Light emitting device package

Patent metadata

Field	Value
Publication number	US-9831406-B2
Application number	US-201514729771-A
Country	US
Kind code	B2
Filing date	Jun 3, 2015
Priority date	Sep 25, 2012
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.

First claim

What is claimed is:

1. A light emitting device package comprising:
a package body including a first cavity and a second cavity;
a pad disposed on a bottom surface of the first cavity;
a light emitting device disposed on a bottom surface of the second cavity electrically connected to the pad;
an adhesive layer disposed under the light emitting device;
a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions expanded from a first side of the body of the heat dissipation member and a second side of the body of the heat dissipation member opposite to the first side at a top surface of the body of the heat dissipation member and a bottom surface of the body of the heat dissipation member; and
electrode patterns disposed at the package body,
wherein the light emitting device emits light in a wavelength range of 190 nm to 405 nm,
wherein the package body has a first layer and a second layer and the second layer is disposed between the adhesive layer and the heat dissipation member,
wherein a top surface of the first layer is the bottom surface of the first cavity and a side surface of the first layer is a side surface of the second cavity, and
wherein a top surface of the second layer is the bottom surface of the second cavity and a height of the bottom surface of the second cavity is higher than a height of the top surface of the heat dissipation member.

2. The light emitting device package according to claim 1 , wherein the expanded portions include a first expanded portion and a second expanded portion, and the first expanded portion and the second expanded portion are expanded from one of the first side and the second side of the body of the heat dissipation member, respectively.

3. The light emitting device package according to claim 1 , wherein the second layer contacts with an entire top surface of the heat dissipation member.

4. The light emitting device package according to claim 2 , wherein an end part of the first expanded portion and an end part of the second expanded portion are vertically non-overlapped.

5. A light emitting device package comprising:
a package body including a first cavity and a second cavity;
a pad disposed on a bottom surface of the first cavity;
a light emitting device disposed on a bottom surface of the second cavity electrically connected to the pad;
an adhesive layer disposed under the light emitting device;
a heat dissipation member inserted into the package body, the heat dissipation member including a body, a first expanded portion, a second expanded portion, a third expanded portion and a fourth expanded portion; and
electrode patterns disposed at the package body,
wherein the light emitting device emits light in a wavelength range of 190 nm to 405 nm,
wherein the first expanded portion is expanded from a first side of the body of the heat dissipation member at a top surface of the body of the heat dissipation member,
wherein the second expanded portion is expanded from the first side of the body of the heat dissipation member at a bottom surface of the body of the heat dissipation member,
wherein the third expanded portion is expanded from a second side of the body of the heat dissipation member opposite to the first side at the top surface of the body of the heat dissipation member,
wherein the fourth expanded portion is expanded from the second side of the body of the heat dissipation member opposite to the first side at the bottom surface of the body of the heat dissipation member,
wherein the package body has a first layer and a second layer, and the second layer is disposed between the adhesive layer and the heat dissipation member,
wherein a top surface of the first layer is the bottom surface of the first cavity, and a side surface of the first layer is a side surface of the second cavity,
wherein a top surface of the second layer is the bottom surface of the second cavity, and a height of the bottom surface of the second cavity is higher than a height of the top surface of the heat dissipation member,
wherein a width of the third expanded portion is greater than a width of the fourth expanded portion, and
wherein the second layer contacts with an entire top surface of the heat dissipation member.

6. The light emitting device package according to claim 5 , wherein the top surface of the body of the heat dissipation member, a top surface of the first expanded portion and a top surface of the third expanded portion are disposed on a same plane.

7. The light emitting device package according to claim 5 , wherein an end part of the first expanded portion and an end part of the second expanded portion are vertically non- overlapped, and an end part of the third expanded portion and an end part of the fourth expanded portion are vertically non-overlapped.

8. The light emitting device package according to claim 5 , wherein the electrode patterns comprise a first electrode pattern and a second electrode pattern.

9. The light emitting device package according to claim 8 , wherein a portion of the package body is disposed between the heat dissipation member and the second electrode pattern.

10. The light emitting device package according to claim 5 , wherein the first layer is disposed on the first electrode pattern and the second layer is disposed under the first electrode pattern.

11. A light emitting device package comprising:
a package body including a first cavity and a second cavity;
a pad disposed on a bottom surface of the first cavity;
a light emitting device disposed on a bottom surface of the second cavity electrically connected to the pad;
an adhesive layer disposed under the light emitting device;
a heat dissipation member inserted into the package body, the heat dissipation member including a body, a first expanded portion and a second expanded portion; and
electrode patterns disposed at the package body having a first electrode pattern and a second electrode pattern,
wherein the light emitting device emits light in a wavelength range of 190 nm to 405 nm,
wherein the first expanded portion is expanded from a first side of the body of the heat dissipation member at a top surface of the body of the heat dissipation member,
wherein the second expanded portion is expanded from the first side of the body of the heat dissipation member at a bottom surface of the body of the heat dissipation member,
wherein an end portion of the first expanded portion is non-overlapped with an end portion of the second expanded portion,
wherein the package body has a first part and a second part, the first part is disposed on the first electrode pattern and the second part is disposed under the first electrode pattern,
wherein the second part is disposed between the adhesive layer and the heat dissipation member,
wherein a top surface of the first part is the bottom surface of the first cavity, and a side surface of the first part is a side surface of the second cavity,
wherein a top surface of the second part is the bottom surface of the second cavity, and a height of the bottom surface of the second cavity is higher than a height of the top surface of the heat dissipation member,
wherein the second part contacts with an entire top surface of the heat dissipation member,
wherein a height of the first electrode pattern is higher than a height of the second electrode pattern and the height of the top surface of the heat dissipation member,
wherein a thickness of at least one portion of the second part is thinner than a thickness of the first part,
wherein a width of the top surface of the heat dissipation member is greater than a maximum width of the secon

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Byung Mok
• Kang Bo Hee
• Kim Ha Na
• Kodaira Hiroshi
• Tanda Yuichiro
• Ozeki Satoshi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/655

  Fan-out layouts · CPC title

• A61L2/08

  Radiation · CPC title

• A61L2/10

  Ultraviolet [UV] radiation · CPC title

• H01L33/483

  Electricity · mapped topic