MEMS microphone modules and wafer-level techniques for fabricating the same

Patent metadata

Field	Value
Publication number	US-9826316-B2
Application number	US-201414894059-A
Country	US
Kind code	B2
Filing date	May 26, 2014
Priority date	May 31, 2013
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102 , an IC chip 22 and a MEM microphone device 24 , where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64 A, 64 , the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22 , mounting a MEMS microphone device 24 to the second substrate 60 , the second substrate not extending over the LED 102 , surrounding the MEMS microphone device by second spacers 32 A, 32 , attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64 . Conductive traces may extend through the spacers. Also defined are MEMS modules without LED's, without stacking, on a single substrate, or on either side of a single substrate.

First claim

What is claimed is:

1. A wafer-level method of fabricating multiple MEMS microphone modules, the method comprising:
providing a substrate wafer on which are mounted pairs of devices, each pair including a MEMS microphone device and an integrated circuit device to perform processing of signals from the MEMS microphone device;
providing a cover wafer over the substrate wafer to form a wafer stack, wherein the cover wafer and substrate wafer are separated by a spacer formed by a replication technique, wherein the spacer serves as a wall surrounding respective pairs of devices; and
dividing the wafers into individual MEMS microphone modules each of which includes at least one of the MEMS microphone devices and an associated one of the integrated circuit devices, and wherein each MEMS microphone module has an opening through which sound can enter the MEMS microphone module.

2. A wafer-level method of fabricating multiple MEMS microphone modules, the method comprising:
providing a substrate wafer on which are mounted pairs of devices, each pair including a MEMS microphone device and an integrated circuit device to perform processing of signals from the MEMS microphone device;
providing a cover wafer over the substrate wafer to form a wafer stack, wherein the cover wafer and substrate wafer are separated by a spacer formed by a vacuum injection technique, wherein the spacer serves as a wall surrounding respective pairs of devices; and
dividing the wafers into individual MEMS microphone modules each of which includes at least one of the MEMS microphone devices and an associated one of the integrated circuit devices, and wherein each MEMS microphone module has an opening through which sound can enter the MEMS microphone module.

3. The wafer-level method of claim 1 including replicating the spacer directly on the substrate wafer.

4. The wafer-level method of claim 1 including replicating the spacer directly on the cover wafer.

5. The wafer-level method of claim 1 wherein the spacer is composed of a polymer material.

6. The wafer-level method of claim 1 including forming the opening in the cover wafer by micromachining.

7. The wafer-level method of claim 1 wherein dividing the wafers into individual MEMS microphone modules includes dicing through the spacers.

8. A MEMS microphone module comprising:
a first substrate;
a second substrate on which is mounted a MEMS microphone device, wherein the second substrate is separated from the first substrate by a first spacer;
an integrated circuit device mounted on the first substrate and arranged to perform processing of signals from the MEMS microphone device, wherein the first spacer laterally surrounds the integrated circuit device; and
a cover separated from the second substrate by a second spacer, wherein the second spacer laterally surrounds the MEMS microphone device,
the first substrate, the first spacer, the second substrate, the second spacer and the cover being stacked one above the other in that order such that the second substrate separates a first region in which the integrated circuit device is disposed from a second region in which the MEMS microphone device is disposed,
the module having an opening in the cover or in the second spacer through which sound can enter.

9. The MEMS microphone module of claim 8 wherein the opening is in the second spacer.

10. The MEMS microphone module of claim 8 including acoustics-enhancing features on at least one of an inner surface of the second spacer or an inner surface of the cover.

11. The MEMS microphone module of claim 10 wherein the acoustics-enhancing features are composed of a polymer material, a foam material or a porous material.

12. The MEMS microphone module of claim 8 including one or more projections extending from an exterior surface of the cover.

13. The MEMS microphone module of claim 12 wherein the opening is in the cover and the one or more projections are located adjacent the opening.

Assignees

• Heptagon Micro Optics Pte Ltd

Inventors

• Geiger Jens
• Rossi Markus
• Rudmann Hartmut

Classifications

• H04R3/00

  Circuits for transducers (arrangements for producing a reverberation or echo sound G10K15/08; amplifiers H03F) · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title

• B81B2207/096

  through the substrate · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title