LED support with wire-bonded electrical connection for a lighting module of a motor vehicle and electrical connector by wire-bonding

Patent metadata

Field	Value
Publication number	US-9829165-B2
Application number	US-201615075468-A
Country	US
Kind code	B2
Filing date	Mar 21, 2016
Priority date	Mar 23, 2015
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A support for light source(s) for a lighting and/or light signaling module for a motor vehicle, comprising a substrate of thermally conductive material, preferentially of metallic material, at least one light source of the light-emitting or laser diode type with a face for mounting on the substrate, in thermal contact therewith and an electrical power supply circuit for the light source or sources. The power supply circuit is linked electrically with the light source or sources by means of metal wires soldered on the surface by the technology commonly referred to by the expression “wire bonding”. The measures of the invention make it possible to define at least one reception plane for the light sources oriented in such a way as to avoid having components in the vicinity of the light sources casting shadows thereon.

First claim

What is claimed is:

1. A support for light source(s) for a lighting and/or light signaling module for a motor vehicle, comprising:
a substrate of thermally conductive material, preferentially of metallic material, said substrate comprising a base;
at least one semiconductor light source;
means for connection to an electrical power supply circuit for said at least one semiconductor light source, said connection means being linked electrically by wire-bonding with said at least one semiconductor light source by means of metal wires soldered on a surface;
wherein said substrate comprises at least one structure which protrudes on said base and which defines a reception surface on which at least one of said at least one semiconductor light source is arranged in thermal contact;
wherein said electrical power supply circuit is printed on or in a plate of electrically insulating material arranged on said substrate;
wherein said substrate comprises two opposite faces each supporting said at least one semiconductor light source, at least one of said two opposite faces comprising at least one structure which protrudes on said base and which defines said reception surface supporting said at least one semiconductor light source, said substrate comprising an orifice linking said two opposite faces and arranged facing said plate so as to allow an electrical link with said at least one semiconductor light source on a face of said substrate opposite to that on which said plate is arranged.

2. The support according to claim 1 , wherein at least one of said reception surface is generally parallel to a plane of said substrate.

3. The support according to claim 1 , wherein at least one of said reception surface is inclined relative to a plane of said substrate.

4. The support according to claim 1 , wherein said electrical power supply circuit is supported by said substrate.

5. The support according to claim 1 , wherein said substrate comprises an electrically insulating surface layer, on which said electrical power supply circuit is formed by electrically conductive metalized tracks.

6. The support according to claim 1 , wherein said orifice is passed through by at least one of said metal wires linked to a face of said plate in contact with said substrate and to said at least one semiconductor light source on said face of said substrate opposite to that on which said plate is arranged.

7. The support according to claim 1 , wherein said plate comprises a portion extending through said orifice, said portion comprising at least one electrical contact, one of said metal wires extending from said at least one electrical contact to said at least one semiconductor light source on said face of said substrate opposite to that on which said plate is arranged.

8. The support according to claim 1 , wherein said substrate comprises cooling fins.

9. The support according to claim 8 , wherein said substrate comprises a first portion forming a wall supporting said at least one semiconductor light source and a second portion comprising said cooling fins.

10. The support according to claim 1 , wherein said at least one semiconductor light source are glued onto said substrate.

11. The support according to claim 2 , wherein said substrate comprises an electrically insulating surface layer, on which said electrical power supply circuit is formed by electrically conductive metalized tracks.

12. The support according to claim 3 , wherein said substrate comprises an electrically insulating surface layer, on which said electrical power supply circuit is formed by electrically conductive metalized tracks.

13. The support according to claim 2 , wherein said electrical power supply circuit is printed on or in a plate of electrically insulating material arranged on said substrate.

14. The support according to claim 3 , wherein said electrical power supply circuit is printed on or in a plate of electrically insulating material arranged on said substrate.

15. A support for light source(s) for a lighting and/or light signaling module for a motor vehicle, comprising:
a substrate of thermally conductive material, preferentially of metallic material, said substrate comprising a base;
at least one semiconductor light source;
a connector for connecting an electrical power supply circuit for said at least one semiconductor light source, said connector being linked electrically by wire-bonding with said at least one semiconductor light source by means of metal wires soldered on a surface;
wherein said substrate comprises at least one structure which protrudes on said base and which defines a reception surface on which at least one of said at least one semiconductor light source is arranged in thermal contact,
wherein said electrical power supply circuit is printed on or in a plate of electrically insulating material arranged on said substrate;
wherein said substrate comprises two opposite faces each supporting said at least one semiconductor light source, at least one of said two opposite faces comprising at least one structure which protrudes on said base and which defines said reception surface supporting said at least one semiconductor light source, said substrate comprising an orifice linking said two opposite faces and arranged facing said plate so as to allow an electrical link with said at least one semiconductor light source on a face of said substrate opposite to that on which said plate is arranged.

16. A lighting module for a motor vehicle, comprising;
a support for at least one light source;
at least one optical device suitable for deflecting light rays emitted by at least one light source in a lighting beam;
wherein said support comprises;
a substrate of thermally conductive material, preferentially of metallic material, said substrate comprising a base;
at least one semiconductor light source;
means for connection to an electrical power supply circuit for said at least one semiconductor light source, said connection means being linked electrically by wire-bonding with said at least one semiconductor light source by means of metal wires soldered on a surface;

wherein said substrate comprises at least one structure which protrudes on said base and which defines a reception surface on which at least one of said at least one semiconductor light source is arranged in thermal contact
wherein said lighting module comprises a first reflector arranged facing a first face of said substrate, said first face supporting at least one of said at least one semiconductor light source and a second reflector arranged facing a second face, said second face supporting said at least one semiconductor light source.

17. The lighting module according to claim 16 , wherein said substrate comprises cooling fins arranged at a rear of a reflector or reflectors relative to a main direction of a lighting beam.

Assignees

• Valeo Vision

Inventors

• Zojceski Zdravko
• Duarte Marc
• Lauvernier Denis

Classifications

• F21S41/148

  the main emission direction of the LED being perpendicular to the optical axis · CPC title

• F21S43/14

  Light emitting diodes [LED] · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

• F21S41/192 Primary

  Details of lamp holders, terminals or connectors · CPC title

• H05K2203/049

  Wire bonding · CPC title