Solid-state imaging apparatus

Patent metadata

Field	Value
Publication number	US-9842872-B2
Application number	US-201715443568-A
Country	US
Kind code	B2
Filing date	Feb 27, 2017
Priority date	Feb 18, 2011
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.

First claim

What is claimed is:

1. An imaging device comprising:
an image sensor;
a metal wire coupled to the image sensor;
a light shielding member configured to shield a portion of light incident from a lens; and
an optical filter attached to the light shielding member, wherein,
an edge surface of the light shielding member defines an opening,
a first end of the opening facing the image sensor has a first size that is greater than a second size of a second end of the opening facing the lens, and
the edge surface of the light shielding member has a rounded corner in a cross sectional view.

2. The imaging device according to claim 1 , further comprising a cavity structure defined by a gap between a light receiving surface of the image sensor and the optical filter.

3. The imaging device according to claim 2 , wherein the metal wire is connected from a substrate to the light receiving surface of the image sensor at a peripheral portion of the image sensor.

4. The imaging device according to claim 3 , wherein the optical filter is an infrared ray cut filter.

5. The imaging device according to claim 4 , wherein the light shielding member is made of an antireflection film.

6. The imaging device according to claim 4 , wherein the light shielding member is colored black.

7. The imaging device according to claim 4 , wherein the light shielding member is UV curable or heat curable.

8. The imaging device according to claim 4 , wherein the light shielding member includes at least one of a carbon filler, epoxy resin, acrylic resin colored black with dye, and an epoxy/acrylic hybrid resin.

9. The imaging device according to claim 4 , further comprising a bonding pad that couples the metal wire to image sensor, wherein the bonding pad is arranged on an area of the image sensor that is further away from an area defined by an intersection between a surface of the image sensor and a virtual extension surface of the edge surface of the light shielding member.

10. The imaging device according to claim 4 , further comprising: a sealing member disposed over the light receiving surface of the image sensor.

11. The imaging device according to claim 10 , wherein the sealing member is made of a transparent material that transmits light.

12. The imaging device according to claim 11 , wherein the sealing member is made of glass or resin.

13. The imaging device according to claim 1 ,
wherein the light shielding member has a first side facing the optical filter and a second side facing the image sensor, the edge surface of the light shielding member has the rounded corner on the second side in a cross sectional view, and an angle between the second side and the edge surface becomes gradually smaller toward the second side of the light shielding member.

14. The imaging device according to claim 1 ,
wherein a portion of the light shielding member overlaps at least a portion of the metal wire in a plan view.

15. The imaging device according to claim 1 ,
wherein a portion of the light shielding member overlaps at least a portion of the image sensor in a plan view.

16. The imaging device according to claim 1 ,
wherein the rounded corner of the light shielding member overlaps at least a portion of the metal wire in a plan view.

17. The imaging device according to claim 1 ,
wherein the rounded corner of the light shielding member overlaps at least a portion of the image sensor in a plan view.

18. An electronic apparatus comprising:
an imaging device comprising:
an image sensor;
a metal wire coupled to the image sensor;
a light shielding member configured to shield a portion of light incident from a lens; and
an optical filter attached to the light shielding member, wherein,
an edge surface of the light shielding member defines an opening,
a first end of the opening facing the image sensor has a first size that is greater than a second size of a second end of the opening facing the lens, and
the edge surface of the light shielding member has a rounded corner in a cross sectional view.

19. The electronic apparatus according to claim 18 , further comprising a cavity structure defined by a gap between a light receiving surface of the image sensor and the optical filter.

20. The electronic apparatus according to claim 19 , wherein the optical filter is an infrared ray cut filter.

Assignees

• Sony Corp

Inventors

• Iwafuchi Toshiaki
• Shimizu Masahiko
• Kobayashi Hirotaka

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• G02B27/0018

  with means for preventing ghost images (anti-reflection coatings G02B1/11) · CPC title

• G02B5/208

  for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation · CPC title

• H01L27/14618 Primary

  Electricity · mapped topic