Integrated thermal stabilization of a microring resonator

US9831360B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9831360-B2
Application numberUS-201314434081-A
CountryUS
Kind codeB2
Filing dateOct 9, 2013
Priority dateOct 9, 2012
Publication dateNov 28, 2017
Grant dateNov 28, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Embodiments of the present disclosure provide devices and methods involving the thermal stabilization of microring resonators, such as microring modulators. Power is measured via an on-chip photodetector integrated with a drop port of the microring resonator, providing a local measurement of average power. This average power is employed as a feedback measure to actively control a heater that is integrated with the microring resonator, in order to stabilize the resonant wavelength of the microring resonator in the presence of thermal fluctuations. Employing such a system, a microring modulator can maintain error-free performance under thermal fluctuations that would normally render it inoperable.

First claim

Opening claim text (preview).

Therefore what is claimed is: 1. A thermally stabilized integrated optical device comprising: a microring resonator modulator configured to modulate an optical signal; a high-speed modulator circuit for driving said microring resonator modulator at a modulation rate; a photodetector integrated with said microring resonator modulator; a heater configured to locally heat said microring resonator modulator; and a low-speed controller interfaced with said photodetector and said heater, wherein said controller is configured to thermally stabilize a resonant wavelength of said microring resonator modulator by controlling said heater to maintain the average power as measured by said photodetector on a timescale that is longer than a modulation timescale associated with the modulation rate, such that the microring resonator modulator is thermally stabilized independent of the modulation rate thereof. 2. The thermally stabilized integrated optical device according to claim 1 wherein said controller is configured to vary a voltage applied to said heater according to a difference between a voltage measured from said photodetector and a reference voltage. 3. The thermally stabilized integrated optical device according to claim 1 further comprising an additional photodetector integrated with a through port of said microring resonator modulator, wherein said controller is interfaced with said additional photodetector, and wherein said controller is configured to thermally stabilize a resonant wavelength of said microring resonator modulator by controlling said heater in response to average power measured by said photodetector and said additional photodetector. 4. The thermally stabilized integrated optical device according to claim 1 wherein said microring resonator modulator comprises a drop port, and wherein said photodetector is integrated with said drop port. 5. The thermally stabilized integrated optical device according to claim 1 wherein said microring resonator modulator comprises an annular waveguide. 6. The thermally stabilized integrated optical device according to claim 1 wherein said microring resonator modulator comprises a micro-disk resonator. 7. The thermally stabilized integrated optical device according to claim 1 wherein said photodetector is a defect-enhanced silicon photodiode. 8. The thermally stabilized integrated optical device according to claim 1 wherein said heater is a thin film heater. 9. The thermally stabilized integrated optical device according to claim 1 wherein said controller is integrated with said microring resonator modulator on a common substrate. 10. The thermally stabilized integrated optical device according to claim 1 wherein said controller is formed on a separate substrate from that of said microring resonator modulator. 11. The thermally stabilized integrated optical device according to claim 1 wherein said microring resonator modulator is employed as a component of an active device selected from the group consisting of microring lasers, microring sensors, microring switches, amplifiers, attenuators, dispersion compensators, and delay lines. 12. The thermally stabilized integrated optical device according to claim 1 wherein said microring resonator modulator is employed as a component of a passive device selected from the group consisting of microring filters, add-drops, cross-connects, mirrors, interleavers, attenuators, dispersion compensators, and delay lines. 13. The thermally stabilized integrated optical device according to claim 1 further comprising one or more additional thermally stabilized microring resonators modulators arranged serially with respect to a common bus waveguide, wherein each microring resonator modulator has associated therewith a dedicated heater and a dedicated photodetector, and wherein each microring resonator modulator has a different operational wavelength. 14. The thermally stabilized integrated optical device according to claim 2 wherein said controller is further configured to apply a bias voltage to said heater in the absence of a difference between said voltage measured from said photodetector and said reference voltage. 15. The thermally stabilized integrated optical device according to claim 14 wherein said bias voltage and said reference voltage are selected, for a given wavelength, based on the high-speed performance of said microring resonator modulator. 16. The thermally stabilized integrated optical device according to claim 15 wherein said bias voltage and reference voltage are selected, for said given wavelength, such that one or more parameters associated with high-speed performance of said microring resonator modulator exceed a pre-selected threshold. 17. The thermally stabilized integrated optical device according to claim 15 wherein said bias voltage is selected such that thermally induced variations in said voltage measured from said photodetector relative to said reference voltage at said given wavelength occur within a region of monotonic slope. 18. The thermally stabilized integrated optical device according to claim 5 wherein said photodetector is integrated within said annular waveguide of said microring resonator modulator. 19. The thermally stabilized integrated optical device according to claim 10 wherein said substrate associated with said microring resonator modulator and said separate substrate are co-packaged. 20. The thermally stabilized integrated optical device according to claim 19 wherein said substrate associated with said microring resonator modulator and said separate substrate are co-packaged via one of wire-bonding and flip-chip bonding. 21. A method of stabilizing the operation of an integrated optical device, the integrated optical device comprising a microring resonator modulator and a modulator circuit for driving said microring resonator modulator at a modulation rate, the microring resonator modulator having a heater and a photodetector interfaced directly therewith, the method comprising: measuring, with the photodetector, average power on a timescale that is longer than a modulation timescale associated with the modulation rate; and controlling the heater to maintain the average power such that the microring resonator modulator is thermally stabilized independent of the modulation rate thereof. 22. The method according to claim 21 wherein the heater is controlled by varying a voltage applied to the heater. 23. The method according to claim 22 wherein the photodetector is a photodetector, the method further comprising varying the voltage according to a difference between a voltage measured from the photodetector and a reference voltage. 24. The method according to claim 23 further comprising applying a bias voltage to the heater in the absence of a difference between the voltage measured from the photodetector and the reference voltage. 25. The method according to claim 24 wherein the bias voltage and the reference voltage are selected, for a given wavelength, based on the high-speed performance of the microring resonator modulator. 26. The method according to claim 25 wherein the bias voltage and the reference voltage are selected by: ramping a voltage applied to the heater, with the device in a controlled thermal environment, to identify a voltage at which the one or more parameters associated with high-speed performance of the microring resonator modulator exceed th

Assignees

Inventors

Classifications

  • Electricity · mapped topic

  • based on thermo-optic effects (G02F1/132 takes precedence) · CPC title

  • Electricity · mapped topic

  • involving resonance effects, e.g. resonantly enhanced interaction · CPC title

  • Circuits for the control or stabilisation of the bias voltage, e.g. automatic bias control [ABC] feedback loops · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9831360B2 cover?
Embodiments of the present disclosure provide devices and methods involving the thermal stabilization of microring resonators, such as microring modulators. Power is measured via an on-chip photodetector integrated with a drop port of the microring resonator, providing a local measurement of average power. This average power is employed as a feedback measure to actively control a heater that is…
Who is the assignee on this patent?
Univ Mcmaster, Univ Columbia
What technology area does this patent fall under?
Primary CPC classification H01L31/02327. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).