Base with heat absorber and heat dissipating module having the base

Patent metadata

Field	Value
Publication number	US-9842791-B2
Application number	US-201615235116-A
Country	US
Kind code	B2
Filing date	Aug 12, 2016
Priority date	Nov 30, 2012
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

First claim

What is claimed is:

1. A base, comprising:
a heat absorber, the heat absorber comprising a top surface and a bottom surface, the heat absorber comprising a main body, a pair of top flanges extending from the main body and located adjacent to the top surface, and a pair of bottom flanges extending from the main body and located adjacent to the bottom surface, a pair of receiving grooves being defined in opposite lateral sides of the heat absorber, respectively, each receiving groove located above a level of the bottom surface and below a level of the top surface; and
two clips attached to the heat absorber, each clip comprising a positioning beam and at least one positioning block located on the positioning beam, the positioning beam being received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed to the positioning beam thereby fixing the positioning beam in the receiving groove;
wherein each receiving groove is defined between one top flange and one corresponding bottom flange;
wherein a positioning groove is defined in one of the top flange and the bottom flange, the positioning groove communicating with the receiving groove; and
wherein the at least one positioning block is fixed in the positioning groove.

2. The base of claim 1 , wherein the plurality of clips is two clips, each clip being embedded in one of the receiving grooves, each clip further comprising two fastening beams extending from two opposite ends of the positioning beam and being exposed out of the heat absorber, the clip being approximately “V” shaped.

3. A heat dissipating module, comprising:
a base, the base comprising a heat absorber and a plurality of clips attached to the heat absorber, the heat absorber comprising a top surface and a bottom surface, the heat absorber comprising a main body, a pair of top flanges extending from the main body and located adjacent to the top surface, and a pair of bottom flanges extending from the main body and located adjacent to the bottom surface, a pair of receiving grooves being defined in opposite lateral sides of the heat absorber, respectively, each receiving groove located above a level of the bottom surface and below a level of the top surface, each clip comprising a positioning beam and a positioning block located on the positioning beam, the positioning beam being received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed to the positioning beam thereby fixing the positioning beam in the receiving groove;
a fin assembly mounted on the base; two heat pipes, each heat pipe comprising an evaporation section and a condenser section, the evaporation section contacting the top surface of the heat absorber and a bottom surface of the fin assembly, the condenser section extending through and in thermal contact with the fin assembly; and
a fan attached to one end of the fin assembly;
wherein each receiving groove is defined between one top flange and one corresponding bottom flange;
wherein a positioning groove is defined in one of the top flange and the bottom flange, the positioning groove communicating with the receiving groove; and
wherein the positioning block is fixed in the positioning groove.

4. The heat dissipating module of claim 3 , wherein the plurality of clips is two clips, each clip being embedded in one of the receiving grooves, each clip further comprising two fastening beams extending from two opposite ends of the positioning beam and being exposed out of the heat absorber, the clip being approximately “V” shaped.

Assignees

• Furui Precise Component (Kunshan) Co Ltd
• Foxconn Tech Co Ltd

Inventors

• Liu Yi-Chang
• Hung Jui-Wen
• Lu jian-zhong

Classifications

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title