LED lighting apparatus

Patent metadata

Field	Value
Publication number	US-9837392-B2
Application number	US-201715626883-A
Country	US
Kind code	B2
Filing date	Jun 19, 2017
Priority date	Jul 22, 2013
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

An LED lighting apparatus includes an LED substrate, a LED chip, a sealing resin member, and a reflecting face. The LED substrate has a main surface. The LED chip is mounted on the main surface of the LED substrate. The sealing resin member is made of a material that transmits light from the LED chip. The sealing resin member covers the LED chip. The sealing resin member has a shape bulging in the direction in which the main surface faces. The reflecting face surrounds the sealing resin member.

First claim

The invention claimed is:

1. An LED module comprising:
a substrate having an obverse surface and a reverse surface and formed with a first opening and a second opening;
a first electrode including a first portion and a second portion connected to the first portion, the first portion being formed on the obverse surface side of the substrate, the second portion being formed within the first opening;
a second electrode spaced apart from the first electrode and including a third portion and a fourth portion connected to the third portion, the third portion being formed on the obverse surface side of the substrate, the fourth portion being formed within the second opening;
an LED chip disposed above the first electrode;
a first wire connecting the LED chip to the second electrode; and
a resin member made of a material that transmits light from the LED chip, the resin member covering the LED chip, the first electrode and the second electrode in plan view, the resin member projecting in a direction in which the obverse surface of the substrate faces,
wherein the third portion of the second electrode is greater in size than the fourth portion of the second electrode in plan view.

2. The LED module according to claim 1 , further comprising a second wire electrically connected to the second electrode.

3. The LED module according to claim 2 , wherein each of the first wire and the second wire has an end connected at the obverse surface of the LED chip.

4. The LED module according to claim 2 , wherein the first wire and the second wire are covered with the resin member in plan view.

5. The LED module according to claim 1 , wherein each of the first opening and the second opening is elongated in the direction in which the obverse surface of the substrate faces.

6. The LED module according to claim 1 , wherein the first electrode comprises an additional conducting portion electrically connected to the second portion. and the first portion and the additional conducting portion are spaced apart from each other via the second portion.

7. The LED module according to claim 6 , wherein the additional conducting portion and the first portion are flat and parallel to each other.

8. The LED module according to claim 6 , wherein the additional conducting portion is closer to the reverse surface than to the obverse surface of the substrate.

9. The LED module according to claim 1 , wherein the second portion of the first electrode has an upper end face that is flush with the obverse surface of the substrate.

10. The LED module according to claim 9 , wherein the upper end face of the second portion is held in contact with a bottom surface of the first portion of the first electrode.

11. The LED module according to claim 1 , wherein the first portion of the first electrode has a series of a first edge. a second edge and a third edge that are spaced apart from the LED chip, and the third portion of the second electrode has a fourth edge, a fifth edge and a sixth edge that face the first edge, the second edge and the third edge, respectively.

12. The LED module according to claim 1 , wherein the first portion of the first electrode is greater in area than the LED chip in plan view.

13. The LED module according to claim 1 , wherein the substrate is greater in size measured along the direction in which the obverse surface of the substrate faces than the LED chip.

14. The LED module according to claim 1 , wherein the LED chip comprises an upper electrode to which the first wire is bonded.

15. The LED module according to claim 1 , wherein the LED chip has a rectangular shape in plan view, and a distance between the second portion of the first electrode and the fourth portion of the second electrode in a direction parallel to an edge of the rectangular shape is greater than a length of the LED chip in the direction parallel to the edge.

Assignees

• Rohm Co Ltd

Inventors

• Ishihara Takayuki
• Kigoshi Satohiro

Classifications

• F21K9/68

  Details of reflectors forming part of the light source · CPC title

• F21K9/69

  Details of refractors forming part of the light source · CPC title

• H05K2203/049

  Wire bonding · CPC title

• H05K2201/0108

  Transparent · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title