Polycrystalline diamond compact cutter

Patent metadata

Field	Value
Publication number	US-9840876-B2
Application number	US-201514875234-A
Country	US
Kind code	B2
Filing date	Oct 5, 2015
Priority date	Oct 6, 2014
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

The polycrystalline diamond compact cutter includes a diamond table and a carbide substrate. Different zones of the diamond table with relative thermal stability and toughness to each other are arranged for a particular cutting efficiency and working life. A thermally stable zone has a metal formation agent removed and forms a top outer ring. A base zone bonds to the carbide substrate on the bottom surface of the diamond table. An anchor zone sets between the thermally stable zone and the base zone, and an absorbing zone extends from the top surface to the base zone. The absorbing zone is circumscribed by the thermally stable zone and the anchor zone. The weight percentage metal content of the anchor zone is less than weight percentage metal content of the base zone. The weight percentage metal content of the base zone is less than weight percentage metal content of the absorbing zone.

First claim

We claim:

1. A polycrystalline diamond compact cutter, comprising:
a diamond table being comprised of polycrystalline diamond particles and a formation agent, the diamond particles being bonded to other diamond particles and said formation agent, said formation agent being a metal compound, said diamond table having a cylindrical profile with a top surface, a bottom surface, and a working edge around said top surface, said diamond table being comprised of a first portion, a second portion, a third portion, and a fourth portion; and
a carbide substrate bonded to said bottom surface of said diamond table,
wherein a thermally stable zone comprises said first portion of said diamond table, said thermally stable zone forming at least a part of said top surface so as to form said working edge,
wherein a base zone comprises said second portion of said diamond table, being bonded to said carbide substrate on said bottom surface,
wherein an anchor zone comprises said third portion of said diamond table, being positioned between said thermally stable zone and said base zone,
wherein an absorbing zone comprises said fourth portion of said diamond table, being circumscribed by said thermally stable zone and said anchor zone, extending from said top surface to said base zone, and forming at least another part of said top surface, and
wherein said thermally stable zone extends over said anchor zone and adjacent to said base zone from said top surface, said base zone attaching said anchor zone, said absorbing zone, and said thermally stable zone to said substrate,
wherein said thermally stable zone has a weight percentage metal content less than said anchor zone, said absorbing zone, and said base zone,
wherein said anchor zone has a weight percentage metal content less than said base zone,
wherein said base zone has a weight percentage metal content less than said absorbing zone, and
wherein said absorbing zone has a weight percentage metal content greater than said anchor zone, said base zone, and said thermally stable zone.

2. The polycrystalline diamond compact cutter, according to claim 1 , wherein said base zone has a weight percentage metal content less than or equal to 0.135e 1.187x , wherein x is weight percentage metal content of said anchor zone, and
wherein said absorbing zone has a weight percentage metal content less than or equal to 0.135e 1.187y , wherein y is weight percentage metal content of said base zone.

3. The polycrystalline diamond compact cutter, according to claim 1 , wherein said thermally stable zone extends downward from said top surface more than 500 micrometers.

4. The polycrystalline diamond compact cutter, according to claim 1 , wherein said thermally stable zone extends downward from said top surface less than or equal to 60% of a distance between said top surface and said bottom surface of said diamond table.

5. The polycrystalline diamond compact cutter, according to claim 1 , wherein said thermally stable zone circumscribes said absorbing zone along said working edge, and
wherein said thermally stable zone extends inward from said working edge at least 25% of a diameter of said diamond table.

6. The polycrystalline diamond compact cutter, according to claim 1 , wherein said anchor zone has a ring shape, being placed between said thermally stable zone and said base zone and around said absorbing zone.

7. The polycrystalline diamond compact cutter, according to claim 1 , wherein said absorbing zone is a centered over said base zone.

8. The polycrystalline diamond compact cutter, according to claim 1 , wherein said absorbing zone is surrounded by said thermally stable zone at said top surface.

9. The polycrystalline diamond compact cutter, according to claim 1 , wherein said absorbing zone abuts said thermally stable zone at an inclined face.

10. The polycrystalline diamond compact cutter, according to claim 9 , wherein said inclined face slants downward from said top surface.

11. The polycrystalline diamond compact cutter, according to claim 1 , wherein said absorbing zone is surrounded by said anchor zone beneath said top surface.

12. The polycrystalline diamond compact cutter, according to claim 1 , wherein said absorbing zone ends before at least 25% of a diameter of said diamond table.

13. A polycrystalline diamond compact cutter, comprising:
a diamond table being comprised of polycrystalline diamond particles and a formation agent, the diamond particles being bonded to other diamond particles and said formation agent, said formation agent being a metal compound, said diamond table having a cylindrical profile with a top surface, a bottom surface, and a working edge around said top surface, said diamond table being comprised of a first portion, a second portion, a third portion, and a fourth portion; and
a carbide substrate bonded to said bottom surface of said diamond table,
wherein a thermally stable zone comprises said first portion of said diamond table, said thermally stable zone forming at least a part of said top surface so as to form said working edge,
wherein a base zone comprises said second portion of said diamond table, being bonded to said carbide substrate on said bottom surface,
wherein an anchor zone comprises said third portion of said diamond table, being positioned between said thermally stable zone and said base zone,
wherein an absorbing zone comprises said fourth portion of said diamond table, being circumscribed by said thermally stable zone and said anchor zone, extending from said top surface to said base zone, and forming at least another part of said top surface,
wherein said thermally stable zone has a weight percentage metal content less than said anchor zone, said absorbing zone, and said base zone,
wherein said anchor zone has a weight percentage metal content less than said base zone,
wherein said base zone has a weight percentage metal content less than said absorbing zone, and
wherein said absorbing zone has a weight percentage metal content greater than said anchor zone, said base zone, and said thermally stable zone.

14. The polycrystalline diamond compact cutter, according to claim 13 , wherein base zone has a weight percentage metal content less than or equal to 0.135e 1.187x , wherein x is weight percentage metal content of said anchor zone, and
wherein said absorbing zone has a weight percentage metal content less than or equal to 0.135e 1.187y , wherein y is weight percentage metal content of said base zone.

15. The polycrystalline diamond compact cutter, according to claim 13 , wherein said thermally stable zone extends over said anchor zone and adjacent to said base zone from said top surface, said base zone attaching said anchor zone, said absorbing zone, and said thermally stable zone to said substrate.

16. The polycrystalline diamond compact cutter, according to claim 15 , wherein said anchor zone has a ring shape, being placed between said thermally stable zone and said base zone and around said absorbing zone.

17. The polycrystalline diamond compact cutter, according to claim 13 , wherein said thermally stable zone circumscribes said absorbing zone along said working edge, and
wherein said anchor zone circumscribes said absorbing zone, and
wherein said absorbing zone is surrounded by said thermally stable zone at said top surface.

18. The polycrystalline diamond compact cutter, according to claim 13 , wherein an amount of difference of weight percentage metal content between said base zone and said absorbing zone is greater than difference of weight percent

Assignees

• Cnpc Usa Corp

Inventors

• Zhao Liang
• Cheng Xiaomin
• Li Ning

Classifications

• C22C26/00

  Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

• E21B10/573 Primary

  characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element · CPC title