Prepreg and carbon fiber reinforced composite materials

Patent metadata

Field	Value
Publication number	US-9828477-B2
Application number	US-201113195989-A
Country	US
Kind code	B2
Filing date	Aug 2, 2011
Priority date	Aug 7, 2006
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2).
(1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

First claim

The invention claimed is:

1. A prepreg for a carbon fiber reinforced composite material, containing:
carbon fiber [A];
an epoxy resin [B] in which a thermoplastic resin is dissolved;
thermoplastic resin particles [C]; and
spherical conductive particles [D] selected from the group consisting of a carbon particle, a particle having a nucleus of inorganic material that is coated with a conductive substance, and a particle having a nucleus of organic material that is coated with a conductive substance,
wherein the carbon fiber [A] has a tensile modulus of at most 440 GPa, a tensile strength of at least 4.4 GPa and a tensile strain of at least 1.7%,
wherein a weight ratio expressed by
(content of [C] in parts by weight)/(content of [D] in parts by weight) is 1 to 1000,

wherein the conductive particles [D] have an average particle diameter equal to or larger than an average particle diameter of the thermoplastic resin particles [C] and the average particle diameter is at most 150 μm,
wherein an isomer of diaminodiphenyl sulfone is used as a hardener of the epoxy resin [B] in an equivalent ratio of the hardener to the epoxy groups contained in [B] of 0.7 to 1.0,
wherein 90 to 100 wt % of each of the thermoplastic resin particles [C] and the conductive particles [D] is localized in a 20% depth range from both surfaces of the prepreg in the thickness direction, and
wherein a total weight of the above-mentioned thermoplastic resin particles [C] and the above-mentioned conductive particles [D] is 1 to 20 wt % with respect to the prepreg weight.

2. A prepreg for a carbon fiber reinforced composite material according to claim 1 , wherein the thermoplastic resin particles [C] are polyamide particles.

3. A carbon fiber reinforced composite material produced by curing a prepreg according to claim 2 .

4. A prepreg for a carbon fiber reinforced composite material according to claim 2 , wherein the thermoplastic resin particles [C] have spherical shape.

5. A carbon fiber reinforced composite material produced by curing a prepreg according to claim 4 .

6. A prepreg for a carbon fiber reinforced composite material according to claim 1 , wherein the weight ratio in terms of parts by weight of the epoxy resin [B] to the dissolved thermoplastic resin is 100:2 to 100:50.

7. A prepreg for a carbon fiber reinforced composite material according to claim 6 , wherein the thermoplastic resin dissolved in the epoxy resin [B] is a polyethersulfone.

8. A carbon fiber reinforced composite material produced by curing a prepreg according to claim 6 .

9. A carbon fiber reinforced composite material produced by curing a prepreg according to claim 7 .

10. A prepreg for a carbon fiber reinforced composite material according to claim 1 , wherein the epoxy resin [B] includes at least a tetraglycidyldiaminodiphenylmethane.

11. A carbon fiber reinforced composite material produced by curing a prepreg according to claim 10 .

12. A carbon fiber reinforced composite material produced by curing a prepreg according to claim 1 .

Assignees

• Arai Nobuyuki
• Natsume Norimitsu
• Yoshioka Kenichi
• Kawasaki Junko
• Takezaki Hiroshi
• Toray Industries

Inventors

• Arai Nobuyuki
• Natsume Norimitsu
• Yoshioka Kenichi
• Kawasaki Junko
• Takezaki Hiroshi

Classifications

• B32B2255/02

  on fibrous or filamentary layer · CPC title

• B32B5/26

  another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)} · CPC title

• B32B27/12 Primary

  next to a fibrous or filamentary layer · CPC title

• D06M15/53

  Polyethers (polyacetals D06M15/39) · CPC title

• C08K7/06

  Elements · CPC title