Light emitting device package and lighting apparatus including the same

Patent metadata

Field	Value
Publication number	US-9831221-B2
Application number	US-201514614004-A
Country	US
Kind code	B2
Filing date	Feb 4, 2015
Priority date	Feb 5, 2014
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A light emitting device package includes: a light emitting device disposed on a substrate; a diffusion plate disposed on the substrate to surround the light emitting device; and a molding portion that is disposed on the substrate and has a shape of an aspheric lens whose center is recessed, The center of the molding portion is located on the same axis as the center of the light emitting device, and the diffusion plate may be interposed between the light emitting device and the molding portion. The molding portion having the shape of the aspheric lens whose center is recessed and the diffusion plate are employed to widely diffuse the light emitted from the light emitting device. Thereby, the efficiency of light can be increased, and manufacturing time and cost can be reduced. Simultaneously, a yellow ring phenomenon can be avoided.

First claim

What is claimed is:

1. A light emitting device package comprising:
a light emitting device disposed on a substrate;
a diffusion plate disposed on the substrate to surround the light emitting device; and
a molding portion that is disposed on the substrate and has a shape of an aspheric lens whose center is recessed,
wherein a width of the substrate is equal to a width of a lower end of the molding portion in at least two regions at a perpendicular direction to an optical axis,
wherein the center of the molding portion is located on the same axis as the center of the light emitting device, and the diffusion plate is interposed between the light emitting device and the molding portion,
wherein the shape of the molding potion is expressed as follows:

y
=

x
2

R

1
+

1
-

(

1
+
k

)

⁢

x
2

R
2

+

A
2

⁢

x
2

+

A
4

⁢

x
4

+

A
6

⁢

x
6

+

A
8

⁢

x
8

+

A
10

⁢

x
10

+

A
12

⁢

x
12

+

A
14

⁢

x
14

,

and
wherein:
x is an axial radius measured on an axis perpendicular to the optical axis,
y is a step of a lens surface in the axial radius x, the step of the lens surface identifying a height obtained by measuring an apex of a molding portion from a reference surface at a height of zero (0) in a direction of the optical axis,
R is a radius of curvature of the apex,
k is a conically curved surface coefficient, and
A2, A4, A6, A8, A10, A12, and A14 are aspheric deformation coefficients, and
wherein R is 1.140E+01, k is −6.281E−02, A2 is 2.519E−01, A4 is −5.678E−01, A6 is 6.969E−01, A8 is −2.915E−01, A10 is −2.933E−01, A12 is 3.163E−01, and A14 is −8.332E−02.

2. The light emitting device package of claim 1 , further comprising a florescent substance layer interposed between the light emitting device and the diffusion plate.

3. The light emitting device package of claim 1 , wherein the width of the lower end of the molding portion is wider than a width of an upper end of the molding portion.

4. The light emitting device package of claim 1 , wherein the light emitting device is disposed in a hole formed in the substrate.

5. The light emitting device package of claim 4 , further comprising a florescent substance layer that fills-up the hole.

6. The light emitting device package of claim 1 , wherein a flange protruding radially outward is formed on a lower end of the molding portion.

7. The light emitting device package of claim 1 , wherein the molding portion is transparent or semitransparent.

8. The light emitting device package of claim 7 , wherein the molding portion includes a silicone resin or an epoxy resin.

9. The light emitting device package of claim 1 , wherein the diffusion plate includes an opal series diffuser.

10. A light emitting device package comprising:
a light emitting device disposed on a substrate; and
a molding portion disposed on the substrate to mold the light emitting device,
wherein the molding portion has a shape of an aspheric lens whose center is recessed and a width of a lower end of the molding portion is wider than a width of an upper end of the molding portion,
wherein a width of the substrate is equal to the width of the lower end of the molding portion in at least two regions at a perpendicular direction to an optical axis,
wherein the shape of the molding potion is expressed as follows:

y
=

x
2

R

1
+

1
-

(

1
+
k

)

⁢

x
2

R
2

Assignees

• Lg Innotek Co Ltd

Inventors

• Park Gwui Youn
• Kang Bo Ra
• Kim Sung Phil
• Joo Yang Hyun

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H01L33/54

  Electricity · mapped topic

• H01L33/56

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic

• H01L2924/0002

  Electricity · mapped topic