Ion implantation apparatus and method of controlling ion implantation apparatus

Patent metadata

Field	Value
Publication number	US-9837248-B2
Application number	US-201514605404-A
Country	US
Kind code	B2
Filing date	Jan 26, 2015
Priority date	Jan 29, 2014
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

In an ion implantation apparatus, an interruption member interrupts an ion beam B in the middle of a beam line. A plasma shower device is provided at the downstream side of the interruption member in the beam line. A control unit causes the interruption member to interrupt the ion beam B during an ignition start period of the plasma shower device. The interruption member may be provided at the upstream side of at least one high-voltage electric field type electrode in the beam line. A gas supply unit may supply a source gas to the plasma shower device. The control unit may start the supply of the source gas from the gas supply unit after the ion beam B is interrupted by the interruption member.

First claim

What is claimed is:

1. An ion implantation apparatus comprising:
an interruption member that interrupts an ion beam in the middle of a beam line;
a plasma shower device that is provided at the downstream side of the interruption member in the beam line; and
a control unit that causes the interruption member to interrupt the ion beam during an ignition start period of the plasma shower device such that the ion beam is interrupted before a vacuum degree is degraded in the vicinity of the plasma shower device.

2. The ion implantation apparatus according to claim 1 , further comprising:
at least one high-voltage electric field type electrode,
wherein the interruption member is provided at the upstream side of the electrode in the beam line.

3. The ion implantation apparatus according to claim 1 , further comprising:
a gas supply unit that supplies a source gas to the plasma shower device,
wherein the control unit starts the supply of the source gas from the gas supply unit after the ion beam is interrupted by the interruption member.

4. The ion implantation apparatus according to claim 3 ,
wherein, after the gas supply unit starts to supply the source gas at a first flow rate, the control unit continues the supply of the source gas from the gas supply unit at a second flow rate smaller than the first flow rate.

5. The ion implantation apparatus according to claim 1 ,
wherein the control unit cancels the interruption of the ion beam by the interruption member after a predetermined time which is necessary to decrease the high gas concentration of the beam line caused by the introduction of the source gas.

6. The ion implantation apparatus according to claim 1 , further comprising:
a beam measurement unit that is disposed so as to move into and out of the beam line and measures the current of the ion beam,
wherein the control unit operates the beam measurement unit as the interruption member by inserting the beam measurement unit into the beam line.

7. The ion implantation apparatus according to claim 1 , further comprising:
a deflection member that changes the traveling direction of the ion beam,
wherein the control unit operates the deflection member as the interruption member by operating the deflection member so that the ion beam is deviated from the beam line.

8. A method of controlling an ion implantation apparatus, the ion implantation apparatus forming a beam line carrying an ion beam drawn out from an ion source to an implantation processing chamber,
wherein the ion implantation apparatus includes a plasma shower device that supplies electrons to the ion beam in the implantation processing chamber, and
wherein the plasma shower device includes a plasma generation chamber that communicates with the implantation processing chamber, and generates plasma by using a source gas introduced into the plasma generation chamber,
the method comprising:
interrupting the ion beam in the middle of the beam line when the plasma shower device starts to generate the plasma such that the ion beam is interrupted before a vacuum degree is degraded in the vicinity of the plasma shower device.

9. The method of controlling the ion implantation apparatus according to claim 8 ,
wherein the ion implantation apparatus includes at least one electrode that exerts an electric field to the ion beam passing through the beam line, and
wherein the ion beam is interrupted at the upstream side of the beam line close to the ion source in relation to at least one electrode.

10. The method of controlling the ion implantation apparatus according to claim 8 , further comprising:
starting the supply of the source gas to the plasma generation chamber after interrupting the ion beam.

11. The method of controlling the ion implantation apparatus according to claim 10 , further comprising:
continuing the supply of the source gas, after starting the supply of the source gas to the plasma generation chamber at a first flow rate, at a second flow rate smaller than the first flow rate.

12. The method of controlling the ion implantation apparatus according to claim 8 ,
wherein interrupting the ion beam is cancelled after a predetermined time which is necessary to decrease the high gas concentration in the beam line caused by the introduction of the source gas.

Assignees

• Sumitomo Heavy Industries Ion Tech Co Ltd

Inventors

• Ooura Masahide
• Imai Daisuke
• Ninomiya Shiro

Classifications

• H01J37/3002

  Details · CPC title

• H01J2237/30472

  Controlling the beam · CPC title

• H01J2237/18

  Vacuum control means · CPC title

• H01J2237/304

  Controlling tubes · CPC title

• H01J2237/0206

  Extinguishing, preventing or controlling unwanted discharges · CPC title