Microfluidic system with single drive signal for multiple nozzles

Patent metadata

Field	Value
Publication number	US-9833806-B2
Application number	US-201514976434-A
Country	US
Kind code	B2
Filing date	Dec 21, 2015
Priority date	Jun 20, 2014
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

First claim

The invention claimed is:

1. A device, comprising:
a microfluidic substrate;
an inlet path through the microfluidic substrate;
a plurality of heaters on the microfluidic substrate, each heater having:
an input contact; and
an output contact being positioned between the heater and the inlet path;

a first contact pad coupled to each of the output contacts;
a plurality of second contact pads, each second contact pad being coupled to a group of the input contacts, a number of second contact pads being smaller than a number of the input contacts, the number of second contact pads being equal to a number of groups of the input contacts.

2. The device of claim 1 , further comprising:
an electrical trace coupled between the first contact pad and each of the output contacts, a first portion of the electrical trace being positioned between the inlet path and a first half of the output contacts and a second portion of the electrical trace being positioned between the inlet path and a second half of the output contacts.

3. The device of claim 1 wherein each of the first contact pad and the plurality of second contact pads are positioned along one side of the microfluidic substrate and aligned with each other.

4. The device of claim 1 , further comprising a plurality of nozzles, each nozzle corresponding to and aligned with one of the plurality of heaters.

5. The device of claim 1 , further comprising a plurality of chambers, each chamber having walls and corresponding to one of the plurality of heaters.

6. A device, comprising:
a microfluidic substrate;
a plurality of heaters on the microfluidic substrate; and
a plurality of nozzles, each nozzle aligned with one of the heaters;
a plurality of first contact pads on the microfluidic substrate, each first contact pad being electrically coupled to a first one and a second one of the plurality of heaters, each heater being coupled between one of the first contact pads and ground.

7. The device of claim 6 , further comprising:
a plurality of chambers, each chamber aligned with one of the heaters; and
each nozzle aligned with one of the chambers.

8. The device of claim 6 wherein a number of the first contact pads that are electrically coupled to the first ones and the second ones of the heaters is one half of a number of the heaters.

9. The device of claim 8 , further comprising a ground contact pad that is coupled to each one of the heaters.

10. The device of claim 8 , further comprising a composite substrate, the microfluidic substrate being positioned on the composite substrate.

11. The device of claim 10 wherein the composite substrate includes a plurality of second contact pads that are electrically coupled to the plurality of first contact pads.

12. The device of claim 11 wherein a number of the first contact pads is greater than a number of the second contact pads.

13. A device, comprising:
a microfluidic substrate;
an inlet path through the microfluidic substrate;
a first contact pad on the microfluidic substrate;
a plurality of second contact pads on the microfluidic substrate;
a plurality of heaters on the microfluidic substrate, each heater including:
an input contact being positioned between the heater and an edge of the microfluidic substrate; and
an output contact being positioned between the heater and the edge of the microfluidic substrate, each input and output contact being spaced from the inlet path by the respective heater;

a first signal line coupled between each of the output contacts and the first contact pad, the plurality of heaters being between the first signal line and the inlet path; and
a plurality of second signal lines, each second signal line being coupled between a group of the input contacts and one of the second contact pads, a number of the second contact pads being smaller than a number of the input contacts.

14. The device of claim 13 wherein the first contact pad and the plurality of second contact pads are positioned along the edge of the microfluidic substrate.

15. The device of claim 13 wherein the first contact pad is grounded.

16. The device of claim 13 , further comprising:
a plurality of chambers, each chamber including one of the heaters; and
a plurality of nozzles, each nozzle aligned with one of the chambers.

17. The device of claim 16 , further comprising:
a channel region on the microfluidic substrate, the channel region connected to the inlet path; and
a plurality of flow paths on the microfluidic substrate, each flow path formed between the channel region and one of the chambers.

18. The device of claim 13 wherein the input contacts and the output contacts are formed as part of a same conductive layer as the first signal line.

19. The device of claim 13 wherein the input contacts and the output contacts are formed as part of a different conductive layer as the first signal line.

20. A device, comprising:
a microfluidic substrate;
a plurality of heaters on the microfluidic substrate; and
a plurality of first contact pads on the microfluidic substrate, each first contact pad being electrically coupled to a pair of the heaters;
a composite substrate, the microfluidic substrate being positioned on the composite substrate, the composite substrate includes a plurality of second contact pads that are electrically coupled to the plurality of first contact pads, a number of the first contact pads is greater than a number of the second contact pads.

21. The device of claim 20 wherein a number of the first contact pads that are electrically coupled to the pairs of the heaters is one half of a number of the heaters.

22. A device, comprising:
a microfluidic substrate;
an inlet path through the microfluidic substrate;
a first contact pad on the microfluidic substrate;
a plurality of second contact pads on the microfluidic substrate;
a plurality of heaters on the microfluidic substrate, each heater including:
an input contact being positioned between the heater and an edge of the microfluidic substrate; and
an output contact being positioned between the heater and the edge of the microfluidic substrate;

a first signal line coupled between each of the output contacts and the first contact pad; and
a plurality of second signal lines, each second signal line being coupled between a group of the input contacts and one of the second contact pads, a number of the second contact pads being smaller than a number of the input contacts, the input contacts and the output contacts are formed as part of a different conductive layer as the first signal line.

23. The device of claim 22 , further comprising:
a plurality of chambers on the microfluidic substrate;
a channel region on the microfluidic substrate, the channel region connected to the inlet path; and
a plurality of flow paths on the microfluidic substrate, each flow path formed between the channel region and one of the chambers.

Assignees

• St Microelectronics Inc
• St Microelectronics Srl
• St Microelectronics Int Nv

Inventors

• Dodd Simon
• Scheffelin Joe
• Hunt Dave
• Giere Matt
• Gruenbacher Dana
• Sherman Faiz

Classifications

• B41J2/14072

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title

• B41J2/1632

  machining · CPC title

• Y10T29/49119

  Brush · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/0212

  Printed circuits or mounted components having integral heating means · CPC title