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US-11906118-B2 · Feb 20, 2024 · US
Method for producing soft magnetic film laminate circuit board
US9844147B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9844147-B2 |
| Application number | US-201414893834-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 14, 2014 |
| Priority date | May 27, 2013 |
| Publication date | Dec 12, 2017 |
| Grant date | Dec 12, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board comprising the steps of: bringing a soft magnetic thermosetting film into contact with the one side of the circuit board, wherein the soft magnetic thermosetting film contains soft magnetic particles, has a porosity of 15% or more and 60% or less, and is in a semi-cured state; and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing. 2. The method for producing a soft magnetic film laminate circuit board according to claim 1 , wherein the specific gravity of the soft magnetic thermosetting film in a cured state relative to that of the soft magnetic thermosetting film in a semi-cured state is 1.5 times or more.
Assignees
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Classifications
Using vacuum or low pressure · CPC title
Porous, e.g. foam · CPC title
for inductive purposes, e.g. printed inductor with ferrite core · CPC title
- H05K3/0058Primary
Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title
- H05K1/165Primary
incorporating printed inductors · CPC title
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- What does patent US9844147B2 cover?
- A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft …
- Who is the assignee on this patent?
- Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K3/0058. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).