Resin mold

US9840038B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9840038-B2
Application numberUS-201414251474-A
CountryUS
Kind codeB2
Filing dateApr 11, 2014
Priority dateApr 11, 2013
Publication dateDec 12, 2017
Grant dateDec 12, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Described is a resinous structure derived from fluorine-containing polymers useful as a mold having excellent dimensional stability.

First claim

Opening claim text (preview).

What is claimed is: 1. A resin mold comprising: a first surface where a plurality of first portions and a plurality of second portions are formed; and a second surface, wherein the resin mold is constituted of a first resin having a plurality of carbon-fluorine bonds, wherein the first resin is formed of a composition including a polymerizable constituent A1 having a unit represented by the following formula (a1) and a polymerizable constituent A2 having a unit represented by the 2. The resin mold of claim 1 , wherein a concentration of fluorine atom included in the first resin is greater than or equal to 20 wt %. 3. The resin mold of claim 1 , wherein a concentration of fluorine atom in the first resin is less than or equal to 76 wt %. 4. The resin mold of claim 3 , wherein the concentration of fluorine atom is greater than or equal to 24.8 wt %. 5. The resin mold of claim 1 , wherein a concentration of fluorine atom in the first resin is less than or equal to 32.1 wt %. 6. A method of using the resin mold of claim 1 to manufacture a plurality of components having a concavo-convex pattern, the method comprising: providing the resin mold with a concavo-convex surface; and repeating transfer printings from the resin mold to manufacture the plurality of components having a concavo-convex pattern.

Assignees

Inventors

Classifications

  • Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372) · CPC title

  • forming a microstructure, i.e. fine patterning · CPC title

  • Lithographic printing · CPC title

  • B29C59/022Primary

    characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title

  • having specific surface shape, e.g. grooves, projections, corrugations · CPC title

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Frequently asked questions

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What does patent US9840038B2 cover?
Described is a resinous structure derived from fluorine-containing polymers useful as a mold having excellent dimensional stability.
Who is the assignee on this patent?
Toyo Gosei Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C59/022. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 12 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).