Method of fabricating improved porous metallic material and resulting structure thereof
US-2015184309-A1 · Jul 2, 2015 · US
US9840789B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9840789-B2 |
| Application number | US-201414159270-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 20, 2014 |
| Priority date | Jan 20, 2014 |
| Publication date | Dec 12, 2017 |
| Grant date | Dec 12, 2017 |
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A nanoporous metal structure is made by etching a metal alloy structure of two or more metals. Less than all of the metals are selectively removed (e.g., dissolved in solution) from the alloy in the presence of an alternating voltage profile, for example, a periodic voltage profile. The resulting nanoporous metal structure, having pore openings of about 20 nm to about 500 nm in diameter and a purity of at least about 70%, can be further treated to alter some or all of the structure, and/or to add, remove and/or modify properties thereof.
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The invention claimed is: 1. A method, comprising: providing an alloy structure of at least two materials; and etching the alloy structure by selectively removing at least one and less than all of the at least two materials from the alloy structure in the presence of an alternating voltage profile, wherein the etching comprises forming a plurality of pores in the alloy structure with openings of about 20 nm to about 500 nm in diameter and a purity of a remainder of the alloy structure after the etching of at least about 70 percent for at least one remaining material of the at least two materials. 2. The method of claim 1 , wherein the alloy structure comprises a metal alloy structure, wherein the at least two materials comprise at least two metals, and wherein the etching creates a nanoporous metal structure. 3. The method of claim 2 , wherein the at least two metals comprise at least two of tungsten, tin, iron, nickel, gold, silver, copper and platinum. 4. The method of claim 3 , wherein the at least two metals comprise nickel and copper. 5. The method of claim 1 , wherein the alternating voltage profile comprises a periodic voltage profile. 6. The method of claim 2 , wherein the providing comprises: providing a solution of at least two metal salts; and generating the metal alloy structure from the solution. 7. The method of claim 2 , wherein the selectively removing comprises using an electrochemical process. 8. The method of claim 1 , wherein selectively removing comprises selectively dissolving the one or more metals in a solution. 9. The method of claim 2 , wherein the metal alloy structure comprises a film. 10. The method of claim 2 , further comprising treating the nanoporous metallic structure to add, remove and/or modify one or more properties thereof. 11. The method of claim 10 , wherein the treating comprises causing one or more chemical species to attach to a surface of the nanoporous metallic structure. 12. The method of claim 10 , wherein the treating comprises at least partially filling at least one pore of the nanoporous metallic structure with one or more materials. 13. The method of claim 12 , wherein the one or more materials comprises at least one pharmaceutical. 14. The method of claim 10 , wherein the treating comprises heating in a predetermined atmosphere to effect a chemical reaction on a surface of the nanoporous metallic structure. 15. The method of claim 14 , wherein the predetermined atmosphere comprises oxygen to create a metal oxide on the surface. 16. The method of claim 10 , wherein the treating comprises coating a surface of the nanoporous metallic structure with one or more materials. 17. The method of claim 16 , wherein the treating comprises electrodeposition. 18. The method of claim 16 , wherein the treating comprises electroless plating. 19. The method of claim 2 , wherein the providing comprises providing the metal alloy structure on a substrate. 20. The method of claim 19 , further comprising separating the nanoporous metallic structure from the substrate. 21. The method of claim 20 , further comprising using the separated nanoporous metallic structure as a film. 22. The method of claim 19 , wherein the substrate has a non-uniform surface on which the metal alloy structure is provided.
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