Pressure sensor with testing device and related methods

Patent metadata

Field	Value
Publication number	US-9835515-B2
Application number	US-201414511346-A
Country	US
Kind code	B2
Filing date	Oct 10, 2014
Priority date	Oct 10, 2014
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

A pressure sensor is for positioning within a structure. The pressure sensor may include a pressure sensor integrated circuit (IC) having a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit. The pressure sensor may include a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.

First claim

That which is claimed is:

1. A pressure sensor for positioning within a structure, the pressure sensor comprising:
a pressure sensor integrated circuit (IC) comprising a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit; and
a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC is configured to bend into the recess when the pressure sensor IC is subjected to external pressure.

2. The pressure sensor of claim 1 , wherein the pressure sensor IC includes electrically conductive antenna traces coupled to the transceiver circuit for receiving radio frequency (RF) energy.

3. The pressure sensor of claim 1 , wherein the recess is trapezoidal in shape.

4. The pressure sensor of claim 1 further comprising a glass frit bonding layer between the pressure sensor IC and the support body.

5. The pressure sensor of claim 1 , wherein the support body comprises a first layer defining the recess and comprising additional electrically conductive antenna traces coupled to the transceiver circuit, and a second layer adjacent the first layer.

6. The pressure sensor of claim 1 , further comprising at least one substrate adjacent the pressure sensor IC and comprising additional electrically conductive antenna traces coupled to the transceiver circuit.

7. The pressure sensor of claim 6 , wherein the at least one substrate comprises a flexible substrate extending laterally outwardly from the pressure sensor IC.

8. The pressure sensor of claim 6 , wherein the additional electrically conductive antenna traces surround the pressure sensor IC.

9. The pressure sensor of claim 6 , wherein the support body extends outwardly and substantially perpendicular to the at least one substrate.

10. The pressure sensor of claim 9 , wherein
the pressure sensor IC comprises electrically conductive antenna traces coupled to the transceiver circuit; and
the electrically conductive antenna traces extend between ends of the support body.

11. The pressure sensor of claim 10 , wherein a first antenna of the electrically conductive antenna traces and a second antenna of the electrically conductive antenna traces are arranged in opposing first and second loops.

12. The pressure sensor of claim 11 , wherein the first loop is square-shaped and the second loop is square-shaped.

13. The pressure sensor of claim 1 , wherein the support body comprises at least one of a ceramic material, a glass material, or a silicon material.

14. The pressure sensor of claim 1 , wherein the pressure sensor circuit comprises piezoresistive pressure sensor circuitry or piezoelectric pressure sensor circuitry.

15. The pressure sensor of claim 1 , wherein the pressure sensor IC has a thickness of 100 microns.

16. The pressure sensor of claim 1 , wherein the pressure sensor is disposed in a wafer.

17. The pressure sensor of claim 16 , wherein the wafer comprises a plurality of pressure sensors.

18. The pressure sensor of claim 1 , wherein the pressure sensor IC is configured to measure pressures of 500 atmospheres or more.

19. A method for making a pressure sensor for positioning within a structure, the method comprising:
providing a pressure sensor integrated circuit (IC) comprising a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit; and
forming a support body to have a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.

20. The method of claim 19 , wherein the providing the pressure sensor IC further comprises providing the pressure sensor IC further comprising electrically conductive antenna traces coupled to the transceiver circuit for receiving radio frequency (RF) energy.

21. The method of claim 19 , further comprising forming the recess to be trapezoidal in shape.

22. The method of claim 19 , further comprising forming a glass frit bonding layer between the pressure sensor IC and the support body.

23. The method of claim 19 , wherein the support body comprises a first layer defining the recess and comprising additional electrically conductive antenna traces coupled to the transceiver circuit, and a second layer adjacent the first layer.

24. The method of claim 19 , further comprising forming at least one substrate adjacent the pressure sensor IC and comprising additional electrically conductive antenna traces coupled to the transceiver circuit.

25. A pressure sensor comprising:
a pressure sensor integrated circuit (IC) comprising a transceiver circuit, a pressure sensor circuit coupled to the transceiver circuit, and a dielectric layer comprising an antenna trace coupled to the transceiver circuit;
a support body having a recess, wherein the pressure sensor IC is configured to bend into the recess; and
a glass frit bonding layer between the pressure sensor IC and the support body.

26. The pressure sensor of claim 25 , wherein the pressure sensor circuit comprises piezoresistive pressure sensor circuitry.

27. The pressure sensor of claim 25 , wherein the pressure sensor circuit comprises piezoelectric pressure sensor circuitry.

28. The pressure sensor of claim 25 , wherein the pressure sensor IC has a thickness of 100 microns.

Assignees

• St Microelectronics Srl
• Stmicroeletronics S R L

Inventors

• Pagani Alberto

Classifications

• G01L1/16

  using properties of piezoelectric devices · CPC title

• G01L1/2206

  Special supports with preselected places to mount the resistance strain gauges; Mounting of supports · CPC title

• G01L25/00 Primary

  Testing or calibrating of apparatus for measuring force, torque, work, mechanical power, or mechanical efficiency · CPC title

• G01L1/26

  Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload · CPC title