Stretchable electronic structures formed of thin films integrated with soft heterogeneous substrate

Patent metadata

Field	Value
Publication number	US-9826625-B2
Application number	US-201314406346-A
Country	US
Kind code	B2
Filing date	Jun 10, 2013
Priority date	Jun 11, 2012
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

Stretchable electronic structure comprising one intrinsically fragile thin film integrated on or within a soft heterogeneous substrate. The invention also relates to a process for manufacturing such a structure.

First claim

The invention claimed is:

1. A stretchable electronic structure comprising:
an intrinsically fragile thin film; and
a soft heterogeneous substrate, the intrinsically fragile thin film in contact with the soft heterogeneous substrate,
wherein the soft heterogeneous substrate includes a soft domain of a first constituent or phase surrounded by a continuous stiff domain of second constituent or phase, the soft domain is distributed and embedded into the stiff domain.

2. The structure according to claim 1 wherein the thin film is made of a sub-100 nm thick layer deposited by thermal evaporation on the heterogeneous substrate.

3. The structure according to claim 1 wherein the thin film is made of metal such as gold.

4. The structure according to claim 1 wherein the continuous stiff domain of the substrate includes an elastic matrix and the soft domain of the substrate is distributed within the elastic matrix.

5. The structure according to claim 4 wherein the elastic matrix includes a flexible polyurethane foam (FPF).

6. The structure according to claim 1 wherein the continuous stiff domain forms an elastic matrix, and the soft domain forms a porous material with cavities,
wherein the soft domain includes zones that are distributed within and surrounded by the elastic matrix.

7. The structure according to claim 1 wherein the thin film includes a sub-100 nm thick gold thin film.

8. The structure according to claim 1 wherein the soft heterogeneous substrate includes a sub-mm thick flexible polyurethane foam.

9. The structure according to claim 1 wherein the intrinsically fragile thin film is bonded to the soft heterogeneous substrate to form direct connections to both the soft domain and the continuous stiff domain.

10. The structure according to claim 1 wherein the soft domain forms bodies that are distributed throughout a volume that forms the continuous stiff domain.

11. A process for manufacturing a structure as defined in claim 1 comprising the steps of:
preparing a soft multi-domain material, defined by highly contrasted stiffness including the soft domain distributed and embedded in the continuous stiff domain to form the soft heterogeneous substrate; and
bonding the intrinsically fragile thin film to the soft heterogeneous substrate.

12. The process according to claim 11 wherein the soft multi-domain material is flexible polyurethane foam (FPF).

13. A pressure sensor including a stretchable electronic structure, the structure comprising:
two intrinsically fragile thin films; and
a soft heterogeneous substrate, the soft heterogeneous substrate sandwiched between the two fragile thin films and in contact with the two intrinsically fragile thin films,
wherein the substrate includes a soft domain of a first constituent or phase surrounded by a continuous stiff domain of second constituent or phase, and
wherein the soft domain is distributed and embedded into the stiff domain.

14. The pressure sensor according to claim 13 wherein, the substrate includes flexible polyurethane foam (FPF).

15. The pressure sensor according to claim 13 wherein the intrinsically fragile thin film is bonded to the soft heterogeneous substrate to form direct connections to both the soft domain and the continuous stiff domain.

16. The pressure sensor according to claim 13 wherein the soft domain forms bodies that are distributed throughout a volume that forms the continuous stiff domain.

Assignees

• Ecole Polytechnique Fed De Lausanne (Epfl)

Inventors

• Vandeparre Hugues
• Lacour Stephanie

Classifications

• H03K2017/9602

  characterised by the type or shape of the sensing electrodes · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K2201/0116

  Porous, e.g. foam · CPC title

• G01L1/142 Primary

  using capacitors · CPC title