Crash-durable adhesive with enhanced stress durability

US9840070B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9840070-B2
Application numberUS-201314368910-A
CountryUS
Kind codeB2
Filing dateMar 22, 2013
Priority dateMar 23, 2012
Publication dateDec 12, 2017
Grant dateDec 12, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl-or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat-curable structural adhesive comprising: A) 34.56 to 41 weight percent, based on the total weight of the heat-curable structural adhesive, of at least one diglycidyl ether of bisphenol A having an epoxy equivalent weight of about 186; B) 23.8 to 26.5 weight percent, based on the total weight of the heat-curable structural adhesive, of a reaction product of 19.6% of a carboxyl-terminated copolymer of butadiene and acrylonitrile, the copolymer of butadiene and acrylonitrile having a number average molecular weight of 2000 to 6000 and 70.2% of a diglycidyl ether of bisphenol F having an epoxy equivalent weight of about 180 which reaction product is further diluted with 10.2% of a diglycidyl ether of bisphenol A having an epoxy equivalent weight of 1600 to 2000; C) at least one elastomeric toughener containing isocyanate groups capped with phenol; D) 4 to 5.1 weight percent, based on the total weight of the heat-curable structural adhesive, dicyandiamide; E) 3 to 4 weight percent of calcium oxide, based on the total weight of the heat-curable structural adhesive; F) a heat activatable catalyst comprising a mixture of 2,4,6-tris(dimethylaminomethyl)phenol and a novolac resin, G) 0.1 to 0.2 weight percent, based on the total weight of the heat-curable structural adhesive, of a blocked diethylene triamine catalyst; H) 0 to 14.8 weight percent, based on the total weight of the heat-curable structural adhesive, of a flame retardant; I) 4 to 12.7 weight percent, based on the total weight of the heat-curable structural adhesive, of at least one inorganic filler; J) a surfactant; and K) a colorant and further wherein the elastomeric toughener and the rubber portion of component B) together constitute from 16.8 to 17.2% of the total weight of the heat-curable adhesive, and the cured adhesive exhibits a storage modulus of at least 900 MPa at 50° C. as measured by dynamic mechanical analysis according to ASTM E2254-09 and withstands at least 45 cycles of the environmental aging under stress test after curing for 10 minutes at 160° C. 2. A method for bonding an aluminum member to a second metal member, comprising forming a layer of a heat-curable structural adhesive of claim 1 between and in contact with the aluminum member and the second metal member to form an assembly and then heating the assembly including the structural adhesive at a temperature of at least 120° C. up to 170° C. to cure the structural adhesive and form an adhesive bond between the aluminum member and the second metal member. 3. A heat-curable structural adhesive comprising: A) 41 weight percent, based on the total weight of the heat-curable structural adhesive, of at least one diglycidyl ether of bisphenol A having an epoxy equivalent weight of about 186; B) 23.8 weight percent, based on the total weight of the heat-curable structural adhesive, of a reaction product of 19.6% of a carboxyl-terminated copolymer of butadiene and acrylonitrile, the copolymer of butadiene and acrylonitrile having a number average molecular weight of 2000 to 6000 and 70.2% of a diglycidyl ether of bisphenol F having an epoxy equivalent weight of about 180 which reaction product is further diluted with 10.2% of a diglycidyl ether of bisphenol A having an epoxy equivalent weight of 1600 to 2000; C) 12 weight percent, based on the total weight of the heat-curable structural adhesive, of at least one elastomeric toughener containing isocyanate groups capped with phenol; D) 5.1 weight percent, based on the total weight of the heat-curable structural adhesive, of dicyandiamide; E) 4 weight percent of calcium oxide, based on the total weight of the heat-curable structural adhesive; F) 0.6 weight percent, based on the total weight of the heat-curable structural adhesive, of a heat activatable catalyst comprising a mixture of 2,4,6-tris(dimethylaminomethyl)phenol and a novolac resin, G) 0.2 weight percent, based on the total weight of the heat-curable structural adhesive, of a blocked diethylene triamine catalyst; H) 12.7 weight percent, based on the total weight of the heat-curable structural adhesive, of at least one inorganic filler; I) a surfactant; and J) a colorant and further wherein the elastomeric toughener and the rubber portion of component B) together constitute 16.8% of the total weight of the heat-curable adhesive, and the cured adhesive exhibits a storage modulus of at least 900 MPa at 50° C. as measured by dynamic mechanical analysis according to ASTM E2254-09 and withstands at least 45 cycles of the environmental aging under stress test after curing for 10 minutes at 160° C. 4. A method for bonding an aluminum member to a second metal member, comprising forming a layer of a heat-curable structural adhesive of claim 3 between and in contact with the aluminum member and the second metal member to form an assembly and then heating the assembly including the structural adhesive at a temperature of at least 120° C. up to 170° C. to cure the structural adhesive and form an adhesive bond between the aluminum member and the second metal member. 5. A heat-curable structural adhesive comprising: A) 34.56 weight percent, based on the total weight of the heat-curable structural adhesive, of at least one diglycidyl ether of bisphenol A having an epoxy equivalent weight of about 186; B) 26.5 weight percent, based on the total weight of the heat-curable structural adhesive, of a reaction product of 19.6% of a carboxyl-terminated copolymer of butadiene and acrylonitrile, the copolymer of butadiene and acrylonitrile having a number average molecular weight of 2000 to 6000 and 70.2% of a diglycidyl ether of bisphenol F having an epoxy equivalent weight of about 180 which reaction product is further diluted with 10.2% of a diglycidyl ether of bisphenol A having an epoxy equivalent weight of 1600 to 2000; C) 12 weight percent, based on the total weight of the heat-curable structural adhesive, of at least one elastomeric toughener containing isocyanate groups capped with phenol; D) 4 weight percent, based on the total weight of the heat-curable structural adhesive, of dicyandiamide; E) 3 weight percent of calcium oxide, based on the total weight of the heat-curable structural adhesive; F) 0.7 weight percent, based on the total weight of the heat-curable structural adhesive, of a heat activatable catalyst comprising a mixture of 2,4,6-tris(dimethylaminomethyl)phenol and a novolac resin, G) 0.1 weight percent, based on the total weight of the heat-curable structural adhesive, of a blocked diethylene triamine catalyst; H) 14.8 weight percent, based on the total weight of the heat-curable structural adhesive, of a flame retardant; I) 4 weight percent, based on the total weight of the heat-curable structural adhesive, of at least one inorganic filler; J) a surfactant; and K) a colorant and further wherein the elastomeric toughener and the rubber portion of component B) together constitute 17.2% of the total weight of the heat-curable adhesive, and the cured adhesive exhibits a storage modulus of at least 900 MPa at 50° C. as measured by dynamic mechanical analysis according to ASTM E2254-09 and withstands at least 45 cycles of the environmental aging under stress test after curing for 10 minutes at 160° C. 6. A method for bonding an aluminum member to a second metal member, comprising forming a layer of a heat-curable structural adhesive of claim 5 between and in contact with the aluminum member and the second metal member to form an assembly and then heating the assembly including the structural adhesive at a temperature of at least 120° C. up to 170° C. to cure the structural adhesive and form an adhesive bond between the aluminum member and the second metal member.

Assignees

Inventors

Classifications

  • Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • phenolic compounds · CPC title

  • Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step · CPC title

  • Designing, manufacturing, e.g. assembling, facilitating disassembly, or structurally modifying motor vehicles or trailers, not otherwise provided for · CPC title

  • Temperature · CPC title

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What does patent US9840070B2 cover?
A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl-or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary …
Who is the assignee on this patent?
Jialanella Gary L, Eagle Glenn G, Ren Dakai, and 2 more
What technology area does this patent fall under?
Primary CPC classification C08G18/8067. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).