Electronic devices with soft input-output components

Patent metadata

Field	Value
Publication number	US-9841548-B2
Application number	US-201615068372-A
Country	US
Kind code	B2
Filing date	Mar 11, 2016
Priority date	Jun 30, 2015
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

An electronic device may have control circuitry coupled to input-output devices such as a display. A flexible input-output device may be formed from an elastomeric substrate layer. The substrate layer may have signal paths to which components are mounted. Openings may be formed in the elastomeric substrate layer between the signal paths to create a stretchable mesh-shaped substrate. The electrical components may each include an interposer having solder pads soldered to the elastomeric substrate. Electrical devices such as micro-light-emitting diodes may be soldered to the interposers. The electrical components may also include electrical devices such as sensors and actuators. A stretchable lighting unit may have a stretchable light guide illuminated by a stretchable light source.

First claim

What is claimed is:

1. Apparatus, comprising:
a stretchable substrate having a mesh shape, wherein the stretchable substrate comprises a first region having a first thickness and a second region having a second thickness, and wherein the first thickness is greater than the second thickness; and
an array of components mounted on the stretchable substrate in the first region, wherein each component has an interposer substrate and electrical devices mounted to the interposer substrate and wherein the array of components is interconnected using signal paths in the first region of the stretchable substrate.

2. The apparatus defined in claim 1 wherein the signals paths are embedded in the stretchable substrate.

3. The apparatus defined in claim 2 wherein the signal paths are formed from serpentine segments of the stretchable substrate and wherein each of the serpentine segments extends between a pair of respective components in the array of components.

4. The apparatus defined in claim 3 wherein the stretchable substrate is formed from an elastomeric polymer.

5. The apparatus defined in claim 4 wherein the components include at least some light-emitting components.

6. The apparatus defined in claim 5 wherein the electrical devices mounted to the interposer substrates in the light-emitting components comprise light-emitting diodes.

7. The apparatus defined in claim 6 wherein some of the light-emitting diodes of each light-emitting component have different colors.

8. The apparatus defined in claim 7 wherein some of the light-emitting diodes of each light-emitting component are redundant light-emitting diodes and wherein the elastomeric polymer material comprises a material selected from the group consisting of: silicone, polyurethane, and acrylic.

9. The apparatus defined in claim 7 wherein the components further comprise sensor components.

10. The apparatus defined in claim 9 wherein the electrical devices mounted to the interposer substrates in the sensor components comprise sensors selected from the group consisting of: force sensors, touch sensors, temperature sensors, and accelerometers.

11. The apparatus defined in claim 10 wherein the components further comprise actuator components.

12. The apparatus defined in claim 11 wherein the interposer in each of the components has solder pads with which the interposer is soldered to the substrate and wherein the electrical devices in each component each have solder pads that are soldered to the interposer of that component.

13. The apparatus defined in claim 7 wherein the light-emitting diodes include micro-light-emitting diodes each of which is formed from a separate semiconductor die.

14. The apparatus defined in claim 7 further comprising:
a layer of material attached to the substrate.

15. The apparatus defined in claim 7 further comprising first and second layers of material, wherein the substrate is interposed between the first and second layers of material.

16. An input-output device, comprising:
a mesh-shaped elastomeric substrate layer having an array of openings and having serpentine signal paths that extend between the openings, wherein the mesh-shaped elastomeric substrate layer has solder pads that are coupled to the serpentine signal paths and wherein the openings extend completely through the mesh-shaped elastomeric substrate layer; and
a plurality of electrical components in an array on the mesh-shaped elastomeric substrate layer, wherein each electrical component has electrical devices and has an interposer with first and second interposer solder pads, wherein the first interposer solder pads are soldered to the solder pads of the mesh-shaped elastomeric substrate layer and wherein the electrical devices are soldered to the second interposer solder pads on the interposer.

17. The input-output device defined in claim 16 wherein the electrical devices comprise micro-light-emitting diodes.

18. The input-output device defined in claim 16 further comprising additional electrical components that include sensors mounted to interposer substrates in the additional electrical components, wherein the interposers of the additional electrical components are soldered to the solder pads of the mesh-shaped elastomeric substrate layer.

19. The input-output device defined in claim 18 wherein the additional electrical components comprise electrical devices selected from the group consisting of: temperature sensors, accelerometers, force sensors, touch sensors, and actuators.

20. An electronic device, comprising:
control circuitry; and
an input-output device coupled to the control circuitry, wherein the input-output device comprises:
a mesh-shaped elastomeric substrate layer having an array of openings and having serpentine signal paths that run between and along the edges of the openings, wherein the mesh-shaped elastomeric substrate layer has solder pads that are coupled to the serpentine signal paths, wherein the mesh-shaped elastomeric substrate layer is transparent, and wherein the serpentine signal paths include transparent conductive material, and
a plurality of light-emitting electrical components arranged in an array on the elastomeric substrate layer, wherein each light-emitting electrical component has an interposer with first interposer solder pads that are soldered to the solder pads of the elastomeric substrate layer and a plurality of light-emitting diodes soldered to second interposer solder pads on the interposer.

Assignees

• Apple Inc

Inventors

• Kim Hoon Sik
• Hsu Yung-Yu
• Drzaic Paul S
• Petti Luisa

Classifications

• G02B6/0068

  Arrangements of plural sources, e.g. multi-colour light sources · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title