium onto the heat-generating portion; and
a platen roller that presses the recording medium against the heat-generating portion.

10. The thermal head according to claim 1 ,
wherein the center line of the driver IC extending in the cross direction of the main scanning direction is located farther from the heat-generating portion than the highest position of the covering member.

11. A thermal head comprising:
a substrate;
a heat-generating portion disposed on the substrate;
an electrode disposed on the substrate and electrically connected to the heat-generating portion;
a circuit board electrically connected to the electrode;
a driver IC disposed on the circuit board and electrically connected to the electrode; and
a covering member covering the driver IC,
wherein, in plan view, a center line of the driver IC extending in a main scanning direction is located farther from the heat-generating portion than a center line of the covering member extending in the main scanning direction.

12. The thermal head according to claim 11 ,
wherein, in plan view, an entirety of the driver IC is located farther from the heat-generating portion than the highest position of the covering member.

13. The thermal head according to claim 11 ,
wherein, in plan view, the highest position of the covering member is located farther from the heat generating portion than a center line of the covering member, extending in the main scanning direction.

14. The thermal head according to claim 11 , wherein the covering member includes a bubble.

15. The thermal head according to claim 14 ,
wherein the bubble is disposed between the highest position of the covering member and the driver IC.

16. The thermal head according to claim 11 ,
wherein the covering member includes a first region in which the driver IC is located in a cross direction of the main scanning direction and a second region in which the driver IC is not located in the cross direction of the main scanning direction, and an each of the first region and the second region includes a first edge disposed close to the heat-generating portion and a second edge located opposite to the first edge, and
wherein a second edge of the second region is located closer to the heat-generating portion than a second edge of the first region.

17. The thermal head according to claim 16 ,
wherein a distance between a first edge of the first region and the heat-generating portion is substantially equal to a distance between a first edge of the second region and the heat-generating portion.

18. The thermal head according to claim 16 ,
wherein the circuit board is disposed adjacent to an each second edge of the first region and the second region, and
wherein a resin layer is disposed on a part of the circuit board and a part of the each second edge of the first region and the second region edge.

19. The thermal head according to claim 11 ,
wherein the center line of the driver IC extending in the main scanning direction is located farther from the heat-generating portion than the highest position of the covering member.

20. The thermal head according to claim 11 ,
wherein the highest position of the cover member is located farther from the heat-generating portion than the center line of the covering member in the main scanning direction.

Assignees

• Kyocera Corp

Inventors

• Kondo Yoshiyuki
• Hirose Shoji
• Moto Yoichi

Classifications

• B41J2/33515

  Heater layers · CPC title

• B41J2/3357

  Surface type resistors · CPC title

• B41J2/3353

  Protective layers · CPC title

• B41J2/3354

  characterised by geometry · CPC title

• B41J2/3355

  characterised by materials · CPC title