Manufacturing method of housing and electronic device

US9844903B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9844903-B2
Application numberUS-201414230675-A
CountryUS
Kind codeB2
Filing dateMar 31, 2014
Priority dateSep 13, 2013
Publication dateDec 19, 2017
Grant dateDec 19, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing. The housing made of the first material exhibits a second material effect in visual and/or tactile senses.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device, comprising: a plurality of electric components; a housing for providing an accommodating space in which the plurality of electric components is accommodated; a first part of the housing being made of a single first material into a uniform construction which is integrally molded; the first part of the housing having a plurality of recesses arranged in a first arrangement, and the plurality of recesses being formed by recessing an outer surface of the first part of the housing inwardly; and the outer surface of the first part of the housing being provided with spaces for spacing the plurality of the recesses, and the spaces being formed between any two of the recesses on the outer surface of the first part of the housing after the outer surface of the first part of the housing being recessed inwardly to form the plurality of the recesses; wherein: portions of the outer surface of the first part of the housing which have the plurality of recesses are arranged to face away from the accommodating space and exposed in an outside of the housing; a second material effect exhibits on the first part of the housing by the plurality of the recesses and the spaces, and the second material is different from the first material; a textile effect presents on the first part of the housing by the plurality of the recesses and the spaces and the second material effect is the textile effect, and the textile effect is embodied in visual and/or tactile senses sensed by an observer of the electronic device when observing the outer surface of the first part of the housing; a texture in a first direction and a texture in a second direction constituted by the plurality of recesses and the plurality of spaces present the textile effect seen by an observer of the electric device, demonstrating that the texture in the first direction interweaving with the texture in the second direction, or when the user touches the device, present a tactile feeling of textile; and the first part of the housing comprises an edge area and a central area, and the edge area surrounds the central area, and the edge area corresponds to an edge of the electronic device, and the plurality of the recesses comprise a first recess located in the edge area and a second recess located in the central area, a depth of the first recess being smaller than that of the second recess. 2. The electronic device according to claim 1 , characterized in that, the depth of the first recess is gradually reduced with far away from the central area. 3. The electronic device according to claim 1 , characterized in that, a circumscribed circle of a pattern which is formed by the recesses on the outer surface of the first part has a diameter of 0.08-0.38 mm, and the depth of the recesses is greater than 0.02 mm, so that the textile effect presents on the first part of the housing. 4. The electronic device according to claim 3 , characterized in that, circumscribed circles of the plurality of recesses have same or different diameters. 5. The electronic device according to claim 1 , characterized in that, the electronic device is a cell phone, a panel computer, an all-in-one PC, a desktop, a media player, a notebook PC, a TV set, a display device or a mobile memory.

Assignees

Inventors

Classifications

  • Component parts, details or accessories; Auxiliary operations · CPC title

  • B29C45/372Primary

    provided with means for marking or patterning, e.g. numbering articles · CPC title

  • combined with a final operation, e.g. shaping (injection-compression moulding B29C45/561) · CPC title

  • Housings or casings incorporating or embedding electric or electronic elements · CPC title

  • for deburring or mechanical trimming (B23K26/351 takes precedence) · CPC title

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Frequently asked questions

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What does patent US9844903B2 cover?
The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a …
Who is the assignee on this patent?
Lenovo Beijing Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/372. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).