Method for determining pattern of mold for imprint, imprint method, and apparatus

US9829789B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9829789-B2
Application numberUS-201414531777-A
CountryUS
Kind codeB2
Filing dateNov 3, 2014
Priority dateNov 6, 2013
Publication dateNov 28, 2017
Grant dateNov 28, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A determination method for determining a pattern of a mold is disclosed. The pattern of the mold is used in imprint processing of forming a pattern on imprint material by performing the steps of pressing the imprint material on a substrate against the pattern of the mold in an atmosphere containing condensable gas to be liquefied due to compression, curing the imprint material, and releasing the mold from the imprint material. A processor calculates a shrinkage amount of the pattern on the imprint material. The pattern on the imprint material shrinks by desorbing condensate liquid, which is produced through liquefaction of the condensable gas between the imprint material and the pattern of the mold in the pressing step and which is dissolved in the imprint material, from the imprint material after completion of the pressing step.

First claim

Opening claim text (preview).

The invention claimed is: 1. A determination method for determining a pattern of a mold, the pattern of the mold being used in imprint processing of forming a pattern on imprint material by performing the steps of pressing the imprint material on a substrate against the pattern of the mold in an atmosphere containing condensable gas to be liquefied due to compression, curing the imprint material, and releasing the mold from the imprint material, the method comprising the steps of: by using a processor, calculating a shrinkage amount of the pattern on the imprint material, the pattern on the imprint material shrinking by desorbing condensate liquid from the imprint material after completion of the pressing step, the condensate liquid being produced through liquefaction of the condensable gas between the imprint material and the pattern of the mold in the pressing step and being dissolved in the imprint material; and determining a size of the pattern of the mold by using the calculated shrinkage amount. 2. The determination method according to claim 1 , wherein, in the calculating step, the shrinkage amount is calculated by using a concentration of the condensate liquid dissolved in the imprint material and a relationship between the concentration and the shrinkage amount. 3. The determination method according to claim 2 , wherein, in the calculating step, the concentration of the condensate liquid is obtained from a concentration of the condensable gas in the atmosphere. 4. The determination method according to claim 3 , wherein, in the calculating step, a concentration distribution of the condensate liquid in a pattern area formed on the imprint material is obtained by using a concentration distribution of the condensable gas in the atmosphere, and wherein the shrinkage amount is calculated by using the concentration distribution of the condensate liquid. 5. The determination method according to claim 3 , wherein, in the calculating step, a concentration distribution of the condensate liquid in a pattern area formed on the imprint material is obtained by using the amount of the condensable gas confined between the imprint material and the pattern of the mold in the pressing step, and wherein the shrinkage amount is calculated by using the concentration distribution of the condensate liquid. 6. The determination method according to claim 1 , wherein, in the calculating step, the shrinkage amount is calculated for each of a plurality of pattern components whose sizes are different from each other. 7. The determination method according to claim 1 , wherein, in the determining step, the size of the pattern of the mold is determined by using a shrinkage amount produced due to curing of the imprint material in the step of curing the imprint material. 8. A non-transitory recording medium storing a program for causing a computer to execute the determination method according to claim 1 . 9. A computer including a processor that determines a pattern of a mold, wherein the mold is used in imprint processing of forming a pattern on imprint material by performing the steps of pressing the imprint material on a substrate against the pattern of the mold in an atmosphere containing condensable gas to be liquefied due to compression, curing the imprint material, and releasing the mold from the imprint material, and wherein the processor calculates a shrinkage amount of the pattern on the imprint material, the pattern on the imprint material shrinking by desorbing condensate liquid from the imprint material after completion of the pressing step, the condensate liquid being produced through liquefaction of the condensable gas between the imprint material and the pattern of the mold in the pressing step and being dissolved in the imprint material, and determines a size of the pattern of the mold by using the calculated shrinkage amount.

Assignees

Inventors

Classifications

  • forming a microstructure, i.e. fine patterning · CPC title

  • characterised by the shape of the surface · CPC title

  • characterised by the use of electric means · CPC title

  • Manufacturing moulds, e.g. shaping the mould surface by machining · CPC title

  • Microembossing · CPC title

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What does patent US9829789B2 cover?
A determination method for determining a pattern of a mold is disclosed. The pattern of the mold is used in imprint processing of forming a pattern on imprint material by performing the steps of pressing the imprint material on a substrate against the pattern of the mold in an atmosphere containing condensable gas to be liquefied due to compression, curing the imprint material, and releasing th…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification G03F7/0002. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).