Metal plate, method of manufacturing metal plate, and method of manufacturing deposition mask by use of metal plate

Patent metadata

Field	Value
Publication number	US-9828665-B2
Application number	US-201415026009-A
Country	US
Kind code	B2
Filing date	Sep 24, 2014
Priority date	Oct 15, 2013
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

The object of the present invention is to provide a metal plate capable of manufacturing a deposition mask in which dispersion of positions of through-holes is restrained. A thermal recovery rate is defined as parts per million of a difference a distance between to measurement points on a sample before a heat treatment and a distance therebetween after the heat treatment, relative to the distance therebetween before the heat treatment. In this case, an average value of the thermal recovery rates of the respective samples is not less than −10 ppm and not more than +10 ppm, and (2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm.

First claim

The invention claimed is:

1. A method of manufacturing a metal plate to be used for manufacturing a deposition mask by forming a plurality of through-holes in the metal plate, the method comprising:
a rolling step of rolling a base metal to obtain the metal plate; and
an annealing step of annealing the metal plate obtained by the rolling step;
wherein:
the through-holes of the deposition mask are formed by etching the metal plate,
when a plurality of samples are taken out from the metal plate, a distance between two measurement points on each sample, which is measured before a heat treatment, is referred to as L1, a distance therebetween which is measured after the heat treatment is referred to as L2, and a thermal recovery rate F of each sample is defined by the following expression: F={(L1−L2)/L1}×10 6 (ppm), the following conditions (1) and (2) are satisfied:
(1) an average value of the thermal recovery rates of the respective samples is not less than −10 ppm and not more than +10 ppm; and
(2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm;

the samples are obtained by cutting at least one sample metal plate, which is obtained by cutting the metal plate along a width direction of the metal plate, into two or more along a longitudinal direction of the metal plate;
the two measurement points on the sample are aligned along the longitudinal direction of the metal plate;
the heat treatment includes a first step of increasing a temperature of each sample from 25° C. to 300° C. for 30 minutes, a second step of keeping the temperature of each sample at 300° C. for 5 minutes, and a third step of decreasing the temperature of each sample from 300° C. to 25° C. for 60 minutes; and
the dispersion of the thermal recovery rates is a value obtained by multiplying 3 to a standard deviation of the thermal recovery rates of the respective samples.

2. The method of manufacturing a metal plate according to claim 1 , wherein
the base metal includes an invar alloy.

3. The method of manufacturing a metal plate according to claim 1 , wherein
the annealing step is performed while pulling the rolled base metal in the longitudinal direction.

4. The method of manufacturing a metal plate according to claim 3 , wherein
the base metal includes an invar alloy.

5. The method of manufacturing a metal plate according to claim 1 , wherein
the annealing step is performed to the metal plate wound around a core.

6. The method of manufacturing a metal plate according to claim 5 , wherein
the base metal includes an invar alloy.

7. A method of manufacturing a deposition mask having a plurality of through-holes formed therein, comprising:
a step of preparing a metal plate;
a resist pattern forming step of forming a resist pattern on the metal plate; and
an etching step of etching an area of the metal plate, which is not covered with the resist pattern, to form recesses in the metal plate, the recesses being configured to define the through-holes;
wherein:
when a plurality of samples are taken out from the metal plate, a distance between two measurement points on each sample, which is measured before a heat treatment, is referred to as L1, a distance therebetween which is measured after the heat treatment is referred to as L2, and a thermal recovery rate F of each sample is defined by the following expression: F={(L1−L2)/L1}×10 6 (ppm), the following conditions (1) and (2) are satisfied:
(1) an average value of the thermal recovery rates of the respective samples is not less than −10 ppm and not more than +10 ppm; and
(2) a dispersion of the thermal recovery rates of the respective samples is not more than 20 ppm;

the samples are obtained by cutting at least one sample metal plate, which is obtained by cutting the metal plate along a width direction of the metal plate, into two or more along a longitudinal direction of the metal plate;
the two measurement points on the sample are aligned along the longitudinal direction of the metal plate;
the heat treatment includes a first step of increasing a temperature of each sample from 25° C. to 300° C. for 30 minutes, a second step of keeping the temperature of each sample at 300° C. for 5 minutes, and a third step of decreasing the temperature of each sample from 300° C. to 25° C. for 60 minutes; and
the dispersion of the thermal recovery rates is a value obtained by multiplying 3 to a standard deviation of the thermal recovery rates of the respective samples.

8. The method of manufacturing a deposition mask according to claim 7 ,
the metal plate includes an invar alloy.

9. The method of manufacturing a deposition mask according to claim 7 , wherein
the resist-pattern forming step includes:
a step of forming a resist film on the metal plate;
a step of bringing an exposure mask into vacuum contact with the resist film;
a step of exposing the resist film in a predetermined pattern through the exposure mask; and
a developing step of forming an image on the exposed resist film;
wherein the developing step includes a resist heat treatment step of increasing a hardness of the resist film.

10. The method of manufacturing a deposition mask according to claim 9 ,
the metal plate includes an invar alloy.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Ikenaga Chikao
• Miyatani Isao

Classifications

• C23F1/04

  Chemical milling · CPC title

• C23C14/042 Primary

  using masks · CPC title

• C23F1/28

  for etching iron group metals · CPC title

• C21D6/001

  containing Ni (C21D6/004 takes precedence) · CPC title

• C23F1/02

  Local etching · CPC title