Configuring Signal Devices in Thermal Processing Systems
US-2015371129-A1 · Dec 24, 2015 · US
US9830552B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9830552-B2 |
| Application number | US-201313964234-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 12, 2013 |
| Priority date | Jul 18, 2007 |
| Publication date | Nov 28, 2017 |
| Grant date | Nov 28, 2017 |
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Official abstract text for this publication.
A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
Opening claim text (preview).
What is claimed is: 1. A radio IC device comprising: a radio IC arranged to process transmitted and received signals; a coil element electrically connected to or electromagnetically coupled to the radio IC; and a radiation plate arranged so as to be coupled to the coil element; wherein the radiation plate is defined by a metal case of an apparatus, and a loop electrode defined by an edge of an opening in a planar portion of the metal case is provided in a portion of the metal case; the coil element is coupled to the loop electrode of the metal case via a magnetic field; and the metal case functions as the radiation plate such that the transmitted signals processed by the radio IC are radiated from the metal case and the received signals received by the metal case are processed by the radio IC. 2. The radio IC device according to claim 1 , wherein the radiation plate includes a notch provided therein, and an edge of the radiation plate which is located around the notch defines the loop electrode. 3. The radio IC device according to claim 1 , wherein the coil element is defined by a spiral electrode. 4. A radio IC device comprising: a radio IC arranged to process transmitted and received signals; a coil element electrically connected to or electromagnetically coupled to the radio IC; and a radiation plate arranged so as to be coupled to the coil element; wherein the radiation plate is defined by a planar metal case of an apparatus; the coil element is provided adjacent to an edge of the planar metal case such that one portion of the coil element overlaps with the edge of the planar metal case in planar view and another portion of the coil element is arranged outside of the planar metal case in planar view, and coupled to the planar metal case via a magnetic field generated by current flowing in the edge of the planar metal case; and the planar metal case functions as the radiation plate such that the transmitted signals processed by the radio iC are radiated from the the radio IC. 5. The radio IC device according to claim 4 , wherein the coil element is defined by a spiral electrode.
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
on active surfaces of flip-chip devices, e.g. underfills · CPC title
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