Surface treated plating material and method for producing the same, and electronic components
US-2015259813-A1 · Sep 17, 2015 · US
US9834848B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9834848-B2 |
| Application number | US-201415321851-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 29, 2014 |
| Priority date | Jun 25, 2014 |
| Publication date | Dec 5, 2017 |
| Grant date | Dec 5, 2017 |
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A tin-plated stainless steel sheet which has a tin plating layer having good adhesion to a stainless steel sheet and exhibits excellent whisker resistance in various environments, and wherein a nickel plating layer having a thickness of 0.3-3 μm is formed on a stainless steel sheet, and a tin plating layer having a thickness of 0.3-5 μm is formed on the nickel plating layer. This tin-plated stainless steel sheet is characterized in that nickel crystals in the nickel plating layer have a lattice distortion of 0.5% or less.
Opening claim text (preview).
The invention claimed is: 1. A Sn-plated stainless steel sheet, comprising: a stainless steel sheet; a Ni-plating layer having a thickness of 0.3 to 3 μm formed on the stainless steel sheet; and a Sn-plating layer having a thickness of 0.3 to 5 μm formed on the Ni-plating layer, wherein a Ni crystal of the Ni-plating layer has a lattice distortion of 0.5% or less. 2. The Sn-plated stainless steel sheet according to claim 1 , to which a reflow treatment has not been subjected.
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces · CPC title
of tin · CPC title
the said other metal being copper or nickel or an alloy thereof · CPC title
of iron or steel · CPC title
of nickel or cobalt · CPC title
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