Epoxy resin with enhanced viscosity stability and use thereof

US9840646B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9840646-B2
Application numberUS-201514918660-A
CountryUS
Kind codeB2
Filing dateOct 21, 2015
Priority dateAug 22, 2011
Publication dateDec 12, 2017
Grant dateDec 12, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).

First claim

Opening claim text (preview).

The invention claimed is: 1. A manufacturing method comprising applying an epoxy adhesive between two components; bonding the two components by partially curing the epoxy adhesive in a first curing stage to obtain a partially cured article; aging the partially cured article; and curing the partially cured article in a second curing stage, wherein the epoxy adhesive comprises: a) 10 to 50 wt % of a toughener composition wherein the toughener is a reaction product produced by mixing polytetrahydrofuran, bisphenol A, trimethylolpropane, heating the resulting mixture to dissolve the bisphenol A, cooling the mixture and adding a diisocyanate and then adding an organometallic catalyst and polymerizing, wherein the amount of the bisphenol A is greater than 10% and less than 15 wt % based on the combined weight of the polytetrahydrofuran, bisphenol A, trimethylolpropane, diisocyanate and organometallic catalyst; b) an epoxy resin; c) a rubber comprising an epoxy resin modified carboxyl terminated butadiene/acrylonitrile copolymer; d) a curing agent comprising a dicyandiamide; and e) an accelerator comprising a tertiary amine. 2. The manufacturing method of claim 1 wherein the epoxy adhesive comprises 20-30 wt % of the toughener composition based on total weight of the epoxy adhesive. 3. The manufacturing method of claim 1 , wherein the epoxy adhesive further comprises at least one of a filler, a thixotropic agent, a viscosity regulator, an adhesion promoter, a surfactant, a wetting agent, a flexibilized epoxy agent, a gelling compound, a flame retardant, a pigment.

Assignees

Inventors

Classifications

  • Ureas; Thioureas; Guanidines; Dicyandiamides · CPC title

  • with compounds of group C08G18/3203 · CPC title

  • Application of adhesive · CPC title

  • containing aromatic groups or benzoquinone groups · CPC title

  • Multi-component adhesives, i.e. chemically curing as a result of the mixing of said multi-components · CPC title

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What does patent US9840646B2 cover?
The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).