Forming white metal oxide films by oxide structure modification or subsurface cracking

Patent metadata

Field	Value
Publication number	US-9839974-B2
Application number	US-201414261060-A
Country	US
Kind code	B2
Filing date	Apr 24, 2014
Priority date	Nov 13, 2013
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

The embodiments described herein relate to forming white appearing metal oxide films by forming cracks within the metal oxide films. In some embodiments, the methods involve directing a laser beam at a metal oxide film causing portions of the metal oxide film to melt, cool, contract, and crack. The cracks have irregular surfaces that can diffusely reflect visible light incident a top surface of the metal oxide film, thereby imparting a white appearance to the metal oxide film. In some embodiments, the cracks are formed beneath a top surface of a metal oxide film, thereby leaving a continuous and uninterrupted metal oxide film top surface.

First claim

What is claimed is:

1. A method of forming an anodic film on a part, the method comprising:
forming a mirror finish on a substrate surface of a metal substrate;
forming the anodic film on the metal substrate, the anodic film having a first surface adjacent the substrate surface and a second surface opposite the first surface, wherein the mirror finish of the substrate surface is visible through the anodic film; and
forming clusters of cracks, wherein the clusters of cracks are equidistantly spaced apart and embedded within the anodic film between the first and second surfaces, and wherein visible light incident at the second surface of the anodic film diffusely reflects off the cracks within the clusters, thereby imparting a white appearance to the anodic film.

2. The method of claim 1 , wherein forming the clusters of cracks comprises:
directing a laser beam at the second surface of the anodic film such that a depth of focus of the laser beam is positioned entirely beneath the second surface of the anodic film.

3. The method of claim 2 , wherein forming the clusters of cracks further comprises:
directing the laser beam at the second surface such that the depth of focus of the laser beam is positioned below the substrate surface, thereby causing the laser beam to reflect off the substrate surface and focus within the anodic film.

4. The method of claim 1 , wherein forming the clusters of cracks includes melting metal oxide material present within the clusters of cracks.

5. The method of claim 1 , wherein a pitch between the clusters of cracks is between about 1 micrometer to about 10 micrometers.

6. The method of claim 1 , wherein a pitch between the clusters of cracks is about twice a diameter of each cluster of the clusters of cracks.

7. The method of claim 1 , wherein each of the clusters of cracks are positioned at different depths beneath the second surface.

8. The method of claim 1 , wherein each of the clusters of cracks have a diameter that is between about 1 micrometer and about 5 micrometers.

9. A part comprising:
a metal substrate having a substrate surface with a mirror finish; and
an anodic film disposed on the metal substrate, the anodic film having a first surface adjacent the substrate surface and a second surface opposite the first surface, wherein the mirror finish of the substrate surface is visible through the anodic film; and
clusters of cracks embedded within the anodic film and between the first and second surfaces, the clusters of cracks being equidistantly spaced apart, wherein visible light incident at the second surface diffusely reflects off the cracks within the clusters, thereby imparting a white appearance to the anodic film.

10. The part of claim 9 , wherein the clusters of cracks include crystalline metal oxide material.

11. The part of claim 9 , wherein a pitch between the clusters of cracks is between about 1 micrometer to about 10 micrometers.

12. The part of claim 9 , wherein a pitch between the clusters of cracks is about twice a diameter of each cluster of the clusters of cracks.

13. The part of claim 9 , wherein at least some of the clusters of cracks are embedded at different depths within the anodic film.

14. The part of claim 9 , wherein each of the clusters of cracks have irregular surfaces that diffusely reflect the visible light.

15. An enclosure for an electronic device, comprising:
a metal substrate having a substrate surface with a mirror finish; and
an anodic film disposed on the metal substrate, the anodic film having a bottom surface adjacent to the substrate surface, and a top surface opposite from the bottom surface, wherein the mirror finish of the substrate surface is visible through the anodic film; and
clusters of cracks embedded within the anodic film, wherein the clusters of cracks are equidistantly spaced apart from each other, and wherein visible light incident at the top surface diffusely reflects off the clusters of cracks, thereby imparting a white appearance to the anodic film.

16. The enclosure of claim 15 , wherein a pitch between the clusters of cracks is about twice a diameter of each cluster of the clusters of cracks.

17. The enclosure of claim 15 , wherein a pitch between the clusters of cracks is between about 1 micrometer to about 10 micrometers.

18. The enclosure of claim 15 , wherein each of the clusters of cracks have a diameter that is between about 1 micrometer and about 5 micrometers.

19. The enclosure of claim 15 , wherein at least some of the clusters of cracks are embedded at different depths within the anodic film.

20. The enclosure of claim 15 , wherein the clusters of cracks include crystalline metal oxide material.

Assignees

• Apple Inc

Inventors

• Mcdonald Daniel T
• Nashner Michael S
• Russell-Clarke Peter N
• Tatebe Masashige

Classifications

• B23K26/53

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• C25D11/04

  of aluminium or alloys based thereon · CPC title

• C25D11/18 Primary

  After-treatment, e.g. pore-sealing · CPC title

• Y10T428/24471

  Crackled, crazed or slit · CPC title

• B23K26/354 Primary

  by melting · CPC title