Roll-to-roll fabrication of ordered three-dimensional nanostructure array, related techniques, materials and products

US9831362B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9831362-B2
Application numberUS-201414202436-A
CountryUS
Kind codeB2
Filing dateMar 10, 2014
Priority dateMar 29, 2013
Publication dateNov 28, 2017
Grant dateNov 28, 2017

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  5. First independent claim

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Abstract

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Roll-to-roll fabrication of predetermined or ordered three-dimensional nanostructure arrays is described. Provided methods can comprise imprinting a substrate with a two-dimensional (2-D) pattern by rolling a cylindrical pattern comprising a 2-D array of structures against a substrate. In addition, control or determination of nanostructure parameters via control of process parameters is provided.

First claim

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What is claimed is: 1. A method, comprising: receiving a foil substrate from a roll; imprinting the foil substrate as the foil substrate is transferred from the roll with a pattern comprising rolling a cylindrical pattern comprising a two-dimensional 2-D array of structures against the foil substrate, wherein the pattern corresponds to predetermined three-dimensional (3-D) nanostructures to be formed on the foil substrate; and forming the predetermined 3-D nanostructures on the foil substrate comprising anodizing the foil substrate resulting in an anodized foil substrate. 2. The method of claim 1 , wherein the imprinting the foil substrate comprises imprinting the foil substrate with at least one of a square-ordered pattern that corresponds to 3-D nanopillars or a hexagonal-ordered pattern that corresponds to 3-D nanoconcaves. 3. The method of claim 1 , wherein the rolling the cylindrical pattern comprises rolling the cylindrical pattern comprising the 2-D array of structures of a predetermined pitch, and wherein the pattern corresponds to a predetermined spacing of the predetermined 3-D nanostructures. 4. The method of claim 1 , wherein the rolling the cylindrical pattern against the foil substrate comprises rolling the cylindrical pattern against a metallic foil substrate. 5. The method of claim 4 , wherein the rolling the cylindrical pattern against the metallic foil substrate comprises rolling the cylindrical pattern against an aluminum foil substrate. 6. The method of claim 1 , further comprising fabricating the cylindrical pattern by forming a master pattern that corresponds to the cylindrical pattern on a pattern substrate via photolithography. 7. The method of claim 6 , further comprising: electroplating at least one metallic substance on the master pattern; releasing the at least one metallic substance from the master pattern and the pattern substrate; and shaping the at least one metallic substance into a cylindrical shape. 8. The method of claim 1 , wherein the rolling the cylindrical pattern comprises at least one of intermittently or continuously rolling the cylindrical pattern. 9. The method of claim 1 , further comprising forming at least one layer formed over the predetermined 3-D nanostructures on the foil substrate comprising at least one of an amorphous silicon layer or an indium tin oxide layer. 10. The method of claim 1 , wherein the forming the predetermined 3-D nanostructures comprises forming at least one of a square-ordered array or a hexagonal-ordered array on the foil substrate. 11. The method of claim 1 , wherein the forming the predetermined 3-D nanostructures comprises forming at least one of a nanopillar array or a nanoconcave array on the foil substrate. 12. The method of claim 1 , wherein the forming the predetermined 3-D nanostructures further comprises etching the anodized foil substrate. 13. A method, comprising: receiving, from a roll, a foil substrate comprising an imprinted pattern, wherein the imprinted pattern corresponds to a cylindrical pattern applied to the foil substrate, and wherein the imprinted pattern corresponds to a two-dimensional (2-D) array of structures on the cylindrical pattern; and forming ordered three-dimensional (3-D) nanostructures on the foil substrate, wherein the ordered 3-D nanostructures correspond to the pattern, and wherein the forming the ordered 3-D nanostructures comprises anodizing the foil substrate resulting in an anodized foil substrate. 14. The method of claim 13 , wherein the receiving the foil substrate further comprises receiving a metallic foil substrate. 15. The method of claim 13 , wherein the receiving the foil substrate further comprises receiving an aluminum foil substrate. 16. The method of claim 13 , wherein the forming the ordered 3-D nanostructures comprises forming at least one of a square-ordered array or a hexagonal-ordered array on the foil substrate. 17. The method of claim 13 , wherein the forming the ordered 3-D nanostructures comprises forming at least one of a nanopillar array or a nanoconcave array. 18. The method of claim 17 , wherein the forming the nanopillar array comprises forming the nanopillar array with a height of between about 500 nanometers to about 2.5 micrometers. 19. The method of claim 13 , wherein the anodizing the foil substrate further comprises anodizing the foil substrate in a mixture of citric acid, phosphoric acid, ethylene glycol, and deionized water. 20. The method of claim 13 , wherein the anodizing the foil substrate further comprises anodizing the foil substrate with a direct current voltage comprising a value between about 200 volts (V) to about 750 V. 21. The method of claim 13 , wherein the forming the ordered 3-D nanostructures further comprises etching the anodized foil substrate. 22. The method of claim 21 , wherein the etching the anodized foil substrate comprises etching the anodized foil substrate with an acidic solution.

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What does patent US9831362B2 cover?
Roll-to-roll fabrication of predetermined or ordered three-dimensional nanostructure arrays is described. Provided methods can comprise imprinting a substrate with a two-dimensional (2-D) pattern by rolling a cylindrical pattern comprising a 2-D array of structures against a substrate. In addition, control or determination of nanostructure parameters via control of process parameters is provided.
Who is the assignee on this patent?
Univ Hong Kong Sci & Tech
What technology area does this patent fall under?
Primary CPC classification H01L31/02366. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).