LED module

Patent metadata

Field	Value
Publication number	US-9829159-B2
Application number	US-201414913627-A
Country	US
Kind code	B2
Filing date	Aug 22, 2014
Priority date	Aug 23, 2013
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

First claim

We claim:

1. A light emitting diode (LED) module, comprising:
a base, the base being thermally and electrically conductive and having a light emitting region and a connecting flange;
an insulative layer selectively provided on the base, the insulative layer configured to be positioned on the connecting flange;
a first trace and a second trace provided on the insulative layer, the first and second traces extending from pads on the connecting flange to a corresponding connecting region adjacent the light emitting region; and
LED chips mounted in the light emitting region in a pattern, the set of LED chips being electrically connected to the first and second traces such that the first and second traces provide an anode and a cathode for the LED chips.

2. The LED module of claim 1 , wherein the connecting flange is offset from the light emitting region.

3. The LED module of claim 1 , wherein the connecting flange is angled with respect to the base.

4. The LED module of claim 1 , wherein the light emitting region is recessed in the base.

5. The LED module of claim 4 , wherein the LED chips are covered by at east two layers.

6. The LED module of claim 5 , wherein the base has a top surface and a bottom surface and the recess extends between the top and bottom surfaces and the at least two layers are below the top surface.

7. The LED module of claim 1 , wherein the base is curved and the light emitting region is positioned in the base such that the base is configured to shape emitted light in a focused manner.

8. The LED module of claim 7 , wherein the base includes an aperture that extends from a first side of the base to a second side opposite the first side, the first side supporting the LED chips, wherein the connecting flange extends from the aperture and is positioned on the second side.

9. A method of forming a light emitting diode (LED) module, comprising:
providing a base, the base having a reflective area and a connecting flange;
providing an insulative layer on the base, wherein the reflective area is substantially free of the insulative layer and the insulative layer at least partially covers the connecting flange;
providing a first trace and a second trace on the insulative layer, the first and second traces extending from adjacent the reflective area to the connecting flange;
positioning a plurality of LED chips on the reflective area;
electrically connecting the plurality of LED chips to the first and second traces; and
providing a protective coating over the LED chips.

10. The method of claim 9 , wherein the reflective area is recessed.

11. The method of claim 10 , wherein the providing of the first and second traces includes providing two pads on the connecting flange, one of the two pads electrically connected to the first trace and the other of the two pads electrically connected to the second trace.

12. The method of claim 11 , wherein the forming of the traces comprises placing a conductive ink directly on the insulative layer.

13. The method of claim 11 , wherein the forming of the traces comprises forming a pattern on the insulative layer with a laser and then placing the base in a plating bath so that a conductive layer forms on the pattern.

Assignees

• Molex Inc
• Mcgowan Daniel B
• Picini Michael C
• Molex Llc

Inventors

• Mcgowan Daniel B
• Picini Michael C

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K1/05

  Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title