Demand-based charging of a heat pipe

Patent metadata

Field	Value
Publication number	US-9835384-B2
Application number	US-201514881393-A
Country	US
Kind code	B2
Filing date	Oct 13, 2015
Priority date	Oct 13, 2015
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.

First claim

The invention claimed is:

1. A heat pipe comprising:
an interface for thermally coupling a heat source to the heat pipe;
a horizontal portion charged with a first quantity of liquid and coupled to the interface;
a reservoir in a lower portion of the horizontal portion that contains a second quantity of the liquid; and
a temperature-actuated valve overlying the reservoir, wherein the temperature-actuated valve seals the second quantity of the liquid in the reservoir when the temperature is below an actuation temperature and unseals the second quantity of liquid in the reservoir when the temperature is above the actuation temperature;
a second reservoir that contains liquid in the lower portion of the horizontal portion; and
a second temperature-actuated valve overlying the second reservoir, wherein the second temperature-actuated valve seals the liquid in the second reservoir when the temperature is below a second actuation temperature and unseals the liquid in the second reservoir when the temperature is above the second actuation temperature;
wherein the actuation temperature and the second actuation temperature are different.

2. The heat pipe of claim 1 wherein, when the temperature is above the actuation temperature, the first and second quantities of the liquid combine to form a third quantity of the liquid that comprises a sum of the first and second quantities of the liquid.

3. The heat pipe of claim 1 wherein the temperature-actuated valve comprises a bi-metal valve.

4. The heat pipe of claim 3 wherein the bi-metal valve has a first end fixedly attached to an edge of the reservoir with an opposing second end free to move from a first position that seals the reservoir to a second position that unseals the reservoir.

5. The heat pipe of claim 4 wherein the reservoir comprises a valve seat the temperature-actuated valve rests on when the temperature is below the actuation temperature.

6. The heat pipe of claim 1 further comprising at least one vertical member connected with the horizontal portion.

7. The heat pipe of claim 1 further comprising a plurality of fins that dissipate heat.

8. The heat pipe of claim 1 wherein the horizontal portion overlies the interface.

9. The heat pipe of claim 1 wherein the heat pipe is made of copper.

10. The heat pipe of claim 9 wherein the liquid comprises water.

11. A heat sink comprising:
a plurality of thermally-conductive fins; and
a heat pipe thermally coupled to the plurality of thermally-conductive fins, the heat pipe comprising: an interface for thermally coupling an integrated circuit to the heat pipe;
a horizontal portion that overlies the interface and contains a first quantity of a liquid;
two vertical members connected with the horizontal portion to form a U-shape;
first and second reservoirs in a lower portion of the horizontal portion, wherein each of the first and second reservoirs contains liquid and at least partially underlies one of the two vertical members;
a first bi-metal valve overlying the first reservoir, the first bi-metal valve sealing the liquid in the first reservoir when the temperature is below a first actuation temperature and unsealing the liquid in the first reservoir when the temperature is above the first actuation temperature; and
a second bi-metal valve overlying the second reservoir, the second bi-metal valve sealing the liquid in the second reservoir when the temperature is below a second actuation temperature and unsealing the liquid in the second reservoir when the temperature is above the second actuation temperature;
wherein the first actuation temperature and the second actuation temperature are different.

12. The heat sink of claim 11 wherein the plurality of thermally-conductive fins dissipate heat.

13. The heat sink of claim 11 wherein the heat pipe is made of copper.

14. The heat sink of claim 13 wherein the liquid comprises water.

Assignees

• IBM

Inventors

• Anderl William J
• Elison Bret P
• Mann Phillip V
• Sinha Arvind K

Classifications

• F28F3/02

  Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title

• F28D15/06 Primary

  Control arrangements therefor · CPC title

• F16K31/002

  actuated by temperature variation (thermo-electric F16K31/025) · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D2015/0216

  having particular orientation, e.g. slanted, or being orientation-independent · CPC title