Assembly and method for transfer molding

Patent metadata

Field	Value
Publication number	US-9840432-B2
Application number	US-201415029322-A
Country	US
Kind code	B2
Filing date	Oct 14, 2014
Priority date	Oct 14, 2013
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

One exemplary embodiment of this disclosure relates to a transfer molding assembly. The assembly includes a die having a molding cavity interconnected with a reservoir. The assembly further includes a heater operable to heat the die, and a load plate configured to move under its own weight to transfer material from the reservoir into the molding cavity.

First claim

What is claimed is:

1. A transfer molding assembly, comprising:
a die including a molding cavity interconnected with a reservoir;
a heater operable to heat the die;
a load plate configured to move under its own weight to transfer material from the reservoir into the molding cavity;
a control rod; and
an injection ram configured to translate along the reservoir under the weight of the load plate, the control rod supporting the load plate above the injection ram before the heater softens the control rod.

2. The assembly as recited in claim 1 , wherein the material received in the reservoir is a first material, and wherein the control rod is made of a second material different than the first material.

3. The assembly as recited in claim 2 , wherein the heater is configured to heat the first material to a transfer molding point before the second material reaches the transfer molding point.

4. The assembly as recited in claim 3 , wherein the heater is configured to heat the first material to a transfer molding point before the second material reaches a working point.

5. The assembly as recited in claim 4 , wherein the heater is configured to heat the first material to a transfer molding point before the second material reaches a softening point.

6. The assembly as recited in claim 2 , wherein the first material and the second material are glass-based materials.

7. The assembly as recited in claim 2 , wherein the first material has a lower viscosity than the second material at a first temperature.

8. A method of transfer molding, comprising:
heating a first material such that the material softens and is injected into a preform under the weight of a load plate: and
supporting the load plate with a control rod, and releasing at least a portion of the weight of the load plate in response to the first material reaching a predefined temperature, wherein the control rod is made of a second material configured to soften at a higher temperature than the first material.

9. The method as recited in claim 8 , wherein the first material and the second material are glass-based materials.

10. The method as recited in claim 8 , wherein the first material has a viscosity at or below 10 2.6 poises at a temperature of about 1500° C., and wherein the second material has a viscosity above 10 2.6 poises at a temperature of about 1500° C.

11. The method as recited in claim 10 , wherein, at a temperature of about 1500° C., the second material has a viscosity of about 10 7.6 poises.

Assignees

• United Technologies Corp

Inventors

• Jarmon David C

Classifications

• C03B19/02

  by casting {molten glass, e.g. injection moulding} · CPC title

• B28B3/025

  Hot pressing, e.g. of ceramic materials · CPC title

• C03B2201/02

  Pure silica glass, e.g. pure fused quartz · CPC title

• C03B19/025 Primary

  by injection moulding, e.g. extrusion · CPC title

• C03B2201/10

  doped with boron (C03B2201/14 takes precedence) · CPC title