Cooling system for power conversion device

US9844168B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9844168-B2
Application numberUS-201213566242-A
CountryUS
Kind codeB2
Filing dateAug 3, 2012
Priority dateDec 9, 2011
Publication dateDec 12, 2017
Grant dateDec 12, 2017

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  1. Title

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  5. First independent claim

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Abstract

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Disclosed is a cooling system for a conversion device that includes a heat sinking plane, a main cooling jacket, and a sub-cooling jacket. The main cooling jacket is connected with the heat sinking plane and provided with a first component disposed thereto. The sub cooling jacket is connected with the heat sinking plane on the opposite side of the main cooling jacket, and provided with a second component which generates a relatively lower amount of heat than the first component. A main inlet is disposed in the main cooling jacket for supplying coolant to the main cooling jacket, and an outlet is disposed in the sub cooling jacket for exhausting the coolant which has passed through the sub cooling jacket. A sub inlet is formed in the heat sinking plane for the coolant passing through the main cooling jacket to be supplied to the sub cooling jacket.

First claim

Opening claim text (preview).

What is claimed is: 1. A cooling system for a conversion device comprising: a heat sinking plane; a main cooling jacket connected adjacently to a first side of the heat sinking plane and provided with a first component disposed thereto, wherein the main cooling jacket and the heat sinking plane define a main cooling path therebetween; and the first component directly contacts the coolant flowing through the main cooling path; a sub cooling jacket connected adjacently to a second side of the heat sinking plane, and is provided with a second component which generates a relatively lower amount of heat than that of the first component wherein the second side of the heat sinking plane is the opposite side of the main cooling jacket, wherein the sub cooling jacket and the heat sinking plane define a sub cooling path therebetween and the second component is indirectly cooled by the coolant flow through the sub cooling jacket via the sub cooling path, wherein heat interface material is interposed between the sub cooling jacket and the second component; a main inlet disposed in the main cooling jacket supplying coolant to directly cool the first component through the main cooling path; and an outlet disposed in the sub cooling jacket exhausting the coolant to indirectly cool the second component through the sub cooling path, wherein a sub inlet is formed in the heat sinking plane to allow the coolant passing through the main cooling path to be supplied to the sub cooling path. 2. The cooling system of claim 1 , wherein an open aperture is formed to the main cooling jacket for the first component to directly contact the coolant. 3. The cooling system of claim 2 , wherein the cooling system further comprises a first cooling pin formed to protrude from the first component, wherein the first cooling pin directly contacts the coolant through the open aperture. 4. The cooling system of claim 1 , wherein the sub cooling path communicates the sub inlet with the outlet and is formed in a “U” shape. 5. The cooling system of claim 4 , wherein the sub cooling path comprises: a first space communicated with the sub inlet; and a second space communicated with the outlet. 6. The cooling system of claim 5 , wherein the sub cooling path further comprises a plurality of channels connecting the first space and the second space. 7. The cooling system of claim 6 , wherein the cooling system further comprises a turbulator formed in at least part of the plurality of channels. 8. The cooling system of claim 1 , wherein the heat interface material is a thermal pad or thermal grease. 9. The cooling system of claim 3 , wherein the cooling system further comprises a second cooling pin formed to protrude from the second component. 10. The cooling system of claim 1 , wherein the conversion device includes an inverter or a converter for a vehicle. 11. The cooling system of claim 1 , wherein: the first component comprises switching elements; and the second component comprises core elements. 12. A cooling system for a conversion device comprising: a heat sinking plane; a main cooling jacket connected with the heat sinking plane and provided with a first component disposed thereto; a sub cooling jacket connected with the heat sinking plane on the opposite side of the main cooling jacket, and provided with a second component which produces a relatively lower amount of heat than the first component, wherein heat interface material is interposed between the sub cooling jacket and the second component; a main inlet disposed in the main cooling jacket supplying coolant to the main cooling jacket; and an outlet disposed in the sub cooling jacket exhausting the coolant which has passed through the sub cooling jacket, wherein a sub inlet is formed in the heat sinking plane for the coolant passing through the main cooling jacket to be supplied to the sub cooling jacket, the main cooling jacket and the heat sinking plane define a main cooling path therebetween, the first component directly contacts the coolant flowing through the main cooling path, and the sub cooling jacket and the heat sinking plane define a sub cooling path therebetween and the second component is in indirect contact with the coolant that flow through the sub cooling jacket via the sub cooling path. 13. The cooling system of claim 12 , wherein: an open aperture is formed to the main cooling jacket for the first component to directly contact the coolant, a first cooling pin is formed to the first component, and the first cooling pin directly contacts the coolant through the open aperture. 14. The cooling system of claim 12 , wherein the sub cooling path communicates the sub inlet with the outlet and is formed in a “U” shape, wherein the sub cooling path comprises: a first space communicated with the sub inlet; and a second space communicated with the outlet. 15. The cooling system of claim 14 , wherein the sub cooling path further comprises a plurality of channels connecting the first space and the second space, wherein a turbulator is formed in at least part of the plurality of channels.

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What does patent US9844168B2 cover?
Disclosed is a cooling system for a conversion device that includes a heat sinking plane, a main cooling jacket, and a sub-cooling jacket. The main cooling jacket is connected with the heat sinking plane and provided with a first component disposed thereto. The sub cooling jacket is connected with the heat sinking plane on the opposite side of the main cooling jacket, and provided with a second…
Who is the assignee on this patent?
Jeon Wooyong, Kim Joon Hwan, Kim Minji, and 1 more
What technology area does this patent fall under?
Primary CPC classification H05K7/20927. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).