Burn-in socket for packaged integrated circuits

Patent metadata

Field	Value
Publication number	US-9837747-B2
Application number	US-201615273818-A
Country	US
Kind code	B2
Filing date	Sep 23, 2016
Priority date	Mar 23, 2016
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

An integrated circuit burn-in socket with a spring-loaded contact pin built into the socket base and an electrical receptacle built into the socket lid wherein the electrical receptacle is configured to mate with the spring-loaded contact pin when the burn-in socket is closed. In one implementation, the socket lid is separate from the socket base and with a spring-loaded contact pin built into the socket base and with an electrical receptacle built into the socket lid wherein the electrical receptacle is configured to mate with the spring-loaded contact pin when the socket lid is clamped to the socket base.

First claim

What is claimed is:

1. An integrated circuit socket, comprising:
a socket base;
a socket lid;
a spring-loaded contact pin built into the socket base;
an electrical receptacle built into the socket lid and configured to mate with the spring-loaded contact pin when the socket base contacts the socket lid; and
a heater mounted on the socket lid wherein the heater is electrically coupled to the electrical receptacle.

2. The integrated circuit socket of claim 1 , further comprising an integrated circuit socket in the socket base wherein the heater contacts a top surface of a packaged integrated circuit when the packaged integrated circuit is plugged into the integrated circuit socket and the burn-in socket is closed.

3. An integrated circuit socket, comprising:
a socket base;
a socket lid;
a hinge connecting the socket lid to the socket base;
a spring-loaded contact pin built into the socket base;
an electrical receptacle built into the socket lid and configured to mate with the spring-loaded contact pin when the socket lid contacts the socket base; and
a heater mounted on the socket lid wherein the heater is electrically coupled to the electrical receptacle.

4. The integrated circuit socket of claim 3 , further comprising:
an integrated circuit socket in the socket base wherein the heater contacts a top surface of a packaged integrated circuit when the packaged integrated circuit is plugged into the integrated circuit socket and the burn-in socket is closed.

5. An integrated circuit socket, comprising:
a socket base;
a socket lid;
a clamp configured to clamp the socket lid to the socket base;
a spring-loaded contact pin in the socket base;
an electrical receptacle in the socket lid and configured to mate with the spring-loaded contact pin when the socket lid is clamped to the socket base; and
a heater mounted on the socket lid wherein the heater is electrically coupled to the electrical receptacle.

6. The integrated circuit socket of claim 5 , further comprising an integrated circuit socket in the socket base wherein the heater contacts a top surface of a packaged integrated circuit when the packaged integrated circuit is plugged into the integrated circuit socket and the socket lid is clamped to the socket base.

7. An integrated circuit socket, comprising:
a socket base;
a socket lid;
a spring-loaded contact pin built into the socket lid;
an electrical receptacle built into the socket base configured to mate with the spring-loaded contact pin when the burn-in socket is closed; and
a heater mounted on the socket lid wherein the heater is electrically coupled to the spring-loaded contact pin.

8. The integrated circuit socket of claim 7 , further comprising an integrated circuit socket in the socket base wherein the heater contacts a top surface of a packaged integrated circuit when the packaged integrated circuit is plugged into the integrated circuit socket and socket lid is clamped to the socket base.

Assignees

• Texas Instruments Inc

Inventors

• Tadepalli Ramana

Classifications

• H01R33/74

  Devices having four or more poles {, e.g. holders for compact fluorescent lamps} · CPC title

• H01R13/24 Primary

  resilient; resiliently-mounted · CPC title

• H01R13/2407 Primary

  characterized by the resilient means · CPC title

• H01R13/2485

  for contacting a ball · CPC title

• H01R12/7076

  for connection between PCB and component, e.g. display · CPC title