Bonding strength test device for electronic components and method for bonding strength test

Patent metadata

Field	Value
Publication number	US-9835544-B2
Application number	US-201615060568-A
Country	US
Kind code	B2
Filing date	Mar 3, 2016
Priority date	Mar 25, 2015
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

According to an embodiment, a bonding strength test device measures bonding strength between a flexure of a suspension of a hard disk drive and microactuators mounted on a gimbal of the flexure. The bonding strength test device includes a clamp, dummy, and device body. The clamp fixes the flexure. The dummy is adhered to the microactuators. The probe is engaged in the dummy. The device body measures a tensile load applied to the probe while the probe is pulled toward a direction to be apart from the flexure.

First claim

What is claimed is:

1. A bonding strength test device configured to measure a bonding strength between a flexure of a suspension of a hard disk drive and electronic components mounted on a gimbal of the flexure, the bonding strength test device comprising:
a clamp which fixes the flexure;
a dummy adhered to the electronic components;
a probe which engage with the dummy; and
a device body which measures a tensile load applied to the probe while the probe is being pulled toward a direction to be apart from the flexure.

2. The bonding strength test device of claim 1 , further comprising an adhesive agent for the engagement of the dummy and the probe.

3. The bonding strength test device of claim 1 , wherein the electronic components are microactuators including a piezoelectric device formed of lead zirconate titanate,
the gimbal includes a first surface on which a pair of microactuators are arranged to be separated from each other and a second surface opposite to the first surface, and
the dummy includes side surfaces interposed between the microactuators to be adhered to inner side surfaces of the microactuators.

4. The bonding strength test device of claim 3 , wherein the dummy is a slider mounted on the gimbal.

5. The bonding strength test device of claim 1 , wherein the electronic components are microactuators including a piezoelectric device formed of lead zirconate titanate,
the gimbal includes a first surface on which a pair of microactuators are arranged to be separated from each other and a second surface opposite, to the first surface, and
the dummy is disposed on both upper surfaces of the pair of microactuators to be adhered to both the upper surfaces.

6. The bonding strength test device of claim 5 , wherein the dummy is a slider having an outer dimension which is larger than that of a slider mounted on the flexure.

7. A method for measuring bonding strength between a flexure of a suspension of a hard disk drive and electronic components mounted on a gimbal of the flexure wherein the electronic components are microactuators including a piezoelectric device formed of lead zirconate titanate, the method comprising:
fixing the flexure to a clamp;
adhering a dummy to the microactuators;
engaging a probe in the dummy; and
measuring a tensile load between the probe and the flexure while pulling the probe in a direction to be apart from the flexure.

Assignees

• Nhk Spring Co Ltd

Inventors

• Kashima Hideki
• Sugita Yuji
• Shimoda Takeshi
• Fukuda Tsutomu

Classifications

• G11B5/4853

  Constructional details of the electrical connection between head and arm · CPC title

• G11B5/483

  Piezoelectric devices between head and arm, e.g. for fine adjustment · CPC title

• G11B5/455

  Arrangements for functional testing of heads; Measuring arrangements for heads · CPC title

• G01N19/04 Primary

  Measuring adhesive force between materials, e.g. of sealing tape, of coating · CPC title