Conductive paste and multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-9840433-B2
Application number	US-201514886304-A
Country	US
Kind code	B2
Filing date	Oct 19, 2015
Priority date	Apr 25, 2013
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

A conductive paste for forming external electrodes for a multilayer ceramic electronic component. The paste contains a glass composition containing (a) BaO, (b) at least one of SrO and CaO, (c) ZnO, (d) B 2 O 3 , and (e) at least one selected from the group consisting of SiO 2 , Al 2 O 3 , and TiO 2 , in which the total content percentage of BaO, SrO, and CaO is 30 mol % or more, the molar ratio represented by B 2 O 3 /(SiO 2 +Al 2 O 3 +TiO 2 ) is 0.7 to 1.5, and the content percentage of ZnO is 0 to 5 mol %.

First claim

The invention claimed is:

1. A conductive paste comprising:
a conductive component; and
a glass composition that contains:
(a) BaO;
(b) at least one of SrO and CaO;
(c) ZnO;
(d) B 2 O 3 ; and
(e) at least one selected from the group consisting of SiO 2 , Al 2 O 3 , and TiO 2 , wherein
a total content percentage of BaO, SrO, and CaO is 44.9 mol % or more with respect to a total amount of the glass composition in the conductive paste,
a molar ratio represented by B 2 O 3 /(SiO 2 +Al 2 O 3 +TiO 2 ) is 0.7 to 1.5, and
a content percentage of ZnO is 0 to 5 mol % with respect to the total amount of the glass composition in the conductive paste.

2. The conductive paste according to claim 1 , wherein the molar ratio represented by B 2 O 3 /(SiO 2 +Al 2 O 3 +TiO 2 ) is 0.7 to 1.0.

3. The conductive paste according to claim 1 , wherein the glass composition contains 20 mol % or more of B 2 O 3.

4. The conductive paste according to claim 2 , wherein the glass composition contains 20 mol % or more of B 2 O 3 .

5. The conductive paste according to claim 1 , further comprising a total of 1 mol % or less of one or more of Li 2 O, Na 2 O, K 2 O, MgO, MnO, CoO, NiO, CuO, SnO 2 , and ZrO 2 .

6. The conductive paste according to claim 1 , wherein the conductive component has an average particle size of 3 to 4 μm.

7. A multilayer ceramic electronic component comprising:
a ceramic body having a plurality of alternately stacked dielectric layers and internal electrode layers; and
an external electrode formed from the conductive paste according to claim 1 applied to a surface of the ceramic body.

8. The multilayer ceramic electronic component according to claim 7 , further comprising a Ni plating film on the external electrode.

9. The multilayer ceramic electronic component according to claim 8 , further comprising an Sn plating film on the Ni plating film.

Assignees

• Murata Manufacturing Co

Inventors

• Miyazaki Tomochika

Classifications

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• C03C8/18

  containing free metals · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/008

  Selection of materials · CPC title

• C03C3/064

  containing boron · CPC title