Prosthetic component having a compliant surface

Patent metadata

Field	Value
Publication number	US-9839390-B2
Application number	US-201414154011-A
Country	US
Kind code	B2
Filing date	Jan 13, 2014
Priority date	Jun 30, 2009
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

A prosthetic component suitable for long-term implantation is provided. The prosthetic component measures a parameter of the muscular-skeletal system is disclosed. The prosthetic component comprises a first structure having at least one support surface, a second structure having at least one feature configured to couple to bone, and at least one sensor. The prosthetic component is a housing for the at least one sensor and electronic circuitry. The electronic circuitry is hermetically sealed from an external environment. The at least one sensor couples to the support surface of the first structure. The support surface of the first structure is compliant. The first and second structure are coupled together housing the at least one sensor and electronic circuitry.

First claim

What is claimed is:

1. A prosthetic component configured to measure load and position of load applied by the muscular-skeletal system comprising:
a first support structure;
electronic circuitry wherein the electronic circuitry is configured to control a measurement process and to transmit measurement data;
a plurality of load sensors;
an interconnect coupling the plurality of sensors to the electronic circuitry;
a second support structure coupled to the first support structure to form a hermetically sealed housing to isolate the electronic circuitry and the plurality of load sensors from an external environment wherein the plurality of sensors are integrated with the interconnect, and wherein the plurality of load sensors are configured to measure a load magnitude and position of load applied to the prosthetic component; and
a rigid load plate having a first surface and a second surface wherein the first surface of the rigid load plate is coupled to an interior surface of the second support structure, wherein the second surface of the rigid load plate couples to the plurality of load sensors, and wherein a portion of the interconnect is between the second surface of the rigid load plate and a first surface of the first support structure.

2. The prosthetic component of claim 1 wherein the interconnect comprises two or more dielectric layers and two or more patterned conductive layers.

3. The prosthetic component of claim 2 wherein at least one dielectric layer comprises polyimide.

4. The prosthetic component of claim 1 wherein a shield is formed in the interconnect to shield the plurality of load sensors or the interconnect.

5. The prosthetic component of claim 1 wherein the plurality of load sensors are elastically compressible capacitors.

6. The prosthetic component of claim 1 further including a load pad formed overlying each load sensor of the plurality of load sensors wherein the load pad does not compress under loading.

7. The prosthetic component of claim 6 wherein the load pad is conductive.

8. The prosthetic component of claim 6 wherein a surface of each load pad is approximately co-planar and couple to the second support structure.

9. A prosthetic component for the muscular-skeletal system comprising:
a first support structure;
electronic circuitry wherein the electronic circuitry is configured to control a measurement process and to transmit measurement data;
a plurality of sensors;
interconnect coupling the plurality of sensors to the electronic circuitry wherein the interconnect is flexible and comprises at least one polyimide dielectric layer;
a second support structure coupled to the first support structure to form a sealed housing to isolate the electronic circuitry and the plurality of sensors from an external environment wherein the plurality of sensors are integrated with the interconnect, and wherein the plurality of sensors are configured to measure a parameter; and
a rigid load plate having a first surface and a second surface wherein the first surface of the rigid load plate is coupled to an interior surface of the second support structure, wherein the second surface of the rigid load plate couples to the plurality of load sensors, and wherein a portion of the interconnect is between the second surface of the rigid load plate and a first surface of the first support structure.

10. The prosthetic component of claim 9 wherein the interconnect comprises two or more dielectric layers and two or more patterned conductive layers.

11. The prosthetic component of claim 9 wherein the interconnect comprises at least two dielectric layers of polyimide.

12. The prosthetic component of claim 9 wherein a shield is formed in the interconnect to shield the plurality of sensors or the interconnect.

13. The prosthetic component of claim 9 further including a load pad formed overlying each load sensor of the plurality of sensors wherein the load pad is non-compressible.

14. A tibial prosthetic component
a first support structure configured to couple to an insert;
electronic circuitry wherein the electronic circuitry is configured to control a measurement process and to transmit measurement data;
a plurality of load sensors;
interconnect coupling the plurality of load sensors to the electronic circuitry;
a second support structure configured to couple to a tibia wherein the second support structure is coupled to the first support structure to form a hermetically sealed housing to isolate the electronic circuitry and the plurality of load sensors from an external environment wherein the plurality of load sensors are integrated with the interconnect, and wherein the plurality of load sensors are configured to measure a parameter;
a rigid load plate having a first surface and a second surface wherein the first surface of the rigid load plate is coupled to an interior surface of the second support structure, wherein the second surface of the rigid load plate couples to the plurality of load sensors, and wherein a portion of the interconnect is between the second surface of the rigid load plate and a first surface of the first support structure;
a load pad formed overlying each load sensor of the plurality of load sensors wherein the load pad is non-compressible.

15. The tibial prosthetic component of claim 14 wherein the interconnect comprises two or more dielectric layers and two or more patterned conductive layers.

16. The tibial prosthetic component of claim 14 wherein at least one dielectric layer comprises polyimide.

17. The tibial prosthetic component of claim 14 wherein a shield is formed in the interconnect to shield the plurality of load sensors or the interconnect.

Assignees

• Orthosensor Inc
• Orthosensor Inc

Inventors

• Stein Marc
• Chase Andrew

Classifications

• A61B2562/0252

  Load cells · CPC title

• A61B5/1036

  Measuring load distribution, e.g. podologic studies · CPC title

• A61B5/4585

  Evaluating the knee · CPC title

• A61B5/7225

  Details of analogue processing, e.g. isolation amplifier, gain or sensitivity adjustment, filtering, baseline or drift compensation (input circuits for detecting, measuring, or recording bioelectric or biomagnetic signals A61B5/30; specific diagnostic methods using bioelectric or biomagnetic signals A61B5/316) · CPC title

• A61B5/4509

  Bone density determination · CPC title