Monolithic fabrication of three-dimensional structures

Patent metadata

Field	Value
Publication number	US-9833978-B2
Application number	US-201414332365-A
Country	US
Kind code	B2
Filing date	Jul 15, 2014
Priority date	Feb 11, 2011
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

A multi-layer, super-planar structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.

First claim

What is claimed is:

1. A method for fabricating a three-dimensional structure comprising:
forming a stack of a plurality of patterned layers, including at least one rigid layer and at least one flexible layer with at least one interface between the rigid and flexible layers and a stacking axis extending orthogonally from the interface between the rigid and flexible layers, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer, and bonding the plurality of patterned layers at selected locations to form a laminate structure with inter-layer bonds; and
expanding the laminate structure into an expanded three-dimensional configuration by flexing the laminate structure at joints between the rigid segments, selectively distorting at least one of the layers to produce gaps that expand parallel to the stacking axis between adjacent layers while maintaining at least some of the inter-layer bonds.

2. A method for fabricating a three-dimensional structure comprising:
producing a plurality of layers with distinct patterns, wherein the layers include at least one rigid layer and at least one flexible layer, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer; then
stacking the plurality of layers with at least one interface between the rigid and flexible layers and a stacking axis extending orthogonally from the interface between the rigid and flexible layers, and bonding the plurality of layers at selected locations to form a laminate structure with inter-layer bonds; and
flexing the laminate structure at joints between the rigid segments to produce an expanded three-dimensional structure with gaps that expand parallel to the stacking axis between adjacent layers, wherein the adjacent layers are joined at the selected bonding locations and separated by the gaps at other locations.

3. A method for fabricating a three-dimensional structure comprising:
producing a plurality of layers with distinct patterns, wherein the layers include at least one rigid layer and at least one flexible layer, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer; then
stacking the plurality of layers and bonding the plurality of layers at selected locations to form a laminate structure with inter-layer bonds;
inserting at least one stimulus-responsive material between layers as the layers are stacked, wherein the stimulus-responsive material serves as an actuator for a cantilever to which the stimulus-responsive material is joined, and wherein the stimulus-responsive material is electrically coupled with a power source; and
flexing the laminate structure at joints between the rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.

4. The method of claim 3 , wherein the stimulus-responsive material is a piezoelectric plate.

5. The method of claim 2 , wherein at least two of the layers in the expanded three-dimensional structure are separated by a distance in a range from 100 μm to 10 mm away from the inter-layer bonds.

6. The method of claim 2 , wherein at least some of the layers have a thickness in a range from 1.5 μm to 150 μm.

7. The method of claim 2 , further comprising cutting the rigid layer with a laser to form the rigid segments.

8. A method for fabricating a three-dimensional structure comprising:
producing a plurality of layers with distinct patterns, wherein the layers include at least one rigid layer and at least one flexible layer, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer; then
stacking the plurality of layers and bonding the plurality of layers at selected locations to form a laminate structure with inter-layer bonds; and
flexing the laminate structure at joints between the rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations,
wherein the rigid layer is coated with a conductive circuit.

9. A method for fabricating a three-dimensional structure comprising:
producing a plurality of layers with distinct patterns, wherein the layers include at least one rigid layer and at least one flexible layer, wherein the rigid layer includes a plurality of rigid segments that are substantially more rigid than the flexible layer; then
stacking the plurality of layers and bonding the plurality of layers at selected locations to form a laminate structure with inter-layer bonds; and
flexing the laminate structure at joints between the rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations, and wherein the expanded three-dimensional structure comprises at least one I-beam.

10. The method of claim 9 , wherein a plurality of rigid layers are patterned, stacked and flexed.

11. The method of claim 9 , wherein a plurality of flexible layers are patterned, stacked and flexed.

12. A laminate precursor for a three-dimensional structure, comprising an aligned stack of layers including:
a plurality of rigid layers, wherein the rigid layers include cuts extending therethrough to form a plurality of rigid segments separated by the cuts; and
a plurality of flexible layers that are substantially less rigid than the rigid segments with at least one interface between the rigid and flexible layers and a stacking axis extending orthogonally from the interface between the rigid and flexible layers, wherein each flexible layer is bonded to at least one of the rigid layers such that the flexible layer is exposed at the cuts in the rigid layer to form joints for folding,
wherein at least some of the layers are bonded to adjacent layers only at selected locations forming islands of inter-layer bonds to allow expansion of the laminate into an expanded three-dimensional structure with gaps that expand parallel to the stacking axis between adjacent layers when the laminate is folded at the joints.

13. A laminate precursor for a three-dimensional structure, comprising an aligned stack of layers including:
a plurality of rigid layers, wherein the rigid layers include cuts extending therethrough to form a plurality of rigid segments separated by the cuts; and
a plurality of flexible layers that are substantially less rigid than the rigid segments, wherein each flexible layer is bonded to at least one of the rigid layers such that the flexible layer is exposed at the cuts in the rigid layer to form joints for folding,
wherein at least some of the layers are bonded to adjacent layers only at selected locations forming islands of inter-layer bonds to allow expansion of the laminate into an expanded three-dimensional structure when the laminate is folded at the joints, and wherein the layers are configured to produce a plurality of copies of the expanded three-dimensional structure for mass production when the laminate is folded at the joints.

Assignees

• Harvard College

Inventors

• Sreetharan Pratheev Sabaratnam
• Whitney John Peter
• Wood Robert J

Classifications

• B32B3/266

  characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title

• B32B2307/20

  having particular electrical or magnetic properties, e.g. piezoelectric · CPC title

• B32B38/0004

  Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence) · CPC title

• Y10T156/1064

  Partial cutting [e.g., grooving or incising] · CPC title

• B32B38/0012

  Mechanical treatment, e.g. roughening, deforming, stretching · CPC title