Integrated modular multimedia system in wall-box format
US-10141700-B2 · Nov 27, 2018 · US
US9829186B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9829186-B2 |
| Application number | US-201314376438-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 8, 2013 |
| Priority date | Feb 7, 2012 |
| Publication date | Nov 28, 2017 |
| Grant date | Nov 28, 2017 |
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Official abstract text for this publication.
Various embodiments relate to a semiconductor bulb, including a housing, and at least one semiconductor light source that is arranged on the housing. The housing includes a rearward base region that is embodied from an electrically non-conductive material for the purpose of engaging in a bulb socket. At least one electrical contact element is arranged on the base region for the purpose of contacting the bulb socket. The base region is embodied for the purpose of arranging electrical contact elements of different base types.
Opening claim text (preview).
The invention claimed is: 1. A semiconductor lamp comprising: a housing, and at least one semiconductor light source that is arranged on the housing, wherein the housing comprises a rearward base region that is embodied from an electrically non-conductive material for the purpose of engaging in a bulb socket, wherein at least one electrical contact element is arranged on the base region for the purpose of contacting the bulb socket and wherein the base region is designed for selectively mounting electrical contact elements of different base types on said base region. 2. The semiconductor lamp as claimed in claim 1 , wherein the base region is designed for selectively mounting electrical contact elements at least of two base types of the group consisting of an Edison base, a bipin base and a bayonet base. 3. The semiconductor lamp as claimed in claim 2 , wherein the base region comprises a first, end-side base section that is designed for receiving bipin contact pins on its front side and for installation in a bipin lamp socket, and a second base section joined to the front of the end-side base section and said second base section comprises a larger diameter than the first base section and is designed such that the electrical contact element in the form of a contact cap of an Edison base or a bayonet base can endwise be plugged onto said second base section. 4. The semiconductor lamp as claimed in claim 3 , wherein the first base section comprises a height of approx. 12 mm. 5. The semiconductor lamp as claimed in claim 4 , wherein the first base section comprises at least at a maximum height a diameter of approx. 22.6 mm. 6. The semiconductor lamp as claimed in claim 3 , wherein the second base section comprises a diameter of approx. 25 mm. 7. The semiconductor lamp as claimed in claim 3 , wherein the second base section comprises a height of approx. 7.5 mm. 8. The semiconductor lamp as claimed in claim 3 , wherein the second base section comprises on the side at least one depression into which the contact cap can be pressed locally in a plastic manner. 9. The semiconductor lamp as claimed in claim 3 , wherein the Edison base is of the type E27, the bipin base is of the type GU10 and the bayonet base is of the type B22d. 10. The semiconductor lamp as claimed in claim 1 , wherein the base region is a lower housing region of a driver housing that is provided for the purpose of receiving a driver. 11. The semiconductor lamp as claimed in claim 10 , wherein an upper housing region of the driver housing comprises a contact surface for the at least one semiconductor light source. 12. The semiconductor lamp as claimed in claim 8 having an Edison base or a bayonet base, wherein semiconductor bulb is produced by a method, the method comprising: pushing on the contact cap; connecting at least one current carrying element; and locally pressing in the contact cap in at least one depression that is arranged on the side of the second base section. 13. A method for producing a semiconductor lamp, the method comprising the following steps: providing a semiconductor lamp according to claim 8 ; connecting at least one current carrying element; and locally pressing in the contact cap in at least one depression that is arranged on the side of the second base section. 14. A semiconductor lamp comprising: a housing, and at least one semiconductor light source that is arranged on the housing, wherein the housing comprises a rearward base region that is embodied from an electrically non-conductive material for the purpose of engaging in a bulb socket, wherein at least one electrical contact element is arranged on the base region for the purpose of contacting the bulb socket, wherein the base region is designed for arranging electrical contact elements of different base types at least of two base types of the group consisting of an Edison base, a bipin base and a bayonet base, wherein the base region comprises a first, end-side base section that is designed for receiving bipin contact pins on its front side and for installation in a bipin lamp socket, and a second base section joined to the front of the end-side base section and said second base section comprises a larger diameter than the first base section and is designed such that the electrical contact element in the form of a contact cap of an Edison base or a bayonet base can endwise be plugged onto said second base section.
adapted for co-operation with two or more dissimilar counterparts · CPC title
the elements being coupling devices {, e.g. connectors} · CPC title
Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings · CPC title
Light-emitting diodes [LED] · CPC title
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