Particle production apparatus, particle production method and method for producing semiconductor encapsulating resin composition

Patent metadata

Field	Value
Publication number	US-9828252-B2
Application number	US-201113581923-A
Country	US
Kind code	B2
Filing date	Feb 23, 2011
Priority date	Mar 25, 2010
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A particle production apparatus 1 includes a processing section 3 in which a processing liquid is allowed to adhere to a surface of each of inorganic particles contained in a powder material, a chamber 4 connected to the processing section 3 at a downstream side thereof in which the powder material is separated from gas carrying the powder material, a powder material supply device 50 having a supply portion 5 and a supply unit 6 for supplying the powder material and the like into the processing section 3 , and a processing liquid spraying device 70 having a nozzle 7 , a pump 8 , a supply unit 9 for supplying the processing liquid, a high-pressure gas (air) generating unit 11 and the like. The processing liquid spraying device 70 is configured to spray the processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section 3 . Preferably, a volume of the processing section 3 is smaller than a volume of the chamber 4.

First claim

What is claimed is:

1. A particle production apparatus which is configured so that a processing liquid adheres to a surface of each of inorganic particles contained in a powder material, the particle production apparatus comprising:
a chamber including a side portion having a cylindrical shape and provided in a vertical direction, wherein in the chamber the powder material is separated from gas carrying the powder material;
a processing section including a tubular portion with two ends, an outlet port provided at one of the ends and a wall portion provided at the other end and having a through-hole, the tubular portion of the processing section directly connected to the side portion of the chamber through the outlet port of the processing section so as to protrude from the chamber in a horizontal direction, wherein in the processing section the processing liquid is allowed to adhere to the surface of each of the inorganic particles;
a processing liquid spraying device including a nozzle having a distal end, the nozzle connected to the wall portion of the processing section via the through-hole of the wall portion; and
a powder material supply device including a supply portion having an outlet port, said outlet port having an edge closest to the nozzle, the supply portion connected to the tubular portion of the processing section through the outlet port of the supply portion such that a gap is formed along a longitudinal direction of the nozzle between the distal end of the nozzle and the edge of the outlet port of the supply portion closest to the nozzle,
wherein the powder material supply device supplies the powder material into the processing section in the vertical directly by its own weight and the processing liquid spraying device sprays the processing liquid as droplets in the horizontal direction from the distal end of the nozzle onto the powder material just after the powder material is supplied into the processing section, and
wherein after the processing liquid sprayed to the powder material adheres to the surface of each of the inorganic particles contained in the powder material in the processing section, the powder material is transferred into the chamber so that the powder material is separated from the gas.

2. The particle production apparatus as claimed in claim 1 , wherein the processing liquid spraying device further comprises:
a gas supply device for supplying the gas having a pressure being equal to or higher than 0.3 MPa to the nozzle; and
a processing liquid supply device for supplying the processing liquid into the nozzle, and
wherein the processing liquid is sprayed from the distal end of the nozzle into the processing section due to the pressure of the gas.

3. The particle production apparatus as claimed in claim 2 , wherein the processing liquid supply device is a pump.

4. The particle production apparatus as claimed in claim 1 , wherein the droplets of the processing liquid sprayed from the processing liquid spraying device include small-sized droplets having a particle size being equal to or less than 20 μm, and the processing liquid spraying device is configured so that a ratio of the small-sized droplets to the total of the sprayed droplets becomes equal to or more than 80 wt %.

5. The particle production apparatus as claimed in claim 1 , wherein the particle production apparatus is configured so that a swirl stream of the gas is generated in the chamber by spraying the processing liquid using the processing liquid spraying device.

6. The particle production apparatus as claimed in claim 1 , wherein the processing section has a central axis,
wherein the processing section is connected to the side portion of the chamber such that the central axis of the processing section is inclined with respect to a direction of a radius of the chamber which passes through the outlet port of the processing section, and
wherein the particle production apparatus is configured so that a swirl stream of the gas is generated in the chamber by spraying the processing liquid using the processing liquid spraying device.

7. The particle production apparatus as claimed in claim 1 , wherein the inorganic particles are constituted of silica and the processing liquid is a coupling agent.

8. The particle production apparatus as claimed in claim 1 , a volume of the processing section is smaller than a volume of the chamber.

9. The particle production apparatus as claimed in claim 1 , wherein a radius of the chamber is in the range of 200 to 300 mm.

10. The particle production apparatus as claimed in claim 1 , wherein a radius of the processing section is in the range of 20 to 100 mm and a length thereof is in the range of 50 to 250 mm.

11. The particle production apparatus as claimed in claim 10 , wherein a distance of the gap is in the range of 5 to 20 mm.

Assignees

• Sumiyoshi Takafumi
• Shibata Hiroshi
• Sumitomo Bakelite Co

Inventors

• Sumiyoshi Takafumi
• Shibata Hiroshi

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/016

  using moulds · CPC title

• C01P2004/61

  Micrometer sized, i.e. from 1-100 micrometer · CPC title

• B01J2/006 Primary

  Coating of the granules without description of the process or the device by which the granules are obtained (to prevent the granules sticking together B01J2/30) · CPC title

• C08K9/06

  with silicon-containing compounds · CPC title