Method of manufacturing an imaging device

Patent metadata

Field	Value
Publication number	US-9831284-B2
Application number	US-201615054677-A
Country	US
Kind code	B2
Filing date	Feb 26, 2016
Priority date	Nov 1, 2013
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.

First claim

What is claimed is:

1. A method of manufacturing an imaging device, the method comprising:
forming, by a manufacturing device, a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side, in a silicon substrate;
forming a passivation layer directly on a top surface side of the silicon substrate;
forming a wiring layer directly under the silicon substrate;
affixing, by the manufacturing device, a lower substrate that photoelectrically converts infrared light incident from the back surface side, under the silicon substrate;
forming at least two infrared electrodes within a bottom surface side of the wiring layer and in direct contact with an upper surface side of the lower substrate, wherein the upper surface side of the lower substrate is facing the bottom surface side of the wiring layer and one of the infrared electrodes is in contact with a bottom surface side of the silicon substrate;
forming a lower electrode in direct contact with a bottom surface side of the lower substrate, wherein the one of the infrared electrodes that is in contact with the bottom surface side of the silicon substrate is formed in a ring shape; and
forming a visible light reading circuit configured to read the visible light within one side of the silicon substrate and forming an infrared light reading circuit configured to read the infrared light within the other side of the silicon substrate,
wherein the visible light reading circuit and the infrared light reading circuit are formed in a position overlapping the infrared electrodes, and
wherein the silicon substrate and the lower substrate form a laminated structure.

2. The method of claim 1 , wherein the lower substrate is formed of a compound semiconductor.

3. The method of claim 1 , wherein the infrared electrode is formed to be transparent.

4. The method of claim 1 , wherein the lower substrate is formed of silicon, and includes transistors and wirings.

5. The method of claim 4 , wherein the lower substrate is an n-type substrate.

6. A method of manufacturing an imaging device, the method comprising:
forming, by a manufacturing device, a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side, in a first silicon substrate;
forming a passivation layer directly on a top surface side of the first silicon sub state;
forming a first wiring layer directly under the first silicon substrate;
affixing, by the manufacturing device, a lower substrate including a second silicon substrate and a second wiring layer, wherein the second wiring layer is directly under the first wiring layer, wherein the second silicon substrate is directly under the second wiring layer, and wherein the lower substrate photoelectrically converts infrared light incident over the entire second silicon substrate,
forming a lower electrode in direct contact with a bottom surface side of the lower substrate;
forming a visible light reading circuit configured to read the visible light within the first wiring layer; and
forming an infrared light reading circuit configured to read the infrared light within the second wiring layer,
wherein the first silicon substrate and the lower substrate form a laminated structure.

7. The method of claim 6 , wherein the infrared light reading circuit is provided in a position substantially overlapping the visible light reading circuit.

8. A method of manufacturing an imaging device, comprising:
forming a photoelectric conversion unit in a silicon substrate, wherein the photoelectric conversion unit formed in the silicon substrate photoelectrically converts visible light incident on a back surface side of the silicon substrate;
forming a passivation layer directly on a top surface side of the silicon substrate;
affixing a lower substrate under the silicon substrate, wherein the lower substrate photoelectrically converts infrared light incident on the silicon substrate that passes through the silicon substrate to the lower substrate;
forming a wiring layer directly under the silicon substrate;
forming at least two infrared electrodes within a bottom surface side of the wiring layer and in direct contact with an upper surface side of the lower substrate, wherein the upper surface side of the lower substrate is facing the bottom surface side of the wiring layer and one of the infrared electrodes is in contact with a bottom surface side of the silicon substrate;
forming a lower electrode in direct contact with a bottom surface side of the lower substrate, and wherein the one of the infrared electrodes that is in contact with the bottom surface side of the silicon substrate is formed in a ring shape; and
forming a visible light reading circuit configured to read the visible light within one side of the silicon substrate and forming an infrared light reading circuit configured to read the infrared light within the other side of the silicon substrate,
wherein the visible light reading circuit and the infrared light reading circuit are formed in a position overlapping the infrared electrodes, and
wherein the silicon substrate and the lower substrate form a laminated structure.

9. The method of claim 8 , wherein the infrared electrode is formed to be transparent.

10. The method of claim 8 , wherein the lower substrate is formed of silicon, and includes transistors and wirings.

11. The method of claim 10 , wherein the lower substrate is an n-type substrate.

12. The method of claim 8 , wherein the infrared light reading circuit is provided in a position substantially overlapping the visible light reading circuit.

13. The method of claim 8 , wherein the lower substrate is formed of a compound semiconductor.

Assignees

• Sony Corp

Inventors

• Mabuchi Keiji
• Abe Hideshi
• Kanbe Hideo
• Uchida Shiro

Classifications

• G01J3/2803

  using photoelectric array detector · CPC title

• G01J3/36

  Investigating two or more bands of a spectrum by separate detectors · CPC title

• G01J5/20

  using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title

• H01L27/14687

  Electricity · mapped topic

• H01L27/1464

  Electricity · mapped topic